Heterogeneous Integration of a 256-Element 5G Phased Array: Design, Assembly, Test

This presentation describes the design and integration considerations for a scalable 24–30GHz 256-element phased array antenna module composed of four 64-element tiles. The module utilizes a heterogeneous integration approach to efficiently combine multiple ICs and passive components within a multi-layered organic substrate that integrates the dual-polarized antenna array, forming a complete mm-wave phased array module. The talk addresses technical challenges and practical design aspects, including system architecture and functional partitioning, Power Delivery Network (PDN) design and modeling, tiling considerations, module assembly, and antenna feedline design to preserve polarization isolation. The proposed approach is validated by radiation and beam scan measurements, demonstrating a ±70° beam scan in both E- and H-planes and polarizations. Finally, the talk will discuss the anticipated advantages of adopting a chiplet-based approach for digital baseband processing, enabling the implementation of full end-to-end antennas-to-AI systems for the next generation of energy-efficient and adaptive mm-wave networks.