Centimeter-Wave Power Amplifiers in Silicon and III-V for 6G FR3 Applications

This talk focuses on practical FR3 PA design and implementation choices across both silicon and III-V technologies, using a cross-technology lens to clarify where each platform excels and how these tradeoffs map to real deployments. On the silicon side, the discussion highlights benchmark stacked PAs, cascode designs with double neutralization for robust wideband operation, and ultra-compact Doherty PAs that improve backoff efficiency in small footprints. Complementing this, III-V PAs provide a reference point for higher output power and efficiency. Finally, the talk briefly discusses how AI-assisted methods can expand the design space for non-intuitive passive EM structures and improve design portability, shortening iteration cycles and supporting faster time-to-market.