A D-Band Tx FOWLP Module with Silicon-Based Resonator Antenna Array

This work presents a D-band phased array transmitter (Tx) module that integrates multiple RFICs with antenna-in-package (AiP) technology, implemented using Fan-Out Wafer Level Packaging (FOWLP). The module features four CMOS 160-GHz beamforming multiplier chains, each connected to a 1 × 4 series-fed antenna array, forming a total array aperture of 4.2 × 4.2 mm². To address thermomechanical challenges such as warpage and die shift during the wafer-level backend fabrication process, dummy silicon chips are strategically placed within the package. The array achieves a broadside radiation pattern, with a measured phased array gain of 14.3 dBi and an effective isotropic radiated power (EIRP) of 7.1 dBm at 160 GHz. It supports a scanning range of ±40° in the elevation plane. This work highlights a robust solution to thermomechanical issues while ensuring reliable electrical and mechanical performance, marking significant progress in the development of high-frequency, large-scale phased array modules for next-generation communication systems, radar, and sensing applications.