Accurate TRL Calibration in Waferscale RF Silicon Interposer Technology — Stackup Choice, GSG Pad Design and Multimode Suppression

This talk introduces IMEC’s 300mm RF Silicon Interposer packaging technology. First, the key modules of the platform will be introduced followed by certain key applications. Second, the need for accurate calibration at sub-THz frequencies will be motivated and it will be shown systematically how the platform is optimized to only excite a single propagating mode up to very high frequencies as well as suppress coupling to adjacent structures. Waferscale calibration standards can provide the necessary accuracy, repeatability and conform to all the TRL requirements at these frequencies.