Thermal Imaging Solutions to Address Emerging Thermal Challenges of Advanced Devices and 3DHI Packaging Techniques

Commercialization of thermoreflectance thermal imaging has met many of the thermal challenges inherent with today’s advanced devices. The technique exploits the fact that the reflectivity of a material changes with temperature. Measuring the reflectivity change with probing wavelengths in the visible band enables diffraction limited spatial resolution in the sub-micron range and temporal response in the sub-nanosecond range. New thermal challenges are arising with current trends in heterogeneous packaging. Addressing these new challenges requires enhancements to existing solutions and the development of new techniques. A description of these advances including optical pump-probe imaging, TDTR, and flash-thermography will be discussed.