Glass-based packaging for bits-to-RF and 3DHI systems-in-package

3DGS will present considerations around a manufacturing platform for the production of vertically stacked glass substrates with heterogeneously integrated surface mount devices for advanced RF systems-in-package. In this talk we will cover design, fabrication, and assembly considerations which solve complex co-location problems associated with RF systems. We will also discuss these variables and their impact on system size, weight, and performance (SWAP) metrics for bits-to-RF systems with a focus on mm-wave frequencies.