KEYNOTE: 3D Heterogeneous Integration (3DHI): Revolutionizing RF Systems

This talk will present an overview of programs that are developing Si-like fabrication and integration solutions to enable 3D heterogeneous integration of high-performance compound semiconductor (GaN, InP) transmit and receive amplifiers with silicon and non-silicon components (e.g., Si beamformer ICs and quartz antenna layers) to create efficient millimeter wave arrays. These programs are laying the foundation for next generation millimeter arrays and massive MIMO systems.