Nikita Mahjabeen, Senior RF Package Design Engineer, NXP Semiconductors
I AM here to help, connect, collaborate and learn.
What made you work in this industry?
As a child, I was fascinated by how invisible electromagnetic waves could connect astronauts in space with people on Earth. Discovering that the same technology powers everything from autonomous vehicles and robotics to smartphones inspired me to pursue RF engineering. Today, I work in the semiconductor industry, advancing wireless innovation through advanced packaging and heterogeneous integration to help shape the future of how people and devices connect.
What is your favorite part of the job?
My favorite part of the job is solving complex technical problems where curiosity meets innovation. I enjoy exploring new ideas, pushing the limits of what is possible, and collaborating with talented people from different disciplines. The most rewarding part is seeing those ideas evolve into patents, real products and technologies that make everyday life better.
What are you most excited about IMS2027?
I am most excited about reconnecting with the IMS family, a community that comes together each year to share knowledge, ideas, and a passion for innovation. I look forward to learning from experts, exploring the latest industry trends, and building new connections. As the Bootcamp Chair, I am especially excited to help deliver a rewarding and inspiring experience for the audience.