Active Devices
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This session focuses on recent advances in Doherty power amplifiers. This load modulation technology is pushed to higher frequencies above 7GHz, higher output power, extended power back-off range, and unprecedented instantaneous bandwidth for emerging wireless infrastructure.
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This session includes several transmit components with over 10W of output power, including a decade-bandwidth 0.2-2GHz load-modulated balanced amplifier, several integrated Doherty PA modules and an E-mode dual-gate SPDT switch.
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This session contains 5 papers on analog predistortion (APD) focusing on very high frequency, MIMO systems, and circuit techniques including phase-cancellation, Doherty and Darlington power amplifier architectures.
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This session features the latest developments in the production of RF power at frequencies up to 1 GHz. The session begins with a survey of transistors for production of 1 kW or more of RF power. Next the session addresses operation over wide bandwidths with both ferrite-loaded baluns and continuous-mode operation of an amplifier. Techniques for driving switching-mode power amplifiers and for directly interfacing high-efficiency amplifiers to antennas are described. Finally, the session includes a comparison of EER and Doherty techniques for high-efficiency operation at VHF.
This session consists of 5 papers including the keynote paper "Efficiency Enhancements using Digital Predistortion and
Advanced Transmitters". The remaining 4 papers address the challenges of linearization in emerging phased-arrays systems, novel machine learning and DSP solutions to improve radio performance.
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This session presents advanced frequency converters and modulators using silicon-based and III-V semiconductor technologies. The wide range of topics including frequency multiplication, frequency mixing, and I/Q modulators will be discussed.
This session presents power amplifiers in GaN and GaAs MMIC technologies. These topics cover continuous mode techniques with active and passive harmonic control.
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This session presents advanced RF/mm-wave frequency multiplication techniques from Ku- to Y-band using a variety of technologies including CMOS, FDSOI, SiGe, and InP.
This session focuses on several papers on high-efficiency power amplifier design techniques in GaAs HBT, CMOS, SOI and EDMOS technologies for 6G FR3 handset and MIMO radar applications.
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This session presents low-phase noise signal generation from X- to D-band using a variety of technologies including bulk CMOS, FDSOI, GaAs, and FinFET.
This session focuses on advancements in power amplifiers using load-modulation architectures to improve efficiency at back-off power levels, as needed in most modulation formats today. Papers cover work at frequencies between 2 GHz and 30 GHz, and technologies including CMOS-SOI, GaAs HBT, Gas pHEMT and GaN.
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This session will showcase state of the art MMIC performance at frequency bands covering E-band (74, 84 GHz) through D-band (110-170 GHz). MMIC technologies ranging from state of the art 100 nm GaN-on-SiC, commercial GaAs PHEMT, and 40 nm bulk CMOS processes are presented. These results represent new benchmark performance results for these technologies and showcase high-performance on-chip power combining techniques and these amplifiers are applicable to a range of RF applications including E-band wireless backhaul, 6G communications, D-band radar and imaging, satellite communications, and defense electronics.
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The session focusses an advanced compound semiconductor integrated-circuits for broadband and phased-array applications. The session will kick-off with an invited talk on the advances in mm-wave and THz-amplifier technology and design. Advanced PA, DPD, linearization, and power combining techniques will be described as well as a highly-integrated 300 GHz active phased-array.
This session presents novel receiver front-end designs, showcasing innovations in LNAs, phase shifters, and broadband receivers.
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This session discusses deep-levels and high field-effects in GaN devices including HEMTs and IMPATT diodes. Additional topics include performance implications gate insulator and metallization design. The session concludes with the characterization of substrates down to cryogenic temperatures.
This session is focused on the latest developments in integrated low noise amplifiers for wideband communication. The papers in the session cover frequency range from C-Band to D-Band. Furthermore, novel circuit techniques are reported to achieve low-noise performance and low power dissipation.