3D Modeling and Advanced Manufacturing of Conformal RF Packaging and Metasurface Antennas

In recent years, the demand for high-performance RF packaging has increased due to the integration of multiple semiconductor dies into compact packages. Advanced manufacturing techniques now enable high-density, high-temperature packaging in both planar and 3D forms, supporting complex metasurface architectures. This presentation explores cutting-edge manufacturing methods, such as micro-dispensing, two-photon polymerization, and aerosol jetting, which are vital for developing high-performance RF packaging. It also highlights the integration of 3D electromagnetic modeling with advanced materials to reduce losses and handle high temperatures, featuring innovations like 3D conformal metasurface antennas in wireless communications.