Transmission Lines, Integration, and Packaging at mm-Wave and THz Frequencies

The integration and packaging of electronic components and systems at mm-wave and THz frequencies present unique challenges. As operating frequencies increase, conventional transmission media such as microstrip lines and coplanar waveguides (CPWs) suffer from excessive conductor and dielectric losses, limiting their suitability for high-performance systems. To mitigate these losses, waveguide-based interconnects and packaging approaches have emerged as promising alternatives. However, their inherent bulkiness and complexity in fabrication and integration create significant barriers to achieving compact, low-cost, and manufacturable solutions. Addressing these trade-offs is critical for enabling scalable mm-wave and THz systems for next-generation communication, sensing, and imaging applications.