Evaluation of Stacked Structure for 160 GHz End-Fire Type Compact Antenna-in-Package Considering Thermal Design

Stacking multiple antenna-in-packages (AiPs) for beam scanning leads to increased heat generation, which can degrade RF characteristics such as power amplifier output. A three-dimensional layered structure of the AiP is proposed, featuring an end-fire antenna that excels in thermal management and low-loss performance. Modeling of the heat dissipation pathway is conducted using a thermal equivalent circuit. A prototype of an AiP operating in the 160 GHz band was fabricated. Thermal evaluation and received power assessment were performed for a two-layer stacked configuration of the AiP. The proposed layered structure demonstrated a 6 dB increase in received power and the capability for two-dimensional beam scanning.