KEYNOTE: Greek Words, Big Technology: The New Language of Advanced Packaging

For decades, the semiconductor industry was defined by the monolithic chip — large, complex dies optimized through relentless scaling. That era is giving way to a fundamentally different design paradigm. Today, we are firmly in what could be called the chiplet era. Packages containing a few chiplets heterogeneously integrated to overcome reticle limits and enhance overall system performance. But this is merely the beginning. Emerging workloads in AI and high-performance computing are driving us rapidly toward a future, in which packages will contain many hundreds of tightly interconnected chips. Achieving this vision requires radical advances in packaging density with ultra-fine-pitch interconnects approaching sub-micrometer dimensions. In this keynote, we explore how Greek linguistic roots — mono, oligo, poly — provide a surprisingly powerful framework for understanding the evolution of advanced packaging from single-die integration to massively interconnected chiplet systems. We trace this technological shift, highlight the architectural implications, and discuss the increasing importance of low-overhead interconnect fabrics as system-on-package becomes the new system-on-chip. Finally, we will link this trajectory to the work underway at Deca Technologies, whose breakthroughs in high-density integration, ultra-fine-pitch wiring, and scalable architectures are shaping the new era of advanced packaging. What emerges is a glimpse into the next Deca-de of semiconductor packaging innovation — an era where the language of progress, quite literally, begins in Greek.