Technical Sessions
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This session highlights innovations and techniques in integrated millimeter-wave and Sub-Terahertz hardware for advanced radar and sensing applications.
This session covers innovations in high-speed wired and wireless links. The first paper presents 3-level ASK modulator for a 15Gb/s wired link. The final 3 papers present wireless communication from an efficient V-bank transmitter to receiver-assisted transmitter linearization and a joint communication and sensing platform.
This session discusses practical realization of state-of-the-art microwave photonics systems and integrated circuits. The session begins with a multi-static, multi-band photonics MIMO radar. An ultra-low phase noise opto-electronic frequency synthesizer is covered next followed by a multi-channel microwave photonic transmitter for RoF applications. The session is concluded with two papers discussing integrated phonic circuits.
This session focuses on recent advances in Doherty power amplifiers. This load modulation technology is pushed to higher frequencies above 7GHz, higher output power, extended power back-off range, and unprecedented instantaneous bandwidth for emerging wireless infrastructure.
This session covers advances in microwave technologies related to quantum computing. The session begins with two papers relevant to quantum computing readout. First a cryo-CMOS single-sideband upconverter is presented for qubit readout waveform generation and then the systematic design of parametric amplifiers using electromagnetic- and schematic-level simulations is described. Next, a wideband cryogenic VCO for use in qubit control/measurement systems is presented. This is followed by a description of research in cryogenic RF-over-fiber links. Finally, the session concludes with the presentation of an high-coherence architecture for packaging superconducting quantum processors
In this session, various novel wireless power transfer (WPT) systems for smart cities and biomedical applications will be highlighted, with an emphasis on energy efficiency, beam-steering, and miniaturized design. Featured contributions include innovations such as broad-beam equiconvex lens-integrated millimeter-wave harvester for 5G-powered environments, time-multiplexed beam-steering antenna array for programmable RF powering of CMOS brain implants, and supply voltage modulation method to address efficiency degradation. Additional advancements include flexible rectennas for ambient RF energy harvesting in IoT applications and single-ended capacitive WPT circuit for artificial retina systems. Collectively, these breakthroughs pave the way for sustainable and efficient WPT solutions across diverse applications.
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This session presents recent developments in millimeter-wave wireless systems for sensing and communications. Advanced techniques for MIMO radar, three-dimensional radar imaging, radar networks, and joint sensing and communications are presented through six detailed presentations.
This session focuses on MHz-to-THz technology for human body communication and other sensing applications. The keynote discusses field interactions in the human body and the second paper demonstrates the human body power transfer. A novel technique to improve underwater communication is presented in the fourth paper and the session concludes using a W-band FMCW radar for smart smoke detection.
This session discusses phonically enabled THz sources, detectors, novel integration techniques as well as systems for applications ranging from communication to sensing.
This session includes several transmit components with over 10W of output power, including a decade-bandwidth 0.2-2GHz load-modulated balanced amplifier, several integrated Doherty PA modules and an E-mode dual-gate SPDT switch.
This session showcases advances in the intersection between AI and RF systems. Highlights include AI-enabled device-level modeling and characterization, power amplifier digital predistortion, and system-level transceiver optimization.
This session delves into cutting-edge innovations in RF rectifier design, showcasing advancements that push the boundaries of efficiency, dynamic range, and compact integration for wireless power transfer (WPT) systems. Presentations will explore novel techniques such as impedance splitting, compression networks, harmonic suppression, and resonance enhancements to achieve superior RF-to-DC conversion efficiencies. Join us to explore how these developments enable scalable, high-performance WPT solutions for emerging applications.
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This scientific session will delve into cutting-edge technologies and methodologies in biomedical applications, focusing on devices and systems for medical imaging and diagnostics. Key topics will include the latest advancements in Magnetic Resonance Imaging (MRI), which enhance imaging resolution and improve patient experience; dielectric spectroscopy for non-invasive tissue characterization; advanced thermometry techniques that enable precise temperature monitoring in therapeutic environments; and the development of resonant microwave biosensors for rapid and sensitive biomolecular detection. We will explore innovative concepts that bridge engineering and medicine, fostering interdisciplinary collaboration aimed at improving patient outcomes and advancing healthcare technologies.
This session presents five cutting-edge papers showcasing recent advancements in sub-THz and mm-wave phased-array systems. The first paper introduces a 150-GHz AiP phased-array module, highlighting its innovative design and performance. The second paper explores a 28-GHz monolithic heterogeneous integrated GaN and Si beamformer, emphasizing its integration. The third paper discusses a 4x4 Butler matrix-based switched beamformer, detailing its architecture and application. The fourth paper presents a novel body proximity detection technique utilizing reflections from a mm-wave phased-array, demonstrating its potential in various applications. The final paper describes linearization techniques for a dual-band near-field probing approach, showcasing significant improvements in performance.
Al Katz passed away on the morning of June 20, 2024, the day he had been scheduled to give a presentation at IMS'24. Today we remember Al Katz and his work on analog linearization. The session will begin with recollections by his widow Sally. Amateur radio was an important factor in Al's becoming an engineer, so we will next present his accomplishments as a radio amateur. Al's work on linearization led to the formation and growth of the Linearizer Technology Company, which will be the next topic of discussion. The fourth segment provides an overview of analog linearization and the current state of the art. Finally, members of the audience will be encouraged to give their recollections of Al Katz.
This session explores new approaches for sub-THz and THz signal generation, spanning diverse technologies and architectures. The first paper presents a 4-240 GHz InP variable-gain amplifier employing an analog-controlled input attenuation network for versatile performance tuning. Next, a 4-420 GHz distributed amplifier MMIC in 20-nm InGaAs-on-Si HEMT technology achieves 11±2 dB of gain. A 280 GHz sub-harmonic injection-locked oscillator in 45 nm CMOS PD SOI demonstrates robust frequency generation. Finally, a 300 GHz-band single-balanced resistive mixer module in 60-nm InP HEMT features LO leakage suppression. Collectively, these designs pave the way for next-generation THz communication systems.
This session contains 5 papers on analog predistortion (APD) focusing on very high frequency, MIMO systems, and circuit techniques including phase-cancellation, Doherty and Darlington power amplifier architectures.
This session explores the integration of wireless sensors, radio frequency (RF) selective surfaces, and innovative power harvesting techniques in the design of energy-efficient microwave and radio frequency sensors.
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The biomedical radar technology has a potential to transform patient monitoring and search and rescue applications. This session explores the state-of-the-art advancements in high precision single and multiple subject detection and monitoring.
This session explores advanced antenna and surface technologies addressing key challenges in next-generation wireless communication, including energy efficiency, adaptability, and sensing-communication integration. Session includes first paper for shape estimation and beam correction in flexible phased arrays, followed by a dual-polarized true-time-delay-based Reconfigurable Intelligent surface (RIS), chirp-based beamwidth control in RIS for millimeter-wave systems, and a multi-feed active antenna module achieving reconfigurable polarization. Additional presentations feature a 2-bit RIS enabling polarization-based sensing and communication, a Liquid Crystal-based RIS with energy-efficient bias pulse technology. Together, these innovations demonstrate transformative potential in reconfigurable systems for future wireless networks.
This session features the latest developments in the production of RF power at frequencies up to 1 GHz. The session begins with a survey of transistors for production of 1 kW or more of RF power. Next the session addresses operation over wide bandwidths with both ferrite-loaded baluns and continuous-mode operation of an amplifier. Techniques for driving switching-mode power amplifiers and for directly interfacing high-efficiency amplifiers to antennas are described. Finally, the session includes a comparison of EER and Doherty techniques for high-efficiency operation at VHF.
This session brings together four papers showcasing sub-terahertz (THz) and THz signal modulation techniques for next-generation communication systems. The first paper introduces attenuator-based vector modulation strategies for phased arrays operating from 200 to 480 GHz. The second paper demonstrates a novel photoconductive solid-state plasma evanescent-mode waveguide for sub-THz phase shifting. The third paper presents a compact 8.2 mW complementary current-reusing D-band frequency quadrupler implemented in 22 nm FDSOI CMOS. Finally, the fourth paper compares wideband low-power H-band frequency doublers, with and without driving stages, also in 22 nm FDSOI CMOS, highlighting performance trade-offs. These advances significantly elevate future sub-THz communications.
This session consists of 5 papers including the keynote paper "Efficiency Enhancements using Digital Predistortion and
Advanced Transmitters". The remaining 4 papers address the challenges of linearization in emerging phased-arrays systems, novel machine learning and DSP solutions to improve radio performance.
This session showcases cutting-edge innovations in satellite communication and remote sensing technologies, highlighting advancements in antennas, phased arrays, and transceivers.
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This session highlights the next generation front-end components and architectures. It includes Wi-Fi 7 as well as phased array applications.
This session will provide an overview of new developments in planar filters with multi-functional capabilities and miniaturized footprint. It will cover concepts allowing to incorporate the co-designed functionality of attenuation, cross over and reflection cancellation. Miniaturization techniques leading to self-packaged filters will also be discussed.
Improved computational methods for the simulation of challenging electromagnetic structures are crucial for advances in key areas of microwave technology. This session presents several innovative computational methods to allow for improved modeling for various applications. Applications include accurate modeling of RF emission from printed circuit boards, a new fast method for analyzing problems with the volume integral equation, a fast method for analyzing arbitrary H-plane waveguide systems, and a new method for finding the mmW attenuation on printed circuit lines due to surface roughness.
This session provides a deep dive into the design of advanced non-planar filters. The content includes innovative dielectric resonator diplexer designs, novel design concepts that help improve filter selectivity, advanced practices in miniaturizing filter size, and novel technologies for filter realization.
This session presents advanced frequency converters and modulators using silicon-based and III-V semiconductor technologies. The wide range of topics including frequency multiplication, frequency mixing, and I/Q modulators will be discussed.
This session presents power amplifiers in GaN and GaAs MMIC technologies. These topics cover continuous mode techniques with active and passive harmonic control.
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This session focuses on the design, implementation, and calibration of advanced silicon based beamforming ICs in SiGe and CMOS. These components and subsystems apply to a range of communication solutions covering from 16 GHz to 39 GHz for phased array applications including 5G.
This session will cover new synthesis and RF design techniques to effectively realize advanced transfer functions. Design techniques allowing the prediction of the filtering transfer function from RF measurements will also be presented. Novel design techniques for compact mm-wave RF filters will be discussed.
This session introduces a variety of innovative modeling techniques that allow for the improved modeling of practical microwave structures as well as the modeling of new phenomena and effects, ranging from microwave to THz frequencies. This includes an improved analysis and optimization of magnet-less circulators, the efficient analysis of practical CuMax routing lines on a printed circuit board, analysis of plasma jet lines, using a physical based model for analyzing signal integrity on high-speed data links, and the modeling THz radiation produced by an electron beam in the vicinity of a grounded strip grating.
In this session you will see the latest advances in passive components realized in non-planar technologies. The papers discuss advanced designs such as power dividers and combiners, combiners with filtering functions, antennas with integrated functionality, rotary joints and waveguide loads.
This session presents advanced RF/mm-wave frequency multiplication techniques from Ku- to G-band using a variety of technologies including CMOS, FDSOI, SiGe, and InP.
This session focuses on several papers on high-efficiency power amplifier design techniques in GaAs HBT, CMOS, SOI and EDMOS technologies for 6G FR3 handset and MIMO radar applications.
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This session will highlight advanced millimeter wave transceivers for next generation radar and communication applications. It includes recent advances in monolithic devices such as CMOS and GaN technologies. Additionally, system on chip and package level innovations are discussed for heterogeneous-integrated electronics.
In this session, we report exciting advancements in integrated passive devices mainly for CMOS and SOI technologies. For example, two SOI RF switches with a series triple-coupled transformer topology demonstrate suitability for compact millimeter-wave systems, with IP3 levels exceeding 81.5 dBm. An SOI digital step attenuator features an ultrawide bandwidth of DC to 51 GHz, sub-5 dB insertion loss, and a 3.1° RMS phase error. A 10–17 GHz continuously tunable CMOS bandpass filter, leveraging mode-switching inductors and Q-enhancement techniques, achieves a broad tuning range and enhanced selectivity. Finally, an ultra-compact D-band substrate-integrated waveguide (SIW) filter shows the potential of SIW filters for on-chip millimeter-wave circuit integration.
This session highlights innovative approaches in computational methods and optimization for circuit design. Topics include advanced CAD techniques for sensitivity analysis, efficient surrogate modeling for inverse design, cognitive methods for design optimization, knowledge-based modeling and novel methods for optimizing oscillator systems. These contributions demonstrate improvements to accuracy, efficiency, and design flexibility in RF and microwave circuits.
This session presents low-phase noise signal generation from X- to D-band using a variety of technologies including bulk CMOS, FDSOI, GaAs, and FinFET.
This session focuses on advancements in power amplifiers using load-modulation architectures to improve efficiency at back-off power levels, as needed in most modulation formats today. Papers cover work at frequencies between 2 GHz and 30 GHz, and technologies including CMOS-SOI, GaAs HBT, Gas pHEMT and GaN.
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This sessions introduces numerous advanced mm-wave in-package radiating and waveguiding structures at frequencies up to G-band
This session will present the latest advances in switching technologies for innovative RF and millimeter-wave circuits. The session will highlight ultra low-loss MEMS switches for high-speed communication systems, wideband CMOS integrated PCM devices. The session will cover BST and PCM based variable capacitors, with super high dynamic range and high-Q. New sub-THz waveguide integrated switches with optical control will also be presented, along with piezoelectric material based modulators.
Radio and millimeter-wave integration and packaging is emerging as an enabling technology for commercial and defense applications. In this session, we highlight different transmission-line based components and system including SIW technologies for compact phase shifters, couplers, and integration of active and passive elements. Integrated wideband waveguide crossovers for high power routing is presented. Miniaturized wafer-scale hybrid couplers are implemented in two different technologies.
Microwave plasma and its applications for protection against high power threads are discussed. New techniques and instruments for material sensing across a broad range from microwave to THz frequencies are presented. The session covers the EM characterization of atmospheric conditions, fluids, as well as conventional and 3D-printed substrates.
This session will showcase state of the art MMIC performance at frequency bands covering E-band (74, 84 GHz) through D-band (110-170 GHz). MMIC technologies ranging from state of the art 100 nm GaN-on-SiC, commercial GaAs PHEMT, and 40 nm bulk CMOS processes are presented. These results represent new benchmark performance results for these technologies and showcase high-performance on-chip power combining techniques and these amplifiers are applicable to a range of RF applications including E-band wireless backhaul, 6G communications, D-band radar and imaging, satellite communications, and defense electronics.
The session covers multi-Gbps transmitter and receiver building blocks and systems for photonics, wireline, and wireless applications. The session starts with a fully integrated silicon photonic transmitter, followed by an IQ modulator for coherent optical systems. The remaining papers are two sampling front ends, a wireline transmitter, and a D-band phase shifter for phased array antennas.
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This session introduces multiple state of the art technologies for packaging and integration up to sub-THz frequency bands. Specifically the papers to be presented will cover novel low-loss shielded interconnects for D-band/sub-THz applications , 3D heterogeneous integrated RF glass-interposer system-in-package architectures, novel waveguide launcher in interposer package technologies for automotive imaging radars, highly scalable RF dielets embedded in glass interposer and thin film transmission lines on low-k polymer films
This session highlights recent innovations in acoustic wave technologies for next-generation communication systems. It covers the design of low-loss SAW filters with wide bandwidths for Wi-Fi 7, as well as frequency and bandwidth optimization of millimeter-wave thin-film lithium niobate acoustic filters. Additionally, the session introduces miniature, high-coupling resonators based on lithium niobate thin films operating in the 10-30 GHz range. The final presentation focuses on a 36 GHz periodically poled FBAR with a trilayer piezoelectric material structure, offering promising applications in high-performance frequency devices. These advancements demonstrate significant potential for future wireless technologies.
Different approaches for the design of advanced phase-shifting components with co-designed RF functionalities are presented, including quasi-circulator operation, bandpass filtering, and tunable attenuation. Implementations of these RF components in various technologies, such as planar, CMOS, and substrate integrated waveguide with liquid crystal are shown.
This joint IMS/ARFTG session addresses today’s measurement needs and challenges brought about by higher operating frequencies and instantaneous bandwidths. The presentations include traceability of coaxial standards through D-band, the use of frequency extenders in millimeter wave load pull, as well as enhancements in receivers and local oscillators used in measurements.
The session focusses an advanced compound semiconductor integrated-circuits for broadband and phased-array applications. The session will kick-off with an invited talk on the advances in mm-wave and THz-amplifier technology and design. Advanced PA, DPD, linearization, and power combining techniques will be described as well as a highly-integrated 300 GHz active phased-array.
This session presents novel receiver front-end designs, showcasing innovations in LNAs, phase shifters, and broadband receivers.
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This session reports the latest advancements in 3D-printing and additive manufacturing of microwave and mm-wave filters, attenuators, interconnects, and transmitters
This session discusses deep-levels and high field-effects in GaN devices including HEMTs and IMPATT diodes. Additional topics include performance implications gate insulator and metallization design. The session concludes with the characterization of substrates down to cryogenic temperatures.
This session presents the latest advancements in reconfigurable filtering devices. The reconfigurable devices include a multi-throw filtering switch, tunable filters, and an electrical balance duplexer for simultaneous transmit and receive architectures. The tunable filters include a dual-band coaxial filter and a tunable filter using Yttrium Iron Garnet to achieve 8-32 GHz frequency tuning.
Higher frequencies, higher levels of integration and new measurement environments, including cryogenic, are driving changes to on-wafer measurement procedures and equipment. In this joint IMS/ARFTG session, we will review a number of new processes, techniques, and different equipment constructs to help meet these evolving requirements. Topics include on-wafer versions of comprehensive mm-wave mixer measurements, on-wafer power calibration techniques, multiport calibration methods, and ways of dealing with thermally extreme environments.
This session explores advancements in leveraging AI/ML for RF/mmWave/sub-THz circuit design, modeling, and optimization. The papers demonstrate synthesis of complex electromagnetic structures, mmWave PA design and array optimization using AI/ML methods.
This session is focused on the latest developments in integrated low noise amplifiers for wideband communication. The papers in the session cover frequency range from C-Band to D-Band. Furthermore, novel circuit techniques are reported to achieve low-noise performance and low power dissipation.