Tuesday, 18 June 2024
16:00-17:00
MicroApps Theater, Booth 2159
This panel of RF/microwave device and system company executives will discuss current trends in semiconductor technology and how they affect system design and performance. New types of compound semiconductor technology, AI integration, heterogeneous integration, chiplets, 3D packaging, new thermal materials and other related topics will be discussed including how these advancements affect system architecture and improve SWaP-C.
Moderator:
Sanjay Raman, Dean of Engineering, University of Massachusetts Amherst
Panelists:
Nick Kolias, Principal Engineering Fellow, Raytheon
Tim Lee, Technical Fellow, Boeing
Bryan Goldstein, President, Analog Devices Federal, Vice President, Aerospace and Defense Group, Analog Devices
Tom Kole, Vice President of Sales and Marketing, Integra Technologies
Dean White, Director- Defense and Aerospace Market Strategy, Qorvo
Sponsored By:
