Addressing Integration Challenges in CMOS RF Circuits at Cryogenic Temperatures

Quantum computing applications which require deep-cryogenic temperatures introduce unique challenges to achieving high-density scalability of RF control, readout, and addressing circuitry needed for many-qubit operations. Careful co-design of wiring, PCBs, CMOS circuitry, and qubits is required to maintain good signal integrity and low temperatures at the quantum structures. We present methods of addressing integration challenges at the system level as well as in CMOS monolithic integration for silicon-based quantum computing.