The IEEE MTT-S RF Integrated Circuits (RFIC) Symposium traces its roots to the IEEE Microwave and Millimeter-Wave Monolithic Circuits Symposium (MMWMC, 1982–1996) and has long been a cornerstone of IMS for monolithic integrated circuit innovation. Today, the RFIC Symposium remains the premier forum dedicated exclusively to presenting the latest advances in RF, millimeter-wave, sub-THz, and THz integrated circuits and systems.
RFIC2027 spans both foundational RFIC building blocks and integrated RFIC subsystems. On the building-block side, the symposium features power amplifiers, transmitter circuits, front-end modules, low-noise amplifiers, oscillators, frequency synthesizers, data converters, mixedsignal circuits, and high-speed interconnects. On the integratedsubsystem side, the symposium focuses on fully integrated solutions operating from sub-GHz to THz frequencies, leveraging SiGe, CMOS, SOI, and compound-semiconductor technologies, and often incorporating on-chip digital processing, calibration, control, and memory subsystems.
The symposium welcomes papers not only on monolithic systems, but also on heterogeneously integrated and advanced-packaged implementations spanning a broad range of applications. Application areas include 5G/6G wireless, radar, satellite communications, sensing, imaging, IoT, wireline and optical links, quantum and cryogenic systems, biomedical platforms, and AI-assisted RFIC design.
The symposium solicits papers describing original work in all areas related to RF, mm-Wave, THz, and wireless systems and ICs. Work must be demonstrated through IC hardware results and measurements.
Our dedicated track for Industry and Startup papers highlights impactful, application-driven innovations, measured commercial technologies, and new concepts with strong potential for real-world deployment.
We look forward to seeing your latest RFIC research in San Antonio in May 2027!
Symposium Chair: Bodhisatwa (Bodhi) Sadhu, IBM Research
TPC Chair: Debopriyo (Debo) Chowdhury, Broadcom
TPC Vice Chair: Steven Turner, BAE Systems
Sponsorship Opportunities for RFIC 2027
