Realizing 3DHI Designs Through Advanced Simulation

3D Heterogeneous Integration (3DHI) promises scaling improvements and increased system integration and density while allowing for the use of best-in-class technologies that cannot be achieved using monolithic design. But increased density also means increased interaction of chips, components, and packaging which requires precision simulation to achieve the desired performance, especially at mm-wave and sub-THz frequencies. In this presentation we will discuss the types of simulations necessary to predict overall system performance and the capabilities needed from EDA tools to successfully combine these different chip and package technologies.