A Scalable Heterogeneous AiP Module for a 256-Element 5G Phased Array

This talk will cover the design and integration methodologies for a scalable 24–30GHz 256-element phased array antenna module, composed of four 64-element tiles. A heterogeneous integration strategy is used to facilitate the effective integration of various ICs, bandpass filters, splitters, combiners, and decoupling capacitors into a multi-layer organic substrate. This substrate also incorporates the 64 dual-polarized antenna array. This presentation introduces the technical challenges and our approaches to the heterogeneous integration of large mm-wave Antenna-in-Package (AiP) designs. It covers: 1) system architecture and functional partitioning among multiple technologies to enable performance and scalability, 2) package design strategies to ensure signal and power integrity, especially for mm-wave active circuits and antennas, and 3) phased array design and tiling considerations to maintain antenna performance when scaling to large antenna array modules. The talk concludes with 360° EIRP measurement result, demonstrating beam scanning across ±70° in E- and H-planes in both polarizations.