From RFICs to Systems: Realizing Sub-THz Communication Modules

It is remarkable that semiconductor technologies now provide power gain at frequencies well beyond 500GHz, a capability that RFIC designers have come to regard as routine. Recent advances in SiGe BiCMOS and next-generation SOI platforms further enable the integration of high-performance analog and RF devices with complex digital content, supporting increasingly sophisticated system functionality. As a result, the drive toward higher carrier frequencies and data-rates in wireless communication systems is both natural and expected. The critical challenge, however, has shifted from the design of sub-THz transceivers to the packaging and industrialization strategies required to realize practical, economical, and energy-efficient end-to-end communication solutions. This talk addresses these challenges by highlighting the co-design and co-integration of sub-THz RFICs with glass interposer technology, demonstrating a pathway toward scalable, state-of-the-art communication modules.