FHE-Enabled Wireless/5G+ Ultrabroadband Interconnects, Packaging and Modules for IoT, SmartAg, Industry 4.0 and Smart Cities Applications

In this talk, flexible antennas, interconnects, “smart” encapsulation and packages, RF electronics, RFIDs, microfluidics and sensors fabricated on PET, paper and other flexible substrates are introduced as a system-level solution for ultra-low-cost mass production of mm-wave modules and metasurfaces for communication, energy harvesting, localizatiom and sensing applications. Prof. Tentzeris will also touch on the state-of-the-art area of fully-integrated FHE-Enabled broadband wireless modules for IoT, Smart Cities and Digital Twins applications covering characterization of flexible materials up to E-band, novel flexible interconnects, transmission lines and cavities for IC embedding that can survive 10000+ bending cycles.