Passive Components

In this session you will see the latest advances in non-planar passive components in several technologies, including power dividers and combiners, frequency selective surfaces and sensors.

In this session, we will discuss the recent advances in microwave devices using magnetostatic, ferroelectric, and phase-change materials. The innovation in tunable and reconfigurable devices, enabled by advanced design, microfabrication, and measurement technologies, will be presented. The comprehensive discussion encompasses a spectrum of applications, including wideband switches, acoustic switches, temperature-compensated magnetostatic resonators, and tunable microwave filters. Join us to unravel the intricacies of these cutting-edge devices and witness how they are reshaping the landscape of microwave engineering with their diverse functionalities and applications in modern communication systems.

This session provides a glimpse into the design of advanced non-planar filters. The content includes innovative techniques for the design of low-loss miniaturized filters, new multi-functional components such as filtering power dividers and combiners, novel implementation of ridge waveguide filters with transmission zeros, and high-power filters for space applications.

This session highlights cutting-edge developments in microwave acoustics through papers on a highly selective Band-5 SAW filter, a 23.8GHz acoustic filter in lithium niobate, a fin-mounted A5-mode lithium niobate resonator at 27GHz, a 56GHz trilayer AlN/ScAlN/AlN FBAR, and an experimental study of a cryogenic lithium niobate resonator. These contributions showcase innovative designs and experimental investigations, pushing the boundaries of microwave acoustics.

This session focuses on advanced synthesis techniques for filters and multiplexers. Content includes techniques utilizing non-resonating nodes in the synthesis, extraction of diplexer parameters, synthesis of spatial filters, synthesis of frequency dependent coupling filters, and antenna-loaded filters.

In this session, recent advances and achievements at DARPA on 3D heterogeneous integration (3DHI) and multiport passive components operating from RF/Microwave to mm-wave range will be presented, resulting in wideband performance and compact size.

This session presents the latest advances in reconfigurable filters and passive devices. The reconfigurable filters presented include a paper on a multi-functional bandpass filter that provides tunable attenuator and reflectionless phase shifter functionalities, and a liquid-metal-based filter with reconfigurable phase shifting properties. The session then transitions into passive devices, which include different ways to realize reconfigurable loads for phase shifters and a reconfigurable 90nm GaAs MMIC quadrature coupler operating in the 17.3–21.2GHz frequency range.

This session will cover numerous novel microwave packaging structures and applications up to sub-THz. The session will discuss a low-loss die-embedded 140GHz InP power amplifier and an integrated radar transceiver for 61GHz applications. Another paper will introduce two feeding methodologies for a flip-chip QFN package mm-wave slot bowtie antenna up to 220GHz. The session will close with a paper discussing embedded printed ring resonators for temperature sensing applications.

In this session, we report exciting progress on integrated passive devices in GaN and Si technologies. For example, a novel high-power limiter based on GaN Schottky barrier diodes demonstrates a record 39ns recovery time at 100W. Two new GaN digital step attenuators exhibit an ultrawide bandwidth of 40–220GHz. Meanwhile, a V-band voltage-controlled distributed attenuator based on 65nm CMOS technology achieves an attenuation range higher than 1000dB/mm² for the first time. Finally, a new electrically balanced duplexer based on a tunable passive auto-transformer in the 65nm CMOS technology demonstrates 30dB isolation at 60GHz with a 19GHz bandwidth.

This session will discuss recent advances in additive manufacturing for RF and mm-wave applications. Presented topics will include 3D components and modules as well as novel material integration and 3D printing techniques as well as models for roughness prediction of additive manufacturing techniques.

Couplers are one of the most important microwave passive components and thus are ubiquitous in balanced amplifiers, mixers, and beam-forming networks for antenna arrays. This session presents the recent advances in design methodologies for state-of-the-art couplers. Initially, novel design platforms including substrate- or metal-integrated suspended lines will be presented to reduce the dielectric and conductor losses in couplers. Next, investigations into architectures including multi-section transformers will be discussed to widen the coupler bandwidths. Finally, industrial coupler prototypes utilizing the InP HEMT MMIC process for highly-integrated chipsets will be presented. Together, these papers aim to build an ecosystem of next-generation couplers with attractive performance such as low loss and wide bandwidth.

This session will present recent advances in planar filter design. Specifically it will cover novel design methodologies for balanced filters, multi-functional filters and substrate-integrated lumped-element filters. New modeling techniques for non-reciprocal filters will also be presented.

This session focuses on innovative approaches to the implementation of practical circuits which include non-magnetic circulators, modulators, switches, mixers, and multiplexers.