Panel Sessions

Joint IMS- RFIC Panel - Will Artificial Intelligence (AI) and Machine Learning (ML) take away my job as an RF/Analog Designer?

Tuesday, 4 June 2019
Room 162 AB
12:00 - 13:15

Organizers: Osama Shanaa, MediaTek, Inc.; Francois Rivet, Univ. of Bordeaux.

Moderator: Osama Shanaa.

Abstract: Machine learning (ML) and artificial intelligence (AI) are no longer futuristic concepts. They are already making their mark not only in applications that are purely data-analytics related, but also in communications, transportation, navigation, autonomous driving, finance, e-commerce, gaming, and many more fields. For example, ML/AI have already replaced humans in driving cars/trucks and in store cash registers. With AI also entering our territory of RF system and IC development, should we expect that our jobs as "conventional" designers will soon be taken away? What will future RF systems and ICs be like, with AI being incorporated in them, as well as in the tools used to design them?

Our distinguished panelists from the academia, DARPA, CAD/EDA, and RF industries will debate what we may expect to see in the near and distant future, and how we should prepare ourselves for the inevitable realities. You do not want to miss this!

Panelists:

1. Ron Rohrer, Southern Methodist Univ.

2. Taylor Hogan, Cadence Design Systems, Inc.

3. Modi Sankalp, MathWorks, Inc.

4. Thomas Rondeau, Defense Advanced Research Projects Agency

5. Paul Franzon, North Carolina State Univ.

100 Gb/s Wireless Link: How do We Get There and What are the Future Applications?

Wednesday, 5 June 2019
Room 162 AB
12:00 - 13:00

Organizers: Omeed Momeni, UC Davis; Ruonan Han, MIT.

Abstract: The ever-growing demand for higher data speed is already driving the wireless communication technology toward the mm-wave and THz spectrum. The move from Radio Frequency (RF) to mm-wave in the upcoming next generation of mobile cellular communication (5G), backhaul, and WiGig systems are the perfect examples. These systems can ideally achieve several Gb/s data rate across tens of meters. In recent years many research works have shown the feasibility of tens of Gb/s data rates over a relatively short range. A few works have gone further to show that 100 Gb/s or even higher is achievable in a wireless link. Would a 100 Gb/s Wireless link be ever used in a product and be able to compete with other alternatives? If so, how do we get there and what are the future applications? What are the necessary conditions to make this a reality? In this panel we will have expert panelists from a variety of industry and academia backgrounds to share their views on this topic.

Panelists:

1. Ali Niknejad, University of California Berkeley;

2. Kenichi Okada, Tokyo Institue of Technology;

3. Tadao Nagatsuma, Osaka Univ.;

4. Ali Sadri, Intel Corp.

5. Herbert Zirath, Chalmers University

6. Shahriar Shahramian, Bell Labs

In-Band Full-Duplex: Is It Really Going To Happen?

Thursday, 6 June 2019
Room 162 AB
12:00 - 13:15

Organizers: Kenneth E. Kolodziej, Massachusetts Institute of Technology.

Abstract: In-Band Full-Duplex (IBFD), or Simultaneous Transmit and Receive (STAR), technology has recently been proclaimed as a critical enabler of fifth-generation (5G) wireless networks as well as other applications that were previously considered impracticable.  IBFD systems promise enhanced spectral and network efficiencies, but must mitigate their inherent self-interference through a variety of techniques that need to be robust across a diverse set of operating environments.  While many groups around the world have demonstrated systems utilizing these different techniques, only a handful of mature prototypes have been presented for potential large-scale deployment.  In this session, expert panelists from a variety of backgrounds will discuss if IBFD technology will ever leave the laboratory, expand upon its potential deployment hurdles, and debate when it may start to appear in tomorrow’s wireless devices.

Panelists:

1. Leo Laughlin, Univ. of Bristol;

2. Harish Krishnaswamy, Columbia Univ.;

3. Dani Korpi, Nokia Bell Labs;

4. Joel Goodman, US Naval Research Laboratory;

5. Jonathan Doane, MIT Lincoln Laboratory.