Niterra North America,Inc.

Niterra North America - NTK Package Solutions, we build advanced robust integrated circuit and semiconductor packages for complex applications. With global service centers, we offer a wide range of packaging materials and package design services for Medical, Automotive, SiP/MCM, Opto, RF, CMOS Image Sensors, Hi-Rel, Satellite, FCBGA, FCCSP, FPGA, CPU and MPU applications. Monolithic package designs for Medical and Mobile applications. Optimum package designs for 10G, 40G, and 100/400G. Ceramic substrates can be scaled and configured with narrow pitches and a wide range of pin count capabilities. Large and small scale Ceramic STFs are manufactured for high-speed/high density probe-cards for semiconductor wafer test. NTK supports fast paced product cycle times with our advanced design and production flows featuring high precision processes for fast turn-around with the highest quality.