Advanced Design Methodology for RF Transition Optimization in IC Packaging: From Calibration to Prediction

In advanced packaging technologies, RF launcher design plays a critical role in enabling high-performance signal transitions between the Integrated Circuit (IC) and the package across a broad frequency range. This work introduces a versatile design workflow applicable to various packaging types, aimed at developing a complete set of calibration standards and test vehicles. These tools enable the precise definition and isolation of reference planes, allowing for targeted optimization of the transition region based on the specific RF launcher, IC technology, and packaging constraints. For this workshop, the methodology is demonstrated using a standard QFN package as a representative case. The workflow incorporates design automation to efficiently identify optimal transition configurations without requiring full electromagnetic co-simulation of the entire package, significantly reducing design effort and turnaround time. Designers can then integrate these transitions into their systems and leverage measurement data to predict and enhance the impact of packaging on overall IC performance.