Building >100GHz Phased Array Systems using Standard 3D Integration Technologies

In this talk, we will show how standard high-density interposers can be used to build high-performance 140GHz phased arrays. This 3DHI technology is low cost, can be built with 8–12 layers, and allows for high density interconnects with miniature vias and vias-on-every-layer. It also uses thick copper layers for high current systems, which are typical today with CMOS chips having 1V supply. This technology is also ideal for antennas, leading to an efficient antenna-in-package module up to 140GHz. We will show a 140GHz Tx/Rx 64-element phased array with up/down-converters built in 45RFSOI and 3DHI integration, and with near ideal performance.