Thermal and RF Design Challenges of Highly Integrated MMIC Amplifiers for Satellite Applications

Flip-chip packaging provides a compact, cost-effective, and scalable approach for integrating mm-wave Monolithic Microwave Integrated Circuit (MMIC) amplifiers into phased array front-ends. MMIC Lab have investigated the RF and thermal performance of flip-chip mounted amplifiers targeting K-band satellite applications. Thermal simulations using Cadence’s Celsius Thermal Solver allow for the evaluation of heat flow and prediction of channel temperature, a critical parameter for long-term reliability in satellite applications. In addition, 3D electromagnetic simulations are used to optimise the RF performance of the flip-chip transition by reducing interconnect parasitics. Simulated and measured results are presented, highlighting the suitability of flip-chip integration for compact, efficient front-ends in next-generation satellite communication systems.