The Role of Advanced Microelectronics and Heterogeneous Integration for Next-Generation 5G/6G Microsystems

With Moore’s Law reaching its limits, the semiconductor industry is moving towards Gate-All-Around (GAA) devices and 2.5D/3D heterogeneous integration. Key challenges include energy management, especially in RF/mm-wave systems especially GaN devices. The IEEE Heterogeneous Integration Roadmap (HIR) highlights future trends driven by AI/ML for silicon and 5G/6G for III-V materials. Challenges in mm-wave technologies include propagation losses and reduced range, addressed partly by phased array systems. Tight integration of antennas, RF transceivers, and processors is key for future AI-enabled applications. This talk will cover microelectronics trends, the HIR roadmap, market drivers, and the impact of IMT-2030 on the microwave field.