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The Role of Advanced Microelectronics and Heterogeneous Integration for Next-Generation 5G/6G Microsystems
The Role of Advanced Microelectronics and Heterogeneous Integration for Next-Generation 5G/6G Microsystems
Abstract
With Moore’s Law reaching its limits, the semiconductor industry is moving towards Gate-All-Around (GAA) devices and 2.5D/3D heterogeneous integration. Key challenges include energy management, especially in RF/mm systems especially GaN devices.
The IEEE Heterogeneous Integration Roadmap (HIR) highlights future trends driven by AI/ML for silicon and 5G/6G for III-V materials. Challenges in millimeter-wave technologies include propagation losses and reduced range, addressed partly by phased-array systems. Tight integration of antennas, RF transceivers, and processors is key for future AI-enabled applications.
This talk will cover microelectronics trends, the HIR roadmap, market drivers, and the impact of IMT-2030 on the microwave field.