MicroApps Presentations: Atlanta

Thank You to Our Sponsors!

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TBD
AR RF/Microwave Instrumentation
Exhibit Hall
Abstract

The bandwidth and peak to average (PAR) ratios of the 5G modulation requires accurate characterization for DPD application. One aspect of a DPD characterization system is often overlooked. A near distortion-free 3GPP test model should be presented to the final device under test. PAR of these test models may be as high as 15dB. With the absolute gain as low as 10 dB, a high-power linear RF drive is required. This would seem to make Class A amplifiers the recommended solution. This presentation will discuss if the typical Class A specification of P1dB is a sufficient parameter for selection criteria.

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Subbaiah Pemmaiah
Copper Mountain Technologies
Exhibit Hall
Abstract

Copper Mountain Technologies (CMT) will present a method to de-embed a fixture using a 1-port reflect model. Traditional fixture removal techniques requires an identical 2x thru line to de-embed the fixture. In this method, CMT will present this alternative 1-port method to overcome the limitations of the fixtures when measuring SMD type components.

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TBD
EM Labs Inc
Exhibit Hall
Abstract

This seminar explores up to date mmwave material test solutions, including the split cylinder resonator and the free space test system, with a strong emphasis on practical information. The audience will see that, with the right instruments, it is surprisingly easy to get highly repeatable material test results at the important 5G and automotive radar frequencies. The seminar includes a lot of real test results to show what actually can be measured today. In addition, free space measurements for 6G (up to 330 GHz) will also be covered briefly.

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Darby Davis, Craig Blanchette
Gel-Pak, BAE Systems
Exhibit Hall
Abstract

IC devices used in microwave modules and other microelectronic assemblies have become increasingly thin and susceptible to costly “out of pocket” chip tray conditions (die migration) which occur during packaging, shipping, and customer handling . This defect condition is especially problematic for automated assembly which strives to be touch-free and efficient with orderly device presentation. This talk will discuss the root cause and the cost associated with these out-of-of-pocket issues and introduces a newly engineered solution.

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Joseph Hertline
Indium Corporation
Exhibit Hall
Abstract

Due to increasing electrification, especially in automotive power modules and RF communication, it is clear that uniform bondline control between the substrate and baseplate has a direct link to mechanical reliability. An uneven bondline can result in early cracking and solder layer delamination due to stress concentration at the thinner joint areas. We will examine how InFORMS®, a reinforced matrix solder composite preform (patent-pending ribbon), deliver uniform bondline control and enhancing reliability by a factor of 2X, and achieving the lowest cost of ownership.

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TBD
Knowles Capacitors
Exhibit Hall
Abstract

DLI has merged SIW technology with a high precision, repeatable, thin film process using high permittivity material. This helps to create small, temperature stable, high performance filters in a surface mount package. A general overview of size and performance benefits vs common PCB materials will be examined. Another point of discussion will be on the flexibility in configuration and implementation in a customer's application. Finally, a demonstration of modeled to measured performance at mmWave (28GHz) will be shown.

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Gregory Alton
Knowles
Exhibit Hall
Abstract

Feed networks are a critical design element of many phased array and MIMO systems. They bridge the RF front end with the radiating elements, yet face their own unique challenges in size and performance. This talk will offer a new perspective on creating a feed network with Thin Film technology. Thin Film devices can enable system designers with compact, lightweight, low cost power dividers with integrated resistive elements. These features provide a designer with flexibility and repeatability beyond what is possible with traditional PCB construction methods.

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TBD
Rogers Corp.
Exhibit Hall
Abstract

With many new PCB applications having more functionality, there is inherently more issues with thermal management. Additionally, many new applications are at higher frequency and/or higher digital speeds than before and that too can cause more concern for thermal management.
This presentation will give an overview of the different thermal management concerns for PCB’s. After the concepts are explained, several examples will be given which will be useful for understanding the many tradeoffs involved with thermal management. Thermal imaging pictures of circuits operating at elevated temperatures will be used to illustrate many of the thermal management concepts.

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Werner Dürport
Rohde Schwarz
Exhibit Hall
Abstract

The IEEE 802.11ad WLAN standard introduced a few years ago for high data rate transmissions in the 60 GHz band can no longer provide the required data rates and range for a variety of current applications. That is why the IEEE 802.11ay has been specified with a maximum of 8.64 GHz total bandwidth by combining up to four channels (channel bonding CB). The available frequency range has been extended to 71 GHz.

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Wolfgang Wendler
Rohde Schwarz
Exhibit Hall
Abstract

Signal processing in advanced radar systems detects and suppresses unwanted reflections from surrounding objects such as trees, buildings and ocean waves , by comparing the phases and amplitudes of successive echoes. Only moving targets are displayed. The greater the phase and amplitude stability of the transmitted
pulses, the better the results from signal processing and targets with a very small radar cross section, such as micro aerial vehicles can be detected. Power amplifiers, in particular, can degrade stability. Precise measurements are necessary to determine overall system performance.

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Exhibit Hall
Abstract

Optical fibers provide a low loss medium for implementing delay lines for broad bandwidth signals. These delay lines can be used to implement a variety of signal processing approaches. This presentation reviews the implementation and applications of RF on fiber based delay lines.

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Thomas Costello
Astronics Test Systems
Exhibit Hall
Abstract

Practical high-speed RF data conversion with multi-GS/s ADCs and DACs has afforded attractive new options for RF transceiver architectures, promising reduced hardware complexity and increased frequency agility in analog front-ends for SDRs, multi-standard base stations and even mobile devices, as well as RF test equipment and instrumentation. This MicroApp discusses system-level advantages, limitations and trade-offs of direct RF conversion architectures with current generation conversion components.

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TBD
SAGE Millimeter, Inc.
Exhibit Hall
Abstract

Waveguide connections are realized using fastening/clamping hardware. The quality/consistency of connections has a large impact on measurement accuracy, especially when the required frequency reaches the Millimeter-wave (mmW) and THz arena. Frequently attaching/detaching the waveguides degrades its quality/ performance and slows testing, which can be detrimental when speed is a priority. Eravant has developed a contactless waveguide flange which allows reliable/ repeatable waveguide flange connections without physical contact or fastening/clamping hardware. When the contactless flange is implemented in a mmW or THz test setup, with VNA extenders, connections are made easily. This improves connection accuracy and helps reduce testing time.

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TBD
Linearizer Technology Inc.
Exhibit Hall
Abstract

High throughput satellite (HTS) communication systems are needed for the demand of increased data rate capacity. Communications architectures are moving to higher frequencies to accommodate greater bandwidths necessary for these throughputs. To accommodate these greater bandwidths, new satellite systems have been designed to operate in the V-Band spectrum. Ground station uplink amplifiers (47-52 GHz) are needed to provide linear high power to allow efficient transmission of these signals. This paper will discuss the progress in V-band predistortion linearizers for these new high power amplifiers (HPAs). Linearizers for both traveling wave tubes (TWTs) and solid-state power amplifiers (SSPAs) will be presented.

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Ralf Ihmels
Mician, Inc.
Exhibit Hall
Abstract

Adaptive Frequency Sampling (AFS) based on rational function interpolation (Stoer-Bulirsch) is a well-known, robust technique for accelerating wideband simulations. By composing circuits from cascaded subcircuits, µWave Wizard offers further improvements. During optimization or parameter sweeps, choosing simulation frequency points based on both interpolation error and CPU-time estimates significantly improves simulation speed, especially if some subcircuits remain unmodified. The subcircuit scheme enables splitting the rational function interpolation of the entire device into multiple low-order rational functions, requiring lesser simulated frequency samples for convergence. This approach allows simulation of high order filters up to 3 times faster than the standard AFS approach.

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Chris DeMartino, Hugo Morales
Modelithics
Exhibit Hall
Abstract

Bias tees are used extensively to apply DC bias to an RF circuit. In this presentation, we will discuss how bias tees can be designed using models that are accurate up to mmWave frequencies. These models enable real performance to be accurately predicted via simulations, thereby enabling first-pass design success. Bias-tee design details and simulated results will be presented. Measured data will then be compared to the simulated performance, with a goal of achieving good performance up to and possibly beyond 40 GHz.

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TBD
Pentek
Exhibit Hall
Abstract

The paradigm shift from discrete components connected via parallel LVDS, or high speed differential pairs on various mezzanine cards to an FPGA has shifted to a more integrated design. The latest generation of devices includes analog I/O, multi-core ARM processors with high speed PHY protocol components hardened in the traditional FPGA fabric.
This design requires complex, multi-layer PCB modules with phase coherent synchronization, multiple integrated power supplies and advanced signal integrity techniques to provide full use of this SoC (System-on-Chip) technology.
This presentation will illustrate key design criteria to properly implement this system-on-chip technology on the latest COTS (Commercial-off-the-Shelf) modules.

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Joe Simanis, Hiroshi Hosaka
New Japan Radio
Exhibit Hall
Abstract

NJR will introduce our WaveEyes® intelligent microwave sensors. The advantage of NJR's WaveEyes sensors is the Microwave RF circuitry and Signal Processing are already designed for the customer. The NJR4266 Motion Detection sensor will be presented. Using the Doppler effect, it can detect a pedestrian moving towards or away from the sensor within a maximum distance range of 7 to 14 meters, depending on the antenna configuration. While applications are many, this presentation will discuss the specifics of a touchless switch, made possible due to the advantage afforded by an optimized signal processing algorithm.

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TBD
Rogers Corp.
Exhibit Hall
Abstract

This presentation will start with an overview of different methods to construct stripline circuitry using Printed Circuit Board (PCB) technology. Certain stripline constructions can be more influenced than other constructions by the effects of copper surface roughness. Additionally, the choice of prepreg can play a significant role in RF performance or High Speed Digital (HSD) performance. Several different prepregs and copper types will be discussed, and data shown to illustrate potential differences using single ended and differential pair stripline circuitry, for RF and HSD performance, when tested up to 80+ GHz and 56 Gbps.

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Sascha Laumann
Rohde Schwarz
Exhibit Hall
Abstract

Emerging business approaches start to redefine the development and production procedures across markets. For example, mobile network base station manufacturing has become a complex endeavor in which time-to-market and production speed have become important measures of success.
In this presentation, a novel approach to tackling these new challenges will be introduced.

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Martin Schmähling
Rohde Schwarz
Exhibit Hall
Abstract

Automotive FMCW radars operate typically between 76 and 77 GHz. The frequency range between 77 and 81 GHz has become available in some countries for automotive radar applications. The distance resolution of a FMCW radar is proportional to its signal bandwidth. Therefore automotive radar manufacturers are already developing FMCW radars with wider bandwidths up to 4 GHz to get the most out of the available frequency range.
In addition to signal frequency and bandwidth, the signal linearity and chirp duration determine the radar performance.

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Kay-Uwe Sander
Rohde Schwarz
Exhibit Hall
Abstract

Modern communication and radar systems occupy very wide bandwidth, either by using very a short pulses, wideband modulation or other techniques. Besides the measurement of the modulation characteristics, the verification of emissions according to EN or FCC standards is mandatory. Many of these UWB transmitters operate between 3 and 81 GHz, and regulations require 50 MHz resolution bandwidth for measuring peak transmission power.

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John Yania
Employees
Exhibit Hall
Abstract

5G and the latest generations of Wi-Fi are generating excitement across the RF and microwave industry. The possibilities presented when discussing future visions for wireless networking and connectivity are raising expectations for wireless and radio applications. The user experience and ubiquitous connectivity potential of 5G and Wi-Fi 6+, as well as the new use cases, is leading to demand for satellite services to provide higher bandwidth and lower latency for a global wireless networking experience. Similarly, aircraft and other transportations services are now feeling increasing pressure to provide a more enhanced wireless experience for passengers, users, and for internal systems.

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rafi hershtig
K&L Microwave
Exhibit Hall
Abstract

the paper introduces new filtering solutions for IMD/Harmonic/jammer test. These solutions are implemented in both tunable and fixed filters, from simple set-ups to complicated test boxes. The versatility presented allows a "plug and play" type, for ever increasing number of LTE bands and combinations.

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rafi hershtig
K&L Microwave
Exhibit Hall
Abstract

A method for the design and construction of thin-film lumped-element microwave filters is presented. The resulting filters exhibit; Temperature Stability, Broadband Spurious-Free, Size Reduction, High Reliability and Repeatability due to their thin film process on Aluminum Titenate (Al2TiO5) construction. The necessary models for inductors and capacitors are discussed. Data from Wide-Band Multiplexers and Generating Transmission zeros from All-Pole structures are presented. With embedded Thin Film Resistor Technology, Non-Reflective Filters with flat Group Delay are designed and manufactured. These filters are used to reduce the overshoot and transition time of instruments and improve the pulsed performance.

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TBD
Eravant
Exhibit Hall
Abstract

Lack of readily available high frequency coaxial connectorized components has denied the industry the flexibility of products above 67 GHz. Eravant’s 1mm connectorized product line offers a wide range of components that are versatile and wideband. Instrumentation and development sectors of the industry are two examples where the 1 mm can flex its capabilities. Amplifier devices, such as Analog’s ADPA7004 and HMC1144, can be used in their full operational frequency range of 35 -80 GHz or HMC-AUH312-Die 500 MHz to 80 GHz when packaged into the 1 mm connectorized amplifier housing. MMIC manufacturers can evaluate devices with one, easy-to-use package.

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TBD
Empower RF Systems, Inc.
Exhibit Hall
Abstract

High power amplifiers do a poor job duplicating the input signal without distortions. Due to the transient response of the amplifier the output will over shoot, ring and droop, introducing undesired low and high frequency components into other parts of the spectrum. Pulse shaping, as it is done today, is an effort to fix fidelity issues caused by the transmitting amplifier and is accomplished by a combination of imperfect methods, most external to the amplifier. In this technical presentation Paulo Correa explains a new approach that matches input pulse signal shape, minimizes droop, overshoot, ringing, rise and fall times.

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Jenny Gallery
Indium Corporation
Exhibit Floor
Abstract

The 5G connectivity network is sure to not only transform technology as we know it, but also provide an entirely new mobile experience for every user. The high-speed and bandwidth needed within the 5G connectivity network result in two common issues facing companies that are producing this mobile technology: controlling thermal management of and maintaining strong solder joints in the hardware. We will discuss the challenges and present solutions that can improve the thermal transfer of high-output lasers, as well as solving the weak joint issue on the gold-rich substrate of gallium nitride (GaN) dies.

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Exhibit Floor
Abstract

Joe Svoboda, Vice President Sales, Marketing & Customer Success, Criteria Labs And Jared Burdick, Microwave R&D Engineer, Knowles Precision Devices will present an innovative design approach for a unified, dielectic four channel switch filter bank. This innovative approach boasts a 2-18GHz range of operation, is optimized for every element of digital beamforming applications and performs extremely well in SWAP sensitive environments.