Packaging Technologies for mm-Wave and Sub-THz Systems

Packaging plays a critical role in modern microelectronic systems. With the advent of the 5th and 6th generation wireless communication standards, tight co-integration of packaging and radio-frequency integrated circuits at mm-wave and sub-THz frequency is essential to achieve the increasing data demand of most applications. This presentation will discuss some recent developments on organic and non-organic packaging integration up to 300GHz. Packaging technologies, passive circuits including filters, diplexers and examples of fully packaged V-band and D-band transceivers implemented on advanced CMOS technology nodes will be presented.