Amplifiers with Multifunctionality and Integration on Internally Matched Wafer-Level-Package Using Silicon Interposer Technology

Integration of amplifiers with other circuits has recently gained significant attention for enhancing electrical performances and reducing circuit size. This presentation highlights advancements in microwave amplifier design with a focus on these goals. It features a co-designed power amplifier (PA)/low-noise amplifier (LNA) with substrate-integrated waveguide bandpass filter (BPF) matching networks, which improves frequency selectivity, electrical performances, and reduces circuit complexity. Another development includes a co-design of class-F?1 PA and a BPF output matching network with harmonics control functionality, which boosts output power and efficiency while further reducing circuit size. The presentation also covers the co-design of a phase shifter with a PA. Furthermore, a wafer-level-packaged internally matched PA using silicon interposer technology demonstrates improved output power and efficiency, enhancing integration and reducing manufacturing costs. This presentation also insights process optimization in RF/mmWave technology that enhance performance of inductor and boosts the gain of LNA, along with noise reduction, all while providing a cost-effective solution for improved electrical performance.