Field, Device and Circuit Tech.

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Vladimir Okhmatovski
Univ. of Manitoba
Werner Thiel
ANSYS, Inc.
Location
207
Abstract

Improved computational methods for the simulation of challenging electromagnetic structures are crucial for advances in key areas of microwave technology. This session presents several innovative computational methods to allow for improved modeling for various applications. Applications include accurate modeling of RF emission from printed circuit boards, a new fast method for analyzing problems with the volume integral equation, a fast method for analyzing arbitrary H-plane waveguide systems, and a new method for finding the mmW attenuation on printed circuit lines due to surface roughness.

We1D-1: KEYNOTE: AI Accelerating Scientific Understanding: Neural Operators for Learning on Function Spaces
Anima Anandkumar
California Institute of Technology
(08:00 - 08:20)
Abstract
We1D-2: Electromagnetic Emission Simulation of Radio-Frequency Circuits Using Direct Domain Decomposition Solver
Jiaqing Lu
Ohio State Univ.
(08:20 - 08:40)
Abstract
We1D-3: Towards Tensor-Train Solution of Vector Volume Integral Equation in 3D with $\log N $ Complexity
Chris Nguyen, Vladimir Okhmatovski
Univ. of Manitoba, Univ. of Manitoba
(08:40 - 09:00)
Abstract
We1D-4: Fusing Leontovich Boundary Conditions and Scalar 2D FEM to Compute Lid and Lateral Wall Losses in H-plane Waveguide Devices
Hui Jiang, Juan Córcoles, Jorge Ruiz-Cruz
Universidad Autonoma de Madrid, Univ. Politecnica de Madrid, Univ. Politecnica de Madrid
(09:00 - 09:20)
Abstract
We1D-5: A Finite Element Method to Model Transmission Lines with Various Rough Conductor Surfaces up to 110 GHz
Felix Sepaintner, Franz Roehrl, Georg Fischer, Werner Bogner, Stefan Zorn
Deggendorf Institute of Technology, Rohde & Schwarz GmbH & Co KG, Friedrich-Alexander-Univ. Erlangen-Nürnberg, Deggendorf Institute of Technology, Rohde & Schwarz GmbH & Co KG
(09:20 - 09:40)

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Oscar Quevedo-Teruel
KTH Royal Institute of Technology
Werner Thiel
ANSYS, Inc.
Location
207
Abstract

This session introduces a variety of innovative modeling techniques that allow for the improved modeling of practical microwave structures as well as the modeling of new phenomena and effects, ranging from microwave to THz frequencies. This includes an improved analysis and optimization of magnet-less circulators, the efficient analysis of practical CuMax routing lines on a printed circuit board, analysis of plasma jet lines, using a physical based model for analyzing signal integrity on high-speed data links, and the modeling THz radiation produced by an electron beam in the vicinity of a grounded strip grating.

We2D-1: KEYNOTE: Reverberation chambers as a new solution for wireless testing of highly integrated antenna systems
Anouk Hubrechsen
ANTENNEX
(10:10 - 10:30)
Abstract
We2D-2: Green's Function Analysis of Spatially Discrete Traveling-Wave Modulated (Parametric) Loop Networks
Amirhossein Babaee, Zachary Fritts, Steve Young, Anthony Grbic
Univ. of Michigan, Univ. of Michigan, Univ. of Michigan, Univ. of Michigan
(10:30 - 10:50)
Abstract
We2D-3: Equation-Based Solver for High-Performance SI CuMax Routing within Pin Fields
Yingcong Zhang, Xiao-Ding Cai, Kai Li, Yan Li, Dongxu Fu, Bidyut Sen, Guoan Wang
Univ. of South Carolina, Cisco Systems, Inc., Cisco Systems, Inc., Cisco Systems, Inc., Cisco Systems, Inc., Cisco Systems, Inc., Univ. of South Carolina
(10:50 - 11:10)
Abstract
We2D-4: A Power-Efficient Plasma Jet Line Enabled by Dielectric Anapole Resonator Technology
Muhammad Rizwan Akram, Abbas Semnani
Univ. of Toledo, Univ. of Toledo
(11:10 - 11:30)
Abstract
We2D-5: Mixed-Mode Distributed Physical-Based Model on OSFP Connector for Fast PAM-4 Channel Analysis and Pathfinding up to 212.5 Gbps
Yulin He, Kewei Song, Haonan Wu, Zetai Liu, Milton Feng
Univ. of Illinois at Urbana-Champaign, Univ. of Illinois at Urbana-Champaign, University of Illinois Urbana-Champaign, University of Illinois Urbana-Champaign, University of Illinois Urbana-Champaign
(11:30 - 11:40)
Abstract
We2D-6: THz Diffraction Radiation Analysis of Finite Graphene Strip Grating with Grounded Dielectric Substrate Excited by Electron Beam
Dariia Herasymova, Mstyslav Kaliberda, Sergey Pogarsky, Alexandr Biloshenko
Institute of Radio-Physics and Electronics of the, V.N.Karazin Kharkiv National University, V.N.Karazin Kharkiv National University, V.N.Karazin Kharkiv National University
(11:40 - 11:50)

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Marco Pirola
Politecnico di Torino
Erin Kiley
Massachusetts College of Liberal Arts
Location
207
Abstract

This session highlights innovative approaches in computational methods and optimization for circuit design. Topics include advanced CAD techniques for sensitivity analysis, efficient surrogate modeling for inverse design, cognitive methods for design optimization, knowledge-based modeling and novel methods for optimizing oscillator systems. These contributions demonstrate improvements to accuracy, efficiency, and design flexibility in RF and microwave circuits.

We3D-1: KEYNOTE: Computational Electromagnetics and a Facilitator of Microwave Creativity and Industrial Innovation
Malgorzata Celuch
QWED Sp. z o.o
(13:30 - 13:50)
Abstract
We3D-2: A Simple Closed-Form CAD Approach for Sensitivity Analysis and Optimization of Passive Networks against Load Variations
Chiara Ramella, Paolo Colantonio, Marco Pirola
Politecnico di Torino, Univ. of Rome Tor Vergata, Politecnico di Torino
(13:50 - 14:00)
Abstract
We3D-3: Frequency-Query Enhanced Electromagnetic Surrogate Modeling with Edge Anti-aliasing Pixelation for Bandpass Filter Inverse Design
Jingyun Bi, Xinyu ZHOU, Jing XIA, Shichang CHEN, Wing Shing Chan
Hong Kong Polytechnic Univ., Hong Kong Polytechnic Univ., Jiangsu University, Hangzhou Dianzi University, City Univ. of Hong Kong
(14:00 - 14:10)
Abstract
We3D-4: Cognitive Broyden-based Input Space Mapping for Design Optimization
Jose Rayas-Sanchez
ITESO - The Jesuit Univ. of Guadalajara
(14:10 - 14:30)
Abstract
We3D-5: Knowledge-based Extrapolation of Neural Network Model for Transistor Modeling
Jinyuan Cui, Lei Zhang, Humayun Kabir, Zhihao Zhao, Richard Sweeney, Qi-jun Zhang
Carleton Univ., NXP Semiconductors, NXP Semiconductors, NXP Semiconductors, NXP Semiconductors, Carleton Univ.
(14:30 - 14:50)
Abstract
We3D-6: Analysis of a Self-Injected Super-Regenerative Oscillator for Motion Sensing
Sergio Sancho, Mabel Ponton, Almudena Suarez
Universidad de Cantabria, Universidad de Cantabria, Universidad de Cantabria
(14:50 - 15:10)

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Gian Piero Gibiino
Univ. of Bologna
Narcus DaSilva
National Instruments
Location
208
Abstract

This joint IMS/ARFTG session addresses today’s measurement needs and challenges brought about by higher operating frequencies and instantaneous bandwidths. The presentations include traceability of coaxial standards through D-band, the use of frequency extenders in millimeter wave load pull, as well as enhancements in receivers and local oscillators used in measurements.

Abstract
Th2D-1: Traceable S-Parameter Measurements up to 165 GHz using 0.8 mm Coaxial Standards
Andreas Schramm, Frauke Gellersen, Florian Rausche, Karsten Kuhlmann
PTB, PTB, PTB, PTB
(10:10 - 10:30)
Abstract
Th2D-2: Millimeter-Wave Wideband Active Load-Pull System Using Vector Network Analyzer Frequency Extenders
Ahmed Ben Ayed, Slim Boumaiza
Univ. of Waterloo, Univ. of Waterloo
(10:30 - 10:50)
Abstract
Th2D-3: A Wideband Digital Compensation Model Based on Fast BandwidthSensing for Zero-IF Receiver
Jiaxuan Zhu, Jun Peng, Lei Liu, Xiaoling Qin, Tianyang Zhong, Yuchen Bian, Xinyu Wang, Fangzhou Yu, Min Xiong, Chenrui Liang
Univ. of Electronic Science and Technology of China, Univ. of Electronic Science and Technology of China, Ceyear, Ceyear, Univ. of Electronic Science and Technology of China, Univ. of Electronic Science and Technology of China, Univ. of Electronic Science and Technology of China, Univ. of Electronic Science and Technology of China, Univ. of Electronic Science and Technology of China, Univ. of Electronic Science and Technology of China
(10:50 - 11:10)
Abstract
Th2D-4: Cross-spectrum Phase Noise Measurements of $10^{-15}$-level Stability Photonic Microwave Oscillators
Michele Giunta, Benjamin Rauf, Sebastian Pucher, Simon Afrem, Wolfgang Wendler, Alexander Roth, Jonas Kornprobst, Stefan Peschl, Jonas Schulz, Jan Schorer, Marc Fischer, Ronald Holzwarth
Menlo Systems GmbH, Menlo systems GmbH, Menlo Systems GmbH, Menlo Systems GmbH, Rohde & Schwarz GmbH & Co KG, Rohde & Schwarz GmbH & Co KG, Rohde & Schwarz GmbH & Co KG, HENSOLDT Sensors GmbH, HENSOLDT Sensors GmbH, HENSOLDT Sensors GmbH, Menlo systems GmbH, Menlo Systems GmbH
(11:10 - 11:30)

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Shuhei Amakawa
Hiroshima Univ.
Jon Martens
Anritsu Co.
Location
208
Abstract

Higher frequencies, higher levels of integration and new measurement environments, including cryogenic, are driving changes to on-wafer measurement procedures and equipment. In this joint IMS/ARFTG session, we will review a number of new processes, techniques, and different equipment constructs to help meet these evolving requirements. Topics include on-wafer versions of comprehensive mm-wave mixer measurements, on-wafer power calibration techniques, multiport calibration methods, and ways of dealing with thermally extreme environments.

Th3D-1: KEYNOTE: Past, Present and Future Challenges of Testing RFIC Industry
Paulo Lamas, Gerardo Orozco, Markus Rullman
Emerson Test and Measurement, Emerson Test and Measurement, Emerson Test and Measurement
(13:30 - 13:50)
Abstract
Th3D-2: Integrated Solution for Linear and Non-Linear Single-Touchdown On-Wafer Characterization of D-Band Mixers
Patrick Umbach, Nico Riedmann, Fabian Thome, Martin Vossiek, Rüdiger Quay
Fraunhofer Institute for Applied Solid State Physics, Rohde & Schwarz GmbH & Co KG, Fraunhofer Institute for Applied Solid State Physics, Friedrich-Alexander-Univ. Erlangen-Nürnberg, Fraunhofer Institute for Applied Solid State Physics
(13:50 - 14:10)
Abstract
Th3D-3: Characterization Approaches to Reduce Process Variation Dependencies for On-Wafer Power Calibration Transfer Devices in Bi/CMOS Technologies
Zerui Gao, Carmine de Martino, Marco Pelk, Steffen Lehmann, Marco Spirito
Technische Universiteit Delft, Vertigo Technologies, Technische Universiteit Delft, GLOBALFOUNDRIES, Technische Universiteit Delft
(14:10 - 14:30)
Abstract
Th3D-4: Differential-Mode Characterization of Multi-Port Passives up to 170GHz Using Independent Single-Ended Two-Port Measurements
Remco Schalk, Maarten Lont, Thiago Hanna Both, Luuk Tiemeijer, Marios Neofytou, Georgi Radulov, Vojkan Vidojkovic, Kostas Doris
Eindhoven Univ. of Technology, NXP Semiconductors, NXP Semiconductors, NXP Semiconductors, NXP Semiconductors, Eindhoven Univ. of Technology, Eindhoven Univ. of Technology, NXP Semiconductors
(14:30 - 14:50)
Abstract
Th3D-5: Cryogenic microwave probe technology with high thermal insulation
Tomonori Arakawa, Junta Igarashi, Shota Norimoto, Noriyoshi Hashimoto, Makoto Minohara, Nobu-hisa Kaneko, Hiroyuki Kayano
National Institute of Advanced Industrial Science and Technology (AIST), National Institute of Advanced Industrial Science and Technology (AIST), National Institute of Advanced Industrial Science and Technology (AIST), National Institute of Advanced Industrial Science and Technology (AIST), National Institute of Advanced Industrial Science and Technology (AIST), National Institute of Advanced Industrial Science and Technology (AIST), National Institute of Advanced Industrial Science and Technology (AIST)
(14:50 - 15:00)