Equation-Based Solver for High-Performance SI CuMax Routing Within Pin Fields

This work presents an equation-based solver for the rapid signal integrity (SI) performance calculation of a novel CuMax routing structure, utilizing an electric field compliant geometrical discretization (ECGD) field model. The resistance-inductance-conductance-capacitance (RLGC) matrix of the routing structure is systematically analyzed to derive the S-parameters. The proposed solver demonstrates high predictive accuracy in calculating the SI performance of practical DDR5 channels. The results indicate a maximum deviation of only 4.37% in time-domain reflectometry (TDR) impedance when compared to numerical simulation benchmark results from Ansys HFSS, while achieving a simulation time speedup of approximately 529x. This combination of high accuracy and computational efficiency in SI performance calculation underscores the efficacy and potential of the proposed approach for CuMax routing designs in next-generation microwave communication systems and beyond, which demand compact sizes and high SI.