Emerging Technical Areas

This session covers innovations in high-speed wired and wireless links. The first paper presents 3-level ASK modulator for a 15Gb/s wired link. The final 3 papers present wireless communication from an efficient V-bank transmitter to receiver-assisted transmitter linearization and a joint communication and sensing platform.

This session covers advances in microwave technologies related to quantum computing. The session begins with two papers relevant to quantum computing readout. First a cryo-CMOS single-sideband upconverter is presented for qubit readout waveform generation and then the systematic design of parametric amplifiers using electromagnetic- and schematic-level simulations is described. Next, a wideband cryogenic VCO for use in qubit control/measurement systems is presented. This is followed by a description of research in cryogenic RF-over-fiber links. Finally, the session concludes with the presentation of a high-coherence architecture for packaging superconducting quantum processors.

This session focuses on MHz-to-THz technology for human body communication and other sensing applications. The keynote discusses field interactions in the human body and the second paper demonstrates the human body power transfer. A novel technique to improve underwater communication is presented in the fourth paper and the session concludes using a W-band FMCW radar for smart smoke detection.

This session showcases advances in the intersection between AI and RF systems. Highlights include AI-enabled device-level modeling and characterization, power amplifier digital predistortion, and system-level transceiver optimization.

Al Katz passed away on the morning of June 20, 2024, the day he had been scheduled to give a presentation at IMS'24. Today we remember Al Katz and his work on analog linearization. The session will begin with recollections by his widow Sally. Amateur radio was an important factor in Al's becoming an engineer, so we will next present his accomplishments as a radio amateur. Al's work on linearization led to the formation and growth of the Linearizer Technology Company, which will be the next topic of discussion. The fourth segment provides an overview of analog linearization and the current state-of-the-art. Finally, members of the audience will be encouraged to give their recollections of Al Katz.

This session explores new approaches for sub-THz and THz signal generation, spanning diverse technologies and architectures. The first paper presents a 4–240GHz InP variable-gain amplifier employing an analog-controlled input attenuation network for versatile performance tuning. Next, a 4–420GHz distributed amplifier MMIC in 20nm InGaAs-on-Si HEMT technology achieves 11±2dB of gain. A 280GHz sub-harmonic injection-locked oscillator in 45nm CMOS PD SOI demonstrates robust frequency generation. Finally, a 300GHz-band single-balanced resistive mixer module in 60nm InP HEMT features LO leakage suppression. Collectively, these designs pave the way for next-generation THz communication systems.

This session brings together four papers showcasing sub-THz and THz signal modulation techniques for next-generation communication systems. The first paper introduces attenuator-based vector modulation strategies for phased arrays operating from 200 to 480GHz. The second paper demonstrates a novel photoconductive solid-state plasma evanescent-mode waveguide for sub-THz phase shifting. The third paper presents a compact 8.2mW complementary current-reusing D-band frequency quadrupler implemented in 22nm FDSOI CMOS. Finally, the fourth paper compares wideband low-power H-band frequency doublers, with and without driving stages, also in 22nm FDSOI CMOS, highlighting performance trade-offs. These advances significantly elevate future sub-THz communications.

Microwave plasma and its applications for protection against high power threads are discussed. New techniques and instruments for material sensing across a broad range from microwave to THz frequencies are presented. The session covers the EM characterization of atmospheric conditions, fluids, as well as conventional and 3D-printed substrates.

This session explores advances in leveraging AI/ML for RF/mm-wave/sub-THz circuit design, modeling, and optimization. The papers demonstrate synthesis of complex electromagnetic structures, mm-wave PA design and array optimization using AI/ML methods.