Future of optical and wireline transceiver

In the era of AI, the demand for higher data transfer rates is continuously increasing, particularly in high-performance computing and data center environments. To meet the next-generation system bandwidth requirement, industry and standard bodies like IEEE802.3 and OIF working groups are recently developing projects at 200+ Gbps link rate and kicking off new projects aiming for the next generation 400+ Gbps link rate. So what comes next generation electrical and optical interfaces and SerDes technologies? How to achieve trade-off between performance and power/latency cost? This presentation will start with system requirements, needs and gaps for 200 and 400 Gbps systems, followed by challenges and solutions for SerDes architecture and implementation. Collaborating with experts from interconnect component vendors and semiconductor vendors, we explore the challenges and solutions in optimizing next generation channels and SerDes performance. The analysis focuses on channel loss, signal integrity, bandwidth, SerDes options and trade-offs, providing insights into the 400+Gbps per lane technologies, especially for the feasibility of chip-to-module interface.