Toward Scalable Quantum Microwave Systems

Present-day quantum processor architectures face fundamental bottlenecks when scaling, including lateral fan-out, bulky interconnects and peripheral components. QuantWare is developing a novel scaling architecture, called VIO, that overcomes these challenges by leveraging a vertical stack of chips. This approach enables a dense array of RF lines with integrated signal conditioning components, significantly reducing both footprint and thermal load compared to existing solutions. This results in a truly modular way of scaling QPUs. In this presentation, we will outline the principles behind VIO and demonstrate its potential to accelerate the path to utility-scale quantum computing.