Emerging Techniques in 3D Modeling and Additive Manufacturing for Conformal RF Packaging and Metasurface Antennas

Over the last decade, the complexity of RF component packaging has increased, driven by, for example, the integration of multiple semiconductor dies into compact, high-performance systems. This evolution has spurred demand for advanced manufacturing approaches capable of supporting intricate planar and 3D architectures, high-temperature operation, and the incorporation of metasurfaces. This presentation delves into the current landscape of advanced manufacturing and 3D electromagnetic modeling for heterogeneous RF components and metasurfaces. It highlights emerging trends and technologies that are reshaping the field, with a focus on the convergence of material science, modeling techniques, and fabrication innovations. From an engineering standpoint, progress in RF packaging hinges on the synergy between high-fidelity electromagnetic modeling and the development of novel conductive and dielectric materials engineered to reduce losses and endure thermal stress. Equally critical is the implementation of cutting-edge manufacturing processes tailored to the demands of heterogeneous integration. Key discussion points will include recent advances in additive manufacturing techniques such as micro-dispensing, two-photon polymerization, femtosecond laser machining, and aerosol jetting. These methods enable the fabrication of multilayer, conformal structures with precise electromagnetic and mechanical properties. The talk will also showcase practical applications, including 3D conformal metasurface antennas, illustrating their transformative impact on next-generation wireless systems.