3D Heterogenous Integration (3DHI) Design Landscape for RF and mm-Wave Communications

Heterogeneous integration involves the combination of diverse Integrated Circuit (IC) technologies to enhance system performance while minimizing overall cost. The high-frequency and wide-bandwidth demands of emerging 5G and prospective 6G wireless communication systems will significantly benefit from the adoption of 3D heterogeneous integration. This presentation will explore the advantages and inherent trade-offs associated with 3D heterogeneous integration applied to front-end RF circuits targeting next-generation communication systems. Key design challenges will be examined alongside critical considerations in technology selection and assembly methodologies. Case studies of 3DHI implementations incorporating BiCMOS, CMOS, and III-V semiconductor technologies will be discussed to illustrate practical approaches and performance outcomes.