MicroApps Presentations

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Brian Rautio
Sonnet Software, Inc.
Auditorium 6
Abstract

Design flows are always getting bigger and better and stronger; at Sonnet, we want our tools to be flexible and scalable to support them. With Sonnet Technology File format (.STF), we can include all kinds of data--including but not limited to stackup configurations--so you can get straight to designing. In this talk, we take a look at the format and discuss how to apply it to all kinds of workflows to save time setting up simulations.

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David Vye
Cadence
Auditorium 6
Abstract

With Cadence’s best-in-class RF design, manufacturing and EM/Thermal system sign-off solutions, users can address cross-fabric, multi-technology packaging and integration challenges across technologies and design discipline. Cadence AWR v16 has implemented capabilities that will greatly improve platform interoperability beyond current intermediate file sharing formats and data base translators. This talk will demonstrate how the new workflow supports intelligent design transfer from AWR Design Environment® RF/microwave into Virtuoso® RFIC and Allegro® PCB Designer software platforms to address cross-fabric, multi-technology packaging and integration challenges across technologies and design disciplines.

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Irfan Ashiq, Jeff Earls
NI
Auditorium 6
Abstract

A mmWave receiver design for a Vehicular Radar Test System is simulated in AWR Visual System Simulator. The construction of the system model in VSS is discussed and the simulated results compared with prototype system measurements.

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TBD
Rogers Corp.
Auditorium 6
Abstract

This presentation will start with an overview of different methods to construct stripline circuitry using Printed Circuit Board (PCB) technology. Certain stripline constructions can be more influenced than other constructions by the effects of copper surface roughness. Additionally, the choice of prepreg can play a significant role in RF performance or High Speed Digital (HSD) performance. Several different prepregs and copper types will be discussed, and data shown to illustrate potential differences using single ended and differential pair stripline circuitry, for RF and HSD performance, when tested up to 80+ GHz and 56 Gbps.

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John Dunn
Cadence
Auditorium 6
Abstract

This MicroApp presentation demonstrates how to use electromagnetic (EM) simulation to correctly calculate the quality (Q) factor for on-chip spiral inductors in both silicon and III-V technologies. EM simulators have a notoriously difficult time calculating the correct Q. The various reasons are explained, along with tips on how to overcome them. The Cadence® Clarity™ 3D finite element method (FEM) simulator, as well as the AWR® AXIEM® and Cadence EMX® 3D planar method-of-moments (MoM) simulators will be used to demonstrate the concepts.

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Jonathan Leitner
Menlo Micro
Auditorium 6
Abstract

Advanced multi-array antennas utilizing beam steering techniques require phase shifters to deliver the expected quality of service and high data rates for cellular, enterprise, military, and SATCOM. A beam steering antenna for C-Band has been developed by Menlo Micro utilizing SP4T RF MEMS switches that are configured with delay lines into a patent-pending differential delay shifter. This design can be utilized in beam forming and phase array antennas to control both the vertical and horizontal beam pattern while maintaining high power handling and linearity requirements.

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Gregory Alton
Knowles
Auditorium 6
Abstract

Feed networks are a critical design element of many phased array and MIMO systems. They bridge the RF front end with the radiating elements, yet face their own unique challenges in size and performance. This talk will offer a new perspective on creating a feed network with Thin Film technology. Thin Film devices can enable system designers with compact, lightweight, low cost power dividers with integrated resistive elements. These features provide a designer with flexibility and repeatability beyond what is possible with traditional PCB construction methods.

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Daniel Schulze
MST/Dyconex AG
Auditorium 6
Abstract

Advanced rigid epoxy-based laminates with low loss dielectric properties are proven to be reliable, lower cost alternatives to ceramic materials for applications up to 60 GHz. Low CTE minimizes stress induced to attached die over thermal cycles, resulting in high yielding assembly and high reliability chip packaging for harsh environments. Build-up construction with laser drilled, copper filled microvias, along with significantly thinner core/pre preg layers, enable high density designs up to ~50% thinner compared to standard technologies. These organic substrates can be produced with high planarity for IC placement, impedance control and compliant with EN9100 for space applications.

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Darby Davis, Craig Blanchette
Gel-Pak, BAE Systems
Auditorium 6
Abstract

IC devices used in microwave modules and other microelectronic assemblies have become increasingly thin and susceptible to costly “out of pocket” chip tray conditions (die migration) which occur during packaging, shipping, and customer handling . This defect condition is especially problematic for automated assembly which strives to be touch-free and efficient with orderly device presentation. This talk will discuss the root cause and the cost associated with these out-of-of-pocket issues and introduces a newly engineered solution.

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TBD
EM Labs Inc
Auditorium 6
Abstract

This seminar explores up to date mmwave material test solutions, including the split cylinder resonator and the free space test system, with a strong emphasis on practical information. The audience will see that, with the right instruments, it is surprisingly easy to get highly repeatable material test results at the important 5G and automotive radar frequencies. The seminar includes a lot of real test results to show what actually can be measured today. In addition, free space measurements for 6G (up to 330 GHz) will also be covered briefly.

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TBD
Rogers Corp.
Auditorium 6
Abstract

With many new PCB applications having more functionality, there is inherently more issues with thermal management. Additionally, many new applications are at higher frequency and/or higher digital speeds than before and that too can cause more concern for thermal management.
This presentation will give an overview of the different thermal management concerns for PCB’s. After the concepts are explained, several examples will be given which will be useful for understanding the many tradeoffs involved with thermal management. Thermal imaging pictures of circuits operating at elevated temperatures will be used to illustrate many of the thermal management concepts.

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Chris DeMartino, Hugo Morales
Modelithics
Auditorium 6
Abstract

Bias tees are used extensively to apply DC bias to an RF circuit. In this presentation, we will discuss how bias tees can be designed using models that are accurate up to mmWave frequencies. These models enable real performance to be accurately predicted via simulations, thereby enabling first-pass design success. Bias-tee design details and simulated results will be presented. Measured data will then be compared to the simulated performance, with a goal of achieving good performance up to and possibly beyond 40 GHz.

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TBD
Linearizer Technology Inc.
Auditorium 6
Abstract

High throughput satellite (HTS) communication systems are needed for the demand of increased data rate capacity. Communications architectures are moving to higher frequencies to accommodate greater bandwidths necessary for these throughputs. To accommodate these greater bandwidths, new satellite systems have been designed to operate in the V-Band spectrum. Ground station uplink amplifiers (47-52 GHz) are needed to provide linear high power to allow efficient transmission of these signals. This paper will discuss the progress in V-band predistortion linearizers for these new high power amplifiers (HPAs). Linearizers for both traveling wave tubes (TWTs) and solid-state power amplifiers (SSPAs) will be presented.

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TBD
Empower RF Systems, Inc.
Auditorium 6
Abstract

High power amplifiers do a poor job duplicating the input signal without distortions. Due to the transient response of the amplifier the output will over shoot, ring and droop, introducing undesired low and high frequency components into other parts of the spectrum. Pulse shaping, as it is done today, is an effort to fix fidelity issues caused by the transmitting amplifier and is accomplished by a combination of imperfect methods, most external to the amplifier. In this technical presentation Paulo Correa explains a new approach that matches input pulse signal shape, minimizes droop, overshoot, ringing, rise and fall times.

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Martin Schmähling
Rohde Schwarz
Auditorium 6
Abstract

Automotive FMCW radars operate typically between 76 and 77 GHz. The frequency range between 77 and 81 GHz has become available in some countries for automotive radar applications. The distance resolution of a FMCW radar is proportional to its signal bandwidth. Therefore automotive radar manufacturers are already developing FMCW radars with wider bandwidths up to 4 GHz to get the most out of the available frequency range.
In addition to signal frequency and bandwidth, the signal linearity and chirp duration determine the radar performance.

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Stanley Oda
Anritsu Co.
Auditorium 6
Abstract

Interfacing between the device under test (DUT) and measurement ports on a Vector Network Analyzer (VNA) has always been a key factor in determining the quality of s-parameter measurements. This seminar will review some application examples where VNA architectures that physically distribute the measurement port hardware provide advantages in s-parameter applications.

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Werner Dürport
Rohde Schwarz
Auditorium 6
Abstract

The IEEE 802.11ad WLAN standard introduced a few years ago for high data rate transmissions in the 60 GHz band can no longer provide the required data rates and range for a variety of current applications. That is why the IEEE 802.11ay has been specified with a maximum of 8.64 GHz total bandwidth by combining up to four channels (channel bonding CB). The available frequency range has been extended to 71 GHz.

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TBD
Linearizer Technology Inc.
Auditorium 6
Abstract

Optical fibers provide a low loss medium for implementing delay lines for broad bandwidth signals. These delay lines can be used to implement a variety of signal processing approaches. This presentation reviews the implementation and applications of RF on fiber based delay lines.

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TBD
Eravant
Auditorium 6
Abstract

Waveguide connections are realized using fastening/clamping hardware. The quality/consistency of connections has a large impact on measurement accuracy, especially when the required frequency reaches the Millimeter-wave (mmW) and THz arena. Frequently attaching/detaching the waveguides degrades its quality/ performance and slows testing, which can be detrimental when speed is a priority. Eravant has developed a contactless waveguide flange which allows reliable/ repeatable waveguide flange connections without physical contact or fastening/clamping hardware. When the contactless flange is implemented in a mmW or THz test setup, with VNA extenders, connections are made easily. This improves connection accuracy and helps reduce testing time.

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Gavin Fisher
FormFactor
Auditorium 6
Abstract

Increased operation frequency of modern devices is pushing to higher extremes, which results in higher wafer testing frequencies also. Engineers are being pushed beyond the limits of single sweep broadband coaxial measurements using a single set of probes, into one or more waveguide bands to cover the operating range of the device. Customers often ask us how well measurements correlate between the bands.
In this talk we will show measurements of the same device type with the same pitch from 200 MHz to 500 GHz, and optimization methods for the measurements and related calibration to achieve one continuous clean result.

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Alejandro Buritica
National Instruments
Auditorium 6
Abstract

Engineers working on Over-the-air (OTA) characterization and validation of 5G mmWave beamsteering antenna modules and system-level designs require a fast and accurate 3D sweeping mechanism to determine the beamforming performance of their devices. This includes both narrowband CW and wideband measurements with 5G NR signals.
This presentation introduces several real and practical challenges of OTA test, as well as an innovative solution for reducing measurement time, and decreasing complexity by converting a direct far field test configuration into a carefully controlled indirect far field anechoic environment for validating beamforming devices with larger antenna apertures.

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Subbaiah Pemmaiah
Copper Mountain Technologies
Auditorium 6
Abstract

Copper Mountain Technologies (CMT) will present a method to de-embed a fixture using a 1-port reflect model. Traditional fixture removal techniques requires an identical 2x thru line to de-embed the fixture. In this method, CMT will present this alternative 1-port method to overcome the limitations of the fixtures when measuring SMD type components.

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Li Tao
W. L. Gore & Associates, Inc.
Auditorium 6
Abstract

The 5G test industry requires improved reliability of cable assemblies to help improve test outcomes. A significant portion of a test system’s stability and repeatability is determined by the precise performance of microwave/RF cable assemblies. They are an integral part of 5G test systems and play a key role in ensuring test reliability and measurement accuracy. Engineers should understand how cable assemblies affect the test system to maximize and optimize overall performance.

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Ralf Ihmels
Mician, Inc.
Auditorium 6
Abstract

Adaptive Frequency Sampling (AFS) based on rational function interpolation (Stoer-Bulirsch) is a well-known, robust technique for accelerating wideband simulations. By composing circuits from cascaded subcircuits, µWave Wizard offers further improvements. During optimization or parameter sweeps, choosing simulation frequency points based on both interpolation error and CPU-time estimates significantly improves simulation speed, especially if some subcircuits remain unmodified. The subcircuit scheme enables splitting the rational function interpolation of the entire device into multiple low-order rational functions, requiring lesser simulated frequency samples for convergence. This approach allows simulation of high order filters up to 3 times faster than the standard AFS approach.

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Alejandro Buritica
National Instruments
Auditorium 6
Abstract

Engineers working on wideband RF front ends must validate their new devices over more frequency bands, carrier-aggregated scenarios, and increasingly complex modulation schemes. With markets demanding greater efficiency and linearity, engineers need to validate design performance with the latest digital predistortion (DPD) algorithms and tightly synchronized envelope tracking (ET) configurations in 50- and non-50 Ω environments. After attending this session, the audience will learn how the NI RFFE Validation reference architecture helps engineers simplify and speed up the process of RF Front-end device bring-up, interactive validation, and automated characterization with extensive test sequences

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Gavin Fisher
FormFactor
Auditorium 6
Abstract

Customised Video overlay markers assist accurate probe tip placement to ensure repeatable, accurate RF calibration using our prober control software Velox. Until recently this was specific to semi-auto probers. Manual stations are susceptible to user variability when probe and stage placement is estimated. Optical alignment markers aligned to standard edges when the stage is correctly aligned, has been found to be a significant advantage. In this talk, we evaluate calibration error term repeatability, and reference standard measurement repeatability with and without on-screen markers using multiple semi-trained users to carry out repeated calibrations and subsequent measurements on a manual probestation.

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TBD
Pentek
Auditorium 6
Abstract

The paradigm shift from discrete components connected via parallel LVDS, or high speed differential pairs on various mezzanine cards to an FPGA has shifted to a more integrated design. The latest generation of devices includes analog I/O, multi-core ARM processors with high speed PHY protocol components hardened in the traditional FPGA fabric.
This design requires complex, multi-layer PCB modules with phase coherent synchronization, multiple integrated power supplies and advanced signal integrity techniques to provide full use of this SoC (System-on-Chip) technology.
This presentation will illustrate key design criteria to properly implement this system-on-chip technology on the latest COTS (Commercial-off-the-Shelf) modules.

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Joe Simanis, Hiroshi Hosaka
New Japan Radio
Auditorium 6
Abstract

NJR will introduce our WaveEyes® intelligent microwave sensors. The advantage of NJR's WaveEyes sensors is the Microwave RF circuitry and Signal Processing are already designed for the customer. The NJR4266 Motion Detection sensor will be presented. Using the Doppler effect, it can detect a pedestrian moving towards or away from the sensor within a maximum distance range of 7 to 14 meters, depending on the antenna configuration. While applications are many, this presentation will discuss the specifics of a touchless switch, made possible due to the advantage afforded by an optimized signal processing algorithm.

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Sascha Laumann
Rohde Schwarz
Auditorium 6
Abstract

Emerging business approaches start to redefine the development and production procedures across markets. For example, mobile network base station manufacturing has become a complex endeavor in which time-to-market and production speed have become important measures of success.
In this presentation, a novel approach to tackling these new challenges will be introduced.

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Steve Reyes
Anritsu Co.
Auditorium 6
Abstract

A key use of broadband VNAs is device characterization where on-wafer devices are characterized across as broad frequency coverage as possible in a single sweep. Broad frequency coverage, beyond the application frequency, provides the information needed to create accurate simulation models. As communication systems continue to migrate higher in frequencies the need for a 2 and 4 port broadband VNA well beyond 110 GHz is a valuable tool to meet design challenges and objectives.
This discussion will describe the 4-port VectorStar 70kHz to 220GHz system providing across the industry's broadest frequency range for characterizing 2 and 4 port devices .

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Paul Moakes
CommAgility (Wireless Telecom Group)
Auditorium 6
Abstract

Wireless technologies have found numerous applications across industry, transport, military and satellite communications. Increasingly these are based around protocols from the commercial world and most development effort is now focused on applying the newer 5G standard, delivering lower latency, faster speeds, and higher reliability than 4G LTE.
5G provides many of the characteristics required for private networks in specialized applications, but typically it cannot be used without algorithmic or protocol modifications. This presentation examines programmable architectures for 5G private network small cells with reference to a commercial system-on-chip (SoC) implementation and CommAgility’s 5G small cell solutions.

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Wolfgang Wendler
Rohde Schwarz
Auditorium 6
Abstract

Signal processing in advanced radar systems detects and suppresses unwanted reflections from surrounding objects such as trees, buildings and ocean waves , by comparing the phases and amplitudes of successive echoes. Only moving targets are displayed. The greater the phase and amplitude stability of the transmitted
pulses, the better the results from signal processing and targets with a very small radar cross section, such as micro aerial vehicles can be detected. Power amplifiers, in particular, can degrade stability. Precise measurements are necessary to determine overall system performance.

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Pavel Borodulin
Renesas
Auditorium 6
Abstract

Active Beamforming ICs are enabling the next generation of cost-effective electronically steered antennas for SATCOM, 5G and radar applications in the microwave and millimeter-wave spectrum. IC-level performance metrics must be clearly defined and accurately characterized in order to enable accurate prediction of system-level array performance parameters such as G/T, EIRP, power consumption, sidelobe level and beam pointing error. We will review the commonly employed IC-level performance parameters and characterization techniques and their impact on system-level array performance.

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Larry Hawkins
Richardson RFPD
Auditorium 6
Abstract

Richardson RFPD is making available multiple prototyping platforms to reduce your time to market and help augment your design team’s expertise. These include a dual 24 – 40 GHz reference design, a 1350 – 2700 MHz 2W and 5W output radio and 4400 – 5000 MHz 5 W radio. These designs include all the hardware from FPGA to antenna/antenna output as well as a comprehensive software and GUI. This presentation will go into more detail regarding the platforms

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Dale Hauck
AR RF/Microwave Instrumentation
Auditorium 6
Abstract

The bandwidth and peak to average (PAR) ratios of the 5G modulation requires accurate characterization for DPD application. One aspect of a DPD characterization system is often overlooked. A near distortion-free 3GPP test model should be presented to the final device under test. PAR of these test models may be as high as 15dB. With the absolute gain as low as 10 dB, a high-power linear RF drive is required. This would seem to make Class A amplifiers the recommended solution. This presentation will discuss if the typical Class A specification of P1dB is a sufficient parameter for selection criteria.

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Kay-Uwe Sander
Rohde Schwarz
Auditorium 6
Abstract

Modern communication and radar systems occupy very wide bandwidth, either by using very a short pulses, wideband modulation or other techniques. Besides the measurement of the modulation characteristics, the verification of emissions according to EN or FCC standards is mandatory. Many of these UWB transmitters operate between 3 and 81 GHz, and regulations require 50 MHz resolution bandwidth for measuring peak transmission power.

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Alejandro Buritica
National Instruments
Auditorium 6
Abstract

A new Wireless LAN technology, Wi-Fi 7 or 802.11be, strives to deliver extreme high throughput using higher order MIMO , tightly packed modulation schemes (4096-QAM), wider channels, and other novel techniques. New wireless standards promise many benefits to consumers, but they also introduce new design and test challenges. In this presentation, learn a basic overview of the new features of 802.11be, and examine several practical considerations that 802.11be introduces for RF design, validation, and test.

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Jenny Gallery
Indium Corporation
Auditorium 6
Abstract

The 5G connectivity network is sure to not only transform technology as we know it, but also provide an entirely new mobile experience for every user. The high-speed and bandwidth needed within the 5G connectivity network result in two common issues facing companies that are producing this mobile technology: controlling thermal management of and maintaining strong solder joints in the hardware. We will discuss the challenges and present solutions that can improve the thermal transfer of high-output lasers, as well as solving the weak joint issue on the gold-rich substrate of gallium nitride (GaN) dies.

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Auditorium 6
Abstract

Lack of readily available high frequency coaxial connectorized components has denied the industry the flexibility of products above 67 GHz. Eravant’s 1mm connectorized product line offers a wide range of components that are versatile and wideband. Instrumentation and development sectors of the industry are two examples where the 1 mm can flex its capabilities. Amplifier devices, such as Analog’s ADPA7004 and HMC1144, can be used in their full operational frequency range of 35 -80 GHz or HMC-AUH312-Die 500 MHz to 80 GHz when packaged into the 1 mm connectorized amplifier housing. MMIC manufacturers can evaluate devices with one, easy-to-use package.