Novel Low-Loss Shielded Interconnects for D-band/sub-THz Applications Using Microscale Metal Printing Technologies

This work presents the first demonstration of a shielded interconnect geometry enabled by a novel metal micro additive manufacturing umAM process. The printed interconnect operates at D-band and features an innovative helical-shaped geometry that resembles the ideal transmission performance of a micro-scale coaxial cable and significantly reduces the impedance mismatch losses that are typically observed in conventional wirebonding interconnects when utilized beyond 100 GHz. The measurements demonstrate superior and reliable performance at least up to 155 GHz with an insertion loss below 1.5 dB and a return loss greater than 10 dB. The proposed $\upmu$AM-enabled interconnect has the potential to enable the next generation of packaging solutions targeted for sub-THz applications that require robust and broadband performance.