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The Role of Bondwire in Integrated Matching Networks in Power Amplifier Packaging
This talk presents the advancement of wireless communication focusing on the development of high-performance front-end circuits in mature 5G and beyond mobile technologies. It delves into the packaging design of power amplifiers (PAs) to achieve miniaturization due to the rising demand for high data rate applications. The technique demonstrates the utilization of bondwires for the fully integrated matching networks in PA to achieve size reduction of the die and package. The use of gallium nitride (GaN)-based transistors and high-electron-mobility transistors for fully integrated PAs is examined.