KEYTOTE: Readout Chip Design and Packaging Challenges to Enable Scalable Quantum Computing

Quantum computing is a promising technology with the potential to solve certain classes of problems exponentially faster than classical computers. In systems based on transmon qubits, RF pulses are used for qubit readout via microwave resonators whose response depends on the qubit state. These signals are routed through cryogenic amplification chains and frequency-multiplexed readout architectures to enable the simultaneous measurement of multiple qubits. Achieving practical, large-scale quantum computing will require the integration of thousands of qubits [1], driving the need for higher levels of integration and new readout circuit architectures. This presentation examines the key challenges associated with scaling quantum computing and highlights how innovations in readout chip design and advanced packaging can help overcome these challenges. Future technology directions relevant to both industry and academia will also be discussed.