Skip to main content
Glass Core Technology as a Building Block for Advanced Packaging Architectures
Glass core packaging and stitch chip technologies are pivotal in advancing semiconductor packaging, enabling higher performance, reduced form factors, and improved thermal and electrical management. Furthermore, these technologies help to address critical challenges in 5G, 6G, and high-frequency communications. The presentation will focus on the recent developments in glass core packaging and stitch chip technologies for RF/mmWave applications.