Wireless Application in the FR3 Band, a Sweet Spot for GaN-on-Si

Expected requirements for wireless applications in the FR3 band are PA power levels calling for Vdd much below the 50V typically used at lower frequencies removing GaN-SiC’s major thermal benefit. At the same time the benefits for monolithic integration will increase or it might even become mandatory. GaN-Si performance can go head-to-head with GaN-SiC on those requirements while being affordable even for monolithically integrated solutions.