Passive Components

This session will provide an overview of new developments in planar filters with multi-functional capabilities and miniaturized footprint. It will cover concepts allowing to incorporate the co-designed functionality of attenuation, cross over and reflection cancellation. Miniaturization techniques leading to self-packaged filters will also be discussed.

This session provides a deep dive into the design of advanced non-planar filters. The content includes innovative dielectric resonator diplexer designs, novel design concepts that help improve filter selectivity, advanced practices in miniaturizing filter size, and novel technologies for filter realization.

This session will cover new synthesis and RF design techniques to effectively realize advanced transfer functions. Design techniques allowing the prediction of the filtering transfer function from RF measurements will also be presented. Novel design techniques for compact mm-wave RF filters will be discussed.

In this session you will see the latest advances in passive components realized in non-planar technologies. The papers discuss advanced designs such as power dividers and combiners, combiners with filtering functions, antennas with integrated functionality, rotary joints and waveguide loads.

In this session, we report exciting advances in integrated passive devices mainly for CMOS and SOI technologies. For example, two SOI RF switches with a series triple-coupled transformer topology demonstrate suitability for compact mm-wave systems, with IP3 levels exceeding 81.5dBm. An SOI digital step attenuator features an ultrawide bandwidth of DC to 51GHz, sub-5dB insertion loss, and a 3.1° RMS phase error. A 10–17GHz continuously tunable CMOS bandpass filter, leveraging mode-switching inductors and Q-enhancement techniques, achieves a broad tuning range and enhanced selectivity. Finally, an ultra-compact D-band Substrate-Integrated-Waveguide (SIW) filter shows the potential of SIW filters for on-chip mm-wave circuit integration.

This session introduces numerous advanced mm-wave in-package radiating and waveguiding structures at frequencies up to G-band.

This session will present the latest advances in switching technologies for innovative RF and mm-wave circuits. The session will highlight ultra low-loss MEMS switches for high-speed communication systems, wideband CMOS integrated PCM devices. The session will cover BST and PCM based variable capacitors, with super high dynamic range and high-Q. New sub-THz waveguide integrated switches with optical control will also be presented, along with piezoelectric material based modulators.

Radio and mm-wave integration and packaging is emerging as an enabling technology for commercial and defense applications. In this session, we highlight different transmission-line based components and system including SIW technologies for compact phase shifters, couplers, and integration of active and passive elements. Integrated wideband waveguide crossovers for high power routing is presented. Miniaturized wafer-scale hybrid couplers are implemented in two different technologies.

This session introduces multiple state-of-the-art technologies for packaging and integration up to sub-THz frequency bands. Specifically the papers to be presented will cover novel low-loss shielded interconnects for D-band/sub-THz applications, 3D heterogeneous integrated RF glass-interposer system-in-package architectures, novel waveguide launcher in interposer package technologies for automotive imaging radars, highly scalable RF dielets embedded in glass interposer and thin film transmission lines on low-k polymer films.

This session highlights recent innovations in acoustic wave technologies for next-generation communication systems. It covers the design of low-loss SAW filters with wide bandwidths for Wi-Fi 7, as well as frequency and bandwidth optimization of mm-wave thin-film lithium niobate acoustic filters. Additionally, the session introduces miniature, high-coupling resonators based on lithium niobate thin films operating in the 10–30GHz range. The final presentation focuses on a 36GHz periodically poled FBAR with a trilayer piezoelectric material structure, offering promising applications in high-performance frequency devices. These advances demonstrate significant potential for future wireless technologies.

Different approaches for the design of advanced phase-shifting components with co-designed RF functionalities are presented, including quasi-circulator operation, bandpass filtering, and tunable attenuation. Implementations of these RF components in various technologies, such as planar, CMOS, and substrate integrated waveguide with liquid crystal are shown.

This session reports the latest advances in 3D-printing and additive manufacturing of microwave and mm-wave filters, attenuators, interconnects, and transmitters.

This session presents the latest advances in reconfigurable filtering devices. The reconfigurable devices include a multi-throw filtering switch, tunable filters, and an electrical balance duplexer for simultaneous transmit and receive architectures. The tunable filters include a dual-band coaxial filter and a tunable filter using Yttrium Iron Garnet to achieve 8–32GHz frequency tuning.