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Advanced Integration and Packaging Solutions for GaN and GaAs MMIC Power Amplifiers up to Q-Band
The boom in wireless communication system technologies and the rise of next-generation networks, such as 5G, future 6G systems and active antenna arrays, require high-performance, low-power electronic components. In this context, GaN and GaAs MMIC power amplifiers play a key role, offering compact, efficient and broadband solutions. This presentation explores recent advances in the integration and packaging of these amplifiers, focusing on their impact on the overall performance of communication systems. Beyond the mechanical protection provided by innovative packaging systems, they ensure enhanced integration, improved thermal dissipation and increased protection against electromagnetic interference. These advances are essential to meet the growing needs in terms of power density, reliability and cost, while paving the way for new, faster, more robust and more efficient communication architectures.