Field, Device and Circuit Tech.

Improved computational methods for the simulation of challenging electromagnetic structures are crucial for advances in key areas of microwave technology. This session presents several innovative computational methods to allow for improved modeling for various applications. Applications include accurate modeling of RF emission from printed circuit boards, a new fast method for analyzing problems with the volume integral equation, a fast method for analyzing arbitrary H-plane waveguide systems, and a new method for finding the mm-wave attenuation on printed circuit lines due to surface roughness.

This session introduces a variety of innovative modeling techniques that allow for the improved modeling of practical microwave structures as well as the modeling of new phenomena and effects, ranging from microwave to THz frequencies. This includes an improved analysis and optimization of magnet-less circulators, the efficient analysis of practical CuMax routing lines on a printed circuit board, analysis of plasma jet lines, using a physical based model for analyzing signal integrity on high-speed data links, and the modeling THz radiation produced by an electron beam in the vicinity of a grounded strip grating.

This session highlights innovative approaches in computational methods and optimization for circuit design. Topics include advanced CAD techniques for sensitivity analysis, efficient surrogate modeling for inverse design, cognitive methods for design optimization, knowledge-based modeling and novel methods for optimizing oscillator systems. These contributions demonstrate improvements to accuracy, efficiency, and design flexibility in RF and microwave circuits.

This joint IMS/ARFTG session addresses today's measurement needs and challenges brought about by higher operating frequencies and instantaneous bandwidths. The presentations include traceability of coaxial standards through D-band, the use of frequency extenders in mm-wave load pull, as well as enhancements in receivers and local oscillators used in measurements.

Higher frequencies, higher levels of integration and new measurement environments, including cryogenic, are driving changes to on-wafer measurement procedures and equipment. In this joint IMS/ARFTG session, we will review a number of new processes, techniques, and different equipment constructs to help meet these evolving requirements. Topics include on-wafer versions of comprehensive mm-wave mixer measurements, on-wafer power calibration techniques, multiport calibration methods, and ways of dealing with thermally extreme environments.