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Sun 15 Jun | 08:00 - 17:20
305/309
Addressing Challenges in the Design and Characterization of Circuits for THz Communications and Sensing
Xiaobang Shang, Jeffrey Hesler
NPL, Virginia Diodes
This workshop provides an opportunity for presenters to share their work in addressing the challenges of unlocking the potential of the THz spectrum for future wireless communications and radar sensing applications. The presenters come from diverse backgrounds — including instrumentation manufacturing, metrology institutes, industry, and academia — offering a wide range of perspectives. Topics covered in this workshop include THz electronics, novel integration approaches for THz systems, interconnections and packaging technologies, photonics-based THz generation for communications, on-chip and waveguide antennas, design and characterization of high electron mobility transistors, and recent advances in testing and measurements up to 1THz and beyond.
08:00 - 17:20
WSK-1 THz Integrated Circuits Beyond 500GHz: Challenges and Opportunities
Jae-Sung Rieh
Korea Univ.
08:00 - 17:20
WSK-2 Substrateless Platform: A Promising Route to THz Integration
Withawat Withayachumnankul
Univ. of Adelaide
08:00 - 17:20
WSK-3 THz Semiconductor Electronics
Theodore Reck, Jan Stake
Vadiodes, Chalmers Univ. of Technology
08:00 - 17:20
WSK-4 THz Electronics for Sensing and Communication Applications
Yi-Fan (Ricky) Tseng
National Taiwan Univ.
08:00 - 17:20
WSK-5 Antennas and Packaging for a Sub-THz Wireless Point-to-Multipoint Link
Akanksha Bhutani
KIT
08:00 - 17:20
WSK-6 Characterization and Modeling of HEMTs Beyond 110GHz
Chong Li
Univ. of Glasgow
08:00 - 17:20
WSK-7 Trends in mm-Wave and THz Test Equipment
Jeffrey Hesler
Virginia Diodes
08:00 - 17:20
WSK-8 Non-Contact On-Wafer Probing for mm-Wave and THz Metrology
Kubilay Sertel
The Ohio State University
08:00 - 17:20
WSK-9 On-Wafer Measurement of Planar Circuits at mm-Wave and Sub-THz Frequencies
Xiaobang Shang
NPL