IMS2026 Schedule

Abstract:<br />
Advancements in instrumentation and metrology over the past decade have been extraordinary, blurring the boundaries between measurement domains. We rely on these tools as windows into reality, yet the increasing complexity of measurement setups, abstraction of instrument functions, and limited user experience (often) result in erroneous characterizations. Faulty measurements not only risk reputational damage within the scientific community but can also lead to costly failures, potentially causing millions of dollars in losses during productization. This lecture celebrates the ingenuity of modern test equipment while also highlighting their limitations and the challenges of accurate DUT characterization.<br />
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Biography:<br />
Shahriar Shahramian (SM ’06) received his Ph.D. degree from University of Toronto in 2010 where he focused on the design of mm-wave data converters and transceivers. Shahriar has been with the Bell Laboratories – Nokia since 2009 and is currently the Lab Leader (Director) of the RFIC & Packaging Research Lab. His research focus includes the design of mm-wave wireless and wireline integrated circuits and systems. Shahriar is a Bell Labs Fellow and leads the design and architecture of several state-of-the-art ASICs for optical coherent and wireless backhaul products. Shahriar has served as the chair mm-Wave & THz subcommittee of IEEE BCICTS & mm-Wave SoCs at IEEE RFIC and member of the technical program committee IEEE ISSCC. He has also served as the guest Editor of the IEEE Journal of Solid-State Circuits (JSSC).
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Shahriar has been the recipient of Ontario Graduate Scholarship & University of Toronto Fellowship, and the best paper award at the CSICS & Symposium in 2005, 2015 and RFIC Symposium in 2015, 2020, 2022 and ISSCC& in 2018. Shahriar is also the recipient of the IEEE MTT Young Engineer Award in 2020. He holds an Adjunct Associate Professor position at Columbia University, has received several teaching awards and is the founder and host of The Signal Path educational video series. Shahriar has also presented short courses and workshops at the IEEE CSICS, BCTM, BCICTS, RFIC/IMS and ISSCC conferences.

This session focuses on advances in mm-wave and RF digital transmitter and power amplification (PA) technologies, showcasing innovative designs across various CMOS nodes. The papers enhance system-level performance and integration for modern communication systems. The first paper introduces a mm-wave transmitter using a digital-to-phase converter (DPC) in 28nm CMOS. The second presents a mm-wave digital Cartesian transmitter with impedance-compensated RFDACs in 40nm CMOS. The third explores an RF digital PA with dynamic range pulse modulation in 22nm FD-SOI. The fourth introduces a UWB all-digital transmitter with hybrid FIR filtering in 28nm CMOS. The final paper presents a bits-to-RF digital transmitter with time-interleaved multi-subharmonic-switching DPAs in 65nm CMOS.

Low Earth Orbit (LEO) satellites are unlocking new possibilities for high-speed communication systems, enabling commercial, multi-user, non-terrestrial networks. Phased arrays operating up to the mm-wave range, with high power efficiency and circuit reutilization, form the foundation of these emerging systems, ensuring both extended range and high network capacity. Advances in antenna interface flexibility, including support for various polarizations, further enhance performance. This session features four papers showcasing the latest developments in circuits, transceivers, and antenna integration solutions for large arrays.

This session presents mm-wave advances in transceivers, filtering, and heterogeneous integration. Advances include mm-wave frequency N path filtering using phase shifting in the signal path, a transceiver overcoming leakage and flicker noise for short range radar, heterogeneous integration of InP and CMOS for high linearity amplification and support circuits, and D-band radio-on-glass utilizing glass interposer for increased performance.

This session presents five high performance power amplifiers and front-end modules. The first three papers demonstrate the latest developments in GaAs power amplifiers and FEMs for the next generation 6G applications. The next two papers focus on the innovation of power amplifiers using FD-SOI technology for WiFi 6 and 5G FR-2.

This session presents recent advances in voltage-controlled oscillator (VCO) design, covering innovations across sub-THz, mm-wave, and microwave frequency bands. The first paper introduces a 60GHz coupled standing-wave-oscillator LO distribution network, enabling a 240GHz 2D phased array with area efficiency and robust performance. The second paper discusses a compact 190GHz push-push Colpitts VCO in 130nm BiCMOS, demonstrating high DC-to-RF efficiency and substantial output power. The third paper explores an image-reused phase-tuning quadrature VCO (QVCO), achieving a high figure-of-merit (FoM) through an innovative tuning technique at mm-wave frequencies. Finally, a 13.8–16.2GHz series-tank-assisted transformer-based oscillator is presented, offering excellent supply pushing characteristics and a competitive phase noise profile. These contributions highlight key innovations in VCO design across a wide range of frequencies, supporting advances in next-generation communication, radar, and sensing applications.

This session explores key mm-wave building blocks and components. The first paper presents a 28–40GHz phase shifter in 65nm CMOS, achieving less than 0.4° RMS phase error, <0.31dB RMS gain error, and a 31.5dB gain tuning range. The second paper introduces a V-band FMCW transmitter featuring an impedance-invariant voltage gain amplifier phase shifter, also in 65nm CMOS. The third paper showcases a 25–32GHz frequency doubler with up to 32% efficiency and >39dBc harmonic rejection, while the fourth paper reports a compact 24–31GHz complex impedance sensor — both implemented in 22nm FD-SOI. The session concludes with a C–X-band Wilkinson power divider/combiner utilizing a folded two-section mechanism in 65nm bulk CMOS.

Large corporations are investing billions of dollars building thousands of LEO satellites to offer broadband internet services to rural and under-developed areas. In addition, many countries are jumping onto this wagon to secure their own access to the internet as part of a national security policy. On the other hand, the high satellite launch cost, hardware cost, and high monthly subscription fees do not seem to fit the objective of providing broadband access to the general earth population, many of whom are living in poverty. Come join the panel and find out if this is expensive space junk or a revolution in broadband internet access.

This session demonstrates frequency generation in advanced FinFET CMOS and SiGe BiCMOS technologies. The first two papers present fractional-N PLLs from 13.5GHz to 23GHz in 5nm and 8nm FinFET technologies respectively. The third paper presents a distributed power-combining frequency doubler for H-band frequencies in SiGe BiCMOS. The session concludes with a circuit-under-inductor demonstration for VCOs and PAs in 6nm and 16nm technologies respectively.

The mm-wave frontier continues to advance across mainstream Si and III-V-based circuits, achieving excellent performance with enhanced functionality. This session presents a diverse set of circuits and front-ends that push the boundaries of bi-directionality, bandwidth, linearity, and sensitivity. The first paper introduces a GaAs pHEMT low-noise amplifier (LNA) with a sub-3dB noise figure (NF) and wideband operation. The second paper features a 28nm CMOS dual-band LNA designed for 5G applications, offering low power consumption and NF. Next, a 40nm CMOS V-band wideband absorptive receiver with enhanced out-of-band linearity for 5G is presented. The session concludes with a 65nm CMOS bi-directional beamforming front-end, leveraging distributed impedance reshaping.

This session will cover the latest developments on high-speed ADCs, introducing time-interleaving, mismatch calibration and spur mitigation techniques. Machine learning circuits are also discussed for ADC calibration. Finally, the session closes on an ADC integrating mixed-signal multiplication stage for beamforming applications.

This session presents five papers on transmitters operating beyond 100GHz. The first paper introduces a direct-digital transmitter in the D-band using RF-DACs for RF-domain modulation. The second and third papers explore an oversampling four-channel digital-to-phase transmitter and a reconfigurable quadrature second-harmonic modulator in the D-band. The fourth paper presents a 200GHz doubler-last phased array transmitter in SiGe technology. Finally, the session concludes with an amplifier-last transmitter operating from 270 to 300GHz in a 130nm SiGe BiCMOS process.

In this session, RF/mm-wave low-noise amplifiers (LNAs) and front-end modules (FEMs) are presented. Different design techniques to achieve high circuit performance in terms of wide bandwidth, low noise, high output power, and superior PAE are proposed. For the first paper, a 23–40GHz LNA with a dual-path noise-cancelling technique is demonstrated. The second paper is an LNA operating at V and E frequency bands with a three-line coupler to provide wide-band noise and power matching. The third paper presents a sub-10GHz RF front-end module composed of a digital PA with a 4-way balanced power combining network and an LNA with a dual-resonant input matching approach. For the fourth paper, a wideband bidirectional switchless PA-LNA with 8-shaped transformers for W frequency bands is proposed. The final paper is a 24–30GHz GaN-on-SiC FEM with a 37.1dBm output power and 34.4% PAE.

This session showcases the latest advances in energy-efficient and high-linearity IoT RFIC design. The first paper presents a backscatter communication IC achieving high modulation order and strong sideband suppression. The session then features a next-generation 5G wake-up receiver leveraging multi-carrier OOK modulation for low-power and high-sensitivity IoT applications, followed by a harmonic-suppressing low-power receiver design. A novel scaling-friendly time-domain technique is introduced to enhance the linearity of an energy-efficient receiver. Finally, a fully integrated galvanic isolator achieves low power for asynchronous full-duplex communication.

This technical session explores the evolving demands of next-generation communication, radar, imaging, and SATCOM applications. The session will address the challenges for achieving high output power, efficiency, linearity, bandwidth, and robust performance. The first paper presents a 10–40GHz stacked push-pull PA that enhances both bandwidth and linearity through the harmonic superposition of drain-source waveforms. The second paper focuses on a V-band PA featuring a dual-mode slotline-based series-parallel combiner. The third paper introduces a D-band Doherty PA incorporating a Guanella transformer and adaptive bias. The fourth paper presents a process robust K-band balanced PA with a current-mode adaptive bias circuit. The final paper demonstrates a 5G phased-array TX with load compensating Doherty PA.

This session consists of five papers on advanced techniques for high-performance oscillators operating at RF frequencies. The first paper introduces an inverse-class-F VCO utilizing a distributed dual-mode resonator (DMR) instead of a transformer-based tank, enhancing high-Q performance at both fundamental and second harmonic frequencies while suppressing noise conversion and minimizing detrimental third harmonic components. The second paper introduces a quad-core quad-mode VCO utilizing a pure magnetic-coupling technique and a fully symmetrical topology, featuring a centrosymmetric transformer with four coupled inductors and an embedded switched inductor to enable quad-mode operation without frequency tuning range degradation. The third paper presents a series resonance oscillator with bidirectional inductive-mode pulling, enabling ultra-low phase noise and wide tuning range by optimizing mode-switching connections, introducing a balanced-slope NMOS inverter for ripple minimization, and ensuring reliable frequency expansion without added parasitic effects. The fourth paper introduces a coupling-canceling common-mode resonance expansion technique using a tail 8-shaped inductor and staggered tap inductors to enhance wideband common-mode impedance, effectively reducing flicker phase noise without requiring manual tuning. The last paper introduces a multi-tap transformer-based quad-core dual-mode VCO that leverages enhanced electromagnetic mixed-coupling and harmonic-free-like techniques to achieve wideband flicker noise suppression while employing orthogonally stacked dual-core transformers and mode switches to enable a wide frequency tuning range.

This session starts with a low-power analog-mixed-signal machine-learning classifier for wireless signals. This is followed by a fast beam-forming system and a silicon-photonic driver. Finally, a UWB SoC for next-generation ranging and a biomedical sensor are presented.

This session covers recent developments, advanced design techniques, and methodologies in high performance RF and mm-wave SiGe PAs. The first paper introduces a new design methodology for algorithmic inverse design and optimization of multi-stage power-combined mm-wave PAs. The second paper demonstrates the first silicon-based PA providing multiple watts of power at Ka-band. The next paper is a 17–30GHz SiGe common-collector common-base PA with enhanced large-signal stability for SATCOM application. The fourth paper presents an efficient Q-band balanced PA designed using a two-tone load-pull optimization technique. The last paper demonstrates a compact, reconfigurable dual-band 5/6GHz SiGe PA for Wi-Fi 6E application.

This session presents integrated systems and techniques introducing breakthroughs in energy efficiency, accuracy and sensitivity of mm-wave radars and sensors. This includes precision sub-THz near field sensors, an interference cancellation technique for FMCW radars, and an energy-efficient phase-modulated radar SoC for joint radar and communication applications.

Heterogeneous integration is one of the most interesting technology areas that is quickly finding its place in RF and mm-wave applications. This session consists of four papers describing circuits and systems implemented by integrating chips fabricated in different semiconductor technologies into one solution platform. The fifth paper describes a single source impedance thermal noise measurement technique. The session starts with the presentation of a heterogeneously integrated power amplifier module using BiCMOS and RF SOI CMOS chips. The second paper presents integration of GaN circulator with RF SOI voltage boosted clock generation IC. The next paper describes a GaN amplifier embedded in a glass substrate. The fourth paper presents the 3D-integration platform for scaled GaN-on-Si dielets with Intel 16 Si CMOS. The final paper described a formalism for determining thermal noise parameters for MOSFET transistors that requires only single source impedance measurements.

The past few years have arguably seen a decrease in transformational or disruptive discoveries reported in radio-frequency integrated circuits (RFIC) papers and publications. Does this indicate that RFIC design has reached its maturity, or does it instead suggest a shift of innovations in emerging areas across the boundary of RFIC design, such as the heterogeneous integration of silicon, antennas, and processors using advanced packaging? If so, what should our community look for in publications and what would be considered “publishable work”? Are universities and research institutions addressing the most compelling challenges? And what has been the role of the funding agencies in promoting fundamental research? Our panel of experts, with the audience’s participation, will attempt to answer these questions and diagnose the trends seen in RFIC publications and in the field in general.

This session covers high performance PLL and frequency multiplier techniques. The first paper presents a high performance D-band double-sampling PLL with 35.1fs jitter. The second paper demonstrates a THz synthesizer using 85GHz CP-PLL and frequency quadrupler with optimal impedance matching technique. The session also includes a digital background calibration LMS technique for a robust wide-band frequency tripler. The fourth paper presents an injection locked frequency tripler with an amplitude detection method to enhance frequency tracking. Lastly, a compact W-band differential doubler is presented with high conversion gain and >36dBc fundamental rejection ratio.

The focus of this session is to introduce innovative D-band circuits and systems in the sensing and communication domains. We start with a 129–148GHz radar transceiver achieving broadband performance through the TL-MCR concept followed by a 169GHz sparse chirp-stitched radar system in 40nm CMOS with an impressive range resolution of 1mm. The third paper is a >27% tuning range sub-sampling PLL in 28nm CMOS. A novel switching mechanism for BPSK modulation for backscattering application is reported in the fourth paper. We close the session with a D-band TRX chipset with >40dB IRR and very low-loss 4-way power combiner built using a novel enhanced magnetic coupling cavity with transmission line (EMCC-TL).

High-speed circuits are essential to the efficient control and driving of upcoming photonic and quantum systems. This session features a diverse set of papers for such applications. The first paper covers a widely reconfigurable temperature-scalable cryogenic PLL. The second paper covers a low-power correlator targeting communications and compute-in-memory applications. Papers 3 and 4 cover ultra-high-speed drivers for photonic transceivers, designed in FD-SOI CMOS and SiGe BiCMOS respectively. The final paper covers a set of integrated circuits designed in GaAs as an oscilloscope front-end system.

This session presents circuit techniques for radars and phased arrays, achieving good energy and area efficiency, wider bandwidth with improved detection range and resolution. A 1TX/4RX FMCW radar chipset exploits multi-band to achieve an angular resolution of 6deg. Baseband techniques are then presented, achieving 800MHz signal bandwidth for phase array and 7.5cm resolution for PMCW with good area and energy efficiency. Finally, two radars for vital-sign detection, with multi-mode IR-UWB radar achieving detection range up to 10m, and another combined FMCW and Doppler radar work with shared building blocks, achieving small chirp frequency error of 0.04%.

In this session, the generation of D-band signals using a tripler with adaptive biasing and a regenerative frequency shifter will be presented. For interfacing transmitter and receiver elements to a single antenna, the session will include a presentation on an integrated quasi circulator, based on a coupled-line coupler with tunable termination. The session will also present a compact PA for phased arrays to enable scaling of half-wavelength spaced array elements as well as a wideband PA that provides full D-band coverage by utilizing coupled-line-based matching networks.

This session explores cutting-edge techniques for designing high-performance receiver front-ends, focusing on achieving superior sensitivity, linearity, and blocker rejection while minimizing power consumption. The presented papers delve into novel architectures and circuit techniques, including passive filtering, mixer-first topologies, active feedback, and capacitive stacking, pushing the boundaries of receiver performance across various frequency bands.

The field of quantum computing relies heavily on the advancements in microwave technology. However, a gap exists between the microwave engineering community and the quantum research effort. To bridge this divide and propel the quantum industry forward, it is crucial to cultivate a new generation of engineers proficient in
both microwave engineering and quantum physics. These multidisciplinary experts will be essential in driving innovation in quantum sensing, communication, and the control of quantum computing platforms, particularly those based on superconducting qubits. Initiatives like the Quantum Boot Camp aim to address this need
by providing microwave engineers with foundational knowledge in quantum engineering, emphasizing the design, fabrication, control, and measurement of quantum systems. By equipping engineers with this expertise, the program seeks to empower them to contribute meaningfully to this rapidly evolving technological landscape. The program caters to a diverse audience, including recent graduates, career changers, and marketing professionals, all seeking to deepen their understanding of quantum technology and its practical implications.

Distributed Amplifier (DA) architectures have long been valued for their ability to deliver exceptionally wide bandwidths. In recent years, new design strategies and circuit techniques in various technologies have dramatically expanded their potential in applications ranging from high-speed optical and wireless communication to defense, instrumentation, radar, and sensing. This workshop will provide a comprehensive overview of recent research and development in distributed amplifiers, focusing on performance improvements across bandwidth, output power, linearity, noise, and efficiency enhancement. Emphasis will be given to implementations across multiple technology platforms including CMOS, SiGe BiCMOS, GaN, and InP technologies, highlighting the unique opportunities and challenges in each domain.

The ever-increasing demand for higher network capacity, and the volume of different devices that need connectivity, require innovative solutions. In mobile applications, this demand is addressed in 5G and 6G networks by using microwave links with massive Multiple-Input Multiple-Output (MIMO) antenna arrays to support high data-rate connectivity between large number of devices with improved coverage. However, the capacity is still limited by the available RF spectrum. Radio-over-fiber (RoF) systems combined with MIMO technology offer a flexible and powerful solution for extending the reach and improving the performance of wireless networks. In data center application, the hybrid opto-electrical links presents numerous advantages over single technology solutions. Energy efficiency, higher throughput, scalability and cost can be optimized by proper convergence of the two technologies. In this workshop, experts from industry and academia will discuss the latest developments in the convergence of the opto-electrical technology as applied to mobile networks and data center connectivity.

This bootcamp will present the basics of AI/machine learning (ML) and their applications to microwave engineering. It is intended for engineers who want to learn the basics of AI/ML or are interested in using AI/ML for microwave applications, marketing and sales professionals who are interested in understanding the basics and relevance of AI/ML for microwaves, professionals with AI/ML expertise seeking to explore potential applications to MHz-to-THz technologies, and university students who like to acquire the basic knowledge of AI/ML.
To this end, the bootcamp includes introductory presentations on the fundamentals of AI/ML, covering supervised, unsupervised and reinforcement learning. Moreover, we will introduce common types of neural networks such as fully connected artificial neural networks (ANNs), convolutional neural networks (CNNs), recurrent neural networks (RNNs), long-short term memory networks (LSTMs), generative adversarial networks (GANs). We will discuss their function, training cost, relative advantages and limitations, as well as their suitability to various applications. We will also introduce concepts such as generalizability (i.e. the accuracy of neural networks to cases outside their training set) and overfitting (when the network learns training data well, but fails to generalize to new cases).
Examples of applications of AI/ML to microwave engineering to be presented include: electromagnetic modeling and optimization, microwave filter modeling/design, GaN HEMT modeling, Doppler radar based human motion recognition, gesture recognition and object identification, radio coverage prediction and design optimization of reconfigurable intelligent surfaces.
The course will provide ample opportunities for audience interaction and Q&A.

This workshop will present recent breakthroughs in the design of Voltage Controlled Oscillators (VCOs) and frequency multipliers, with a focus on innovations spanning the microwave, mm-wave, and sub-THz frequency bands. As these components are critical enablers in emerging communication, radar, and sensing systems, the workshop will cover both theoretical insights and practical design strategies that push the boundaries of performance, integration, and power efficiency. Bringing together leading experts from both academia and industry, the sessions will highlight state-of-the-art circuit techniques, emerging device technologies, and system-level considerations. Presentations will explore various aspects of VCO and frequency multiplier design, aiming to achieve low noise, wide tuning range, and high efficiency. The workshop will also address key challenges in scaling designs to higher frequencies and more compact integration.

The workshop takes a deep dive into systems and circuits at the forefront of the next generation wireless technology for commercial and defense applications. Bringing together leading experts from both academia and industry, the talks will highlight trade-offs in MIMO systems that motivate the use of analog, digital and hybrid beamforming with a focus on parameters like coverage, spectral and energy efficiency, bandwidth and throughput. Emerging device technologies, state-of-the-art design techniques for RF, analog and digital circuits, advanced packaging integration and thermal management will also be presented, providing a comprehensive view of the direction in which wireless systems are heading.

Generative AI and Large Language Models (LLMs) are beginning to change how electromagnetic and RF systems are specified, synthesized, and verified. Although these tools are common in software and data science, their use in microwave engineering is nascent and requires careful, physics-aware evaluation. This full-day workshop spotlights state-of-the-art methods that connect AI generation to EM reality, moving beyond proofs-of-concept toward validated models and workflows engineers can use today. Technical content centers on three pillars — (1) Inverse EM / spec-to-layout and end-to-end design: “Generative AI Methods for Wireless Propagation Prediction” (Costas Sarris) shows diffusion and GANs for real-time, generalizable indoor propagation maps and super-resolution; “AI-enabled End-to-End RF and RFIC Design” (Kaushik Sengupta) discusses inverse-design and generative AI approaches for automated synthesis of complex RF passives, multi-port elements, antennas, and spec-to-GDS RFIC flows combining reinforcement learning and inverse design; “Empowering Optimal Design of RF Devices by Generative AI” (Dominique Baillargeat and Francisco Chinesta) introduces rank-reduction autoencoders as generative surrogates for RF circuits and antennas; “An Autonomous Agentic Framework for Deep Inverse Photonic Design” (Willie Padilla) presents an agentic, autonomous inverse-design workflow for metamaterials, illustrating how AI agents can accelerate spectrum-to-structure design paradigms relevant across EM domains — (2) LLM-augmented EDA workflows and ML foundations: “Practical Considerations for Applying AI to RF and Microwave EDA Workflows” (Matthew Ozalas) and “Accelerating Innovation: AI-Driven Advances in Sigrity, Clarity, and Optimality” (Jian Liu) highlight Keysight’s and Cadence’s strategies for GenAI/LLM-aided design; Complementary talks cover attention mechanisms for non-linear circuit modeling (Qi-Jun Zhang) and multiphysics-informed, data-free ML for RFIC design (Dan Jiao) — (3) Multimodal LLMs: “Multimodal LLMs for Electromagnetic Waves” (Zhi Jackie Yao) fuses image-based EM data with text via a BLIP bridge into pretrained LLMs for EM reasoning and design assistance. Rigor and trust will be discussed throughout. Talks and discussion will cover dataset curation, generalization, solver-in-the-loop constraints (passivity/causality/manufacturability), independent EM/measurement validation, and secure integration into EDA flows, along with practical guardrails to avoid hallucinations and constraint violations. For attendees new to this intersection, the workshop includes short primers, reproducible examples, and simple evaluation checklists to separate signal from hype.

Next-generation wireless systems Beyond-5G will place unprecedented demands on radio front-ends across all frequency ranges, from sub-6GHz (FR1) to the upper mid-band (FR3) and into mm-wave spectrum. Each band presents its own trade-offs in terms of coverage, capacity, propagation, and spectrum availability, but they share common challenges: fragmented allocations, coexistence with incumbent services, and the need for spectrally agile, energy-efficient, and highly integrated transceivers. The upper mid-band (FR3, ∼6–24GHz) is a prime example. Compared to congested FR1 allocations, it offers an order of magnitude more bandwidth, while avoiding some of the severe propagation penalties of mm-wave frequencies above 28GHz. These advantages make FR3 highly attractive for wide-area enhanced broadband and low-latency applications, but also introduce stringent coexistence requirements with incumbent scientific, defense, and satellite users. The resulting emphasis on spectrum awareness and frequency agility highlights design challenges that resonate across all frequency ranges. This workshop will explore the circuit- and architecture-level innovations needed to enable broadband, reconfigurable, and spectrally agile radios. Topics include: Wideband, reconfigurable LNAs and PAs with high linearity and efficiency; Frequency-agile local oscillators and synthesizers with fast switching, low phase noise, and fine resolution; Wideband filtering and duplexing strategies using tunable, switched-capacitor, or acoustic/EM-based solutions; Digital-assisted calibration and adaptation, including ML-based techniques for resilience against PVT variations; Scalable architectures in advanced CMOS and SiGe technologies, enabling multi-band, multi-standard, and multi-antenna integration with energy efficiency. By bringing together experts from academia, industry, and government laboratories, the workshop will highlight state-of-the-art circuit techniques and cross-layer considerations — including spectrum policy, system-level trade-offs, and co-designed RF/digital intelligence — that are critical to realizing the next generation of programmable, energy-efficient, spectrally agile radios.

Are we there yet? — a world where radios and SoCs for IoT and countless other domains are truly battery free? What would it take to go beyond a smart toaster to a future with ubiquitous ambiently powered sensors that work seamlessly with the existing wireless devices and infrastructure. This workshop addresses these questions by bringing together a unique mix of top industry, research and academic speakers with expertise ranging from RFICs to SoCs. Apart from the current state of the low-power radios, the talks will discuss circuits and system architectures that have the potential to achieve 1000× improvements in energy efficiency. The workshop and concluding panel session also aims to explore salient features which the front-ends, integrated energy harvesters, and overall systems must provide to continue the evolution of ambient IoTs.

This workshop will focus on the design and implementation of FR3 Power Amplifiers. It will cover technology considerations, circuit implementation and topology consideration for PAs in this frequency range. Both Silicon, GaAs and GaN circuit examples and techniques are discussed, as well as DPD and broadband circuit techniques. The speakers are from both academia and industry.

The ever-increasing demand for high-throughput communication links and high-resolution radar sensors is driving the development of future wireless systems at higher operating frequencies, from mm-wave to sub-THz bands. The flexibility required from these systems to support multiple functionalities leads to the adoption of large phased array antennas and complex System-in-Package (SiP) Bit-to-RF or Optical-to-RF solutions. Heterogeneous technologies and vertical 3D integration will play a vital role in enhancing performance and functional density while reducing the size and cost of next-generation RF systems. However, the shift to 3DHI also introduces a new set of challenges, ranging from novel processes and substrates to RFIC/MMIC design, packaging and thermal management. This workshop brings together leading experts from academia and industry to present the latest advances and design methodologies in heterogeneous integration and advanced packaging technologies for mm-wave and sub-THz applications. The talks span a wide range of critical topics, including interposer-based system integration, advanced simulation techniques, integration of III-V technologies, SiGe and CMOS platform optimization, and co-packaged system testing and calibration.

The rapid progress in quantum computing has made microwave engineering a key enabler of nearly all major hardware platforms, including superconducting qubits, spin qubits, trapped ions, etc. Each of these technologies relies on advanced microwave techniques for control, coupling, readout, and scaling, demanding approaches that go well beyond classical electromagnetics. This creates a great opportunity for microwave engineers to make lasting contributions to the development of quantum computing and related technologies. The need for ultra-low-noise amplification, high-fidelity readout, and crosstalk suppression has stimulated novel device designs, often requiring hybrid approaches that combine electromagnetic modeling with quantum theory. Similar challenges appear in other quantum platforms; for example, trapped-ion processors demand stable and phase-coherent microwave delivery for multi-qubit gates, while spin qubits rely on advanced microwave control schemes. At the algorithmic level, quantum computing is increasingly viewed as a potential game-changer for electromagnetics and related fields. Specialized quantum algorithms promise significant acceleration for tasks such as solving integral equations, optimizing antenna radiation patterns, or addressing NP-hard problems in inverse scattering and system design. While fully fault-tolerant quantum computing remains a long-term goal, near-term noisy intermediate-scale quantum devices are already serving as valuable testbeds. Hardware-aware algorithm design, ie tailoring quantum algorithms to the specific strengths and limitations of physical devices, is becoming an essential strategy for identifying useful applications in the presence of noise and limited coherence times. This workshop will highlight state-of-the-art advances at the interface of microwave engineering, quantum hardware development, and quantum algorithm design. Contributions will cover multiple quantum platforms, emphasizing both their unique microwave engineering challenges and the unifying principles that connect them. A particular focus will be placed on industrial perspectives, including scalability, reliability, and manufacturability of microwave components for large-scale quantum systems. Industry engagement is crucial, as commercial interest and investment in quantum computing have surged dramatically, creating demand for engineers who can translate fundamental concepts into deployable technologies. To ensure accessibility, the workshop will open with a comprehensive tutorial introducing the basics of quantum theory in the language of microwave engineering. This will help participants from the RF and microwave community engage with the specialized concepts of quantum physics and better appreciate their role in quantum device design. The program will then feature a series of invited talks from leading experts in academia and industry, with topics spanning theoretical methods, quantum hardware, and algorithmic perspectives. By bringing together specialists from diverse quantum hardware platforms, algorithm developers, and industrial leaders, this workshop will provide a unique forum for exchanging ideas, identifying cross-platform synergies, and further drafting the engineering roadmap toward practical, scalable quantum computing.

With the operating frequencies of 6G wireless communications and next-generation automotive radars extending above 110GHz, accurate and robust on-wafer measurements are essential for enabling design, model verification, and industrialization. While a solid foundation has been established over the past decades in calibration methodologies and measurement platforms, many challenges remain as research and development move deeper into the sub-THz domain. As advanced devices, circuits, interposers/packaging technologies emerge alongside high-frequency systems, new measurement scenarios and calibration requirements continue to arise. At the same time, new methodologies such as AI-driven automation, advanced calibration algorithms, and novel calibration substrates are being developed to address these evolving needs. This full-day workshop brings together international experts from national metrology institutes, academia, and industry to address these challenges from complementary perspectives. The program begins with a focus on the fundamentals of calibration and measurement, reviewing the state-of-the-art in instrumentation, calibration techniques, and traceability at mm-wave frequencies, followed by comprehensive design guidance for calibration standards and systematic analysis of probe-induced uncertainties. These sessions lay the foundation for reliable and reproducible on-wafer measurements at sub-THz frequencies, offering both the theoretical framework and practical guidance needed for advancing calibration practices. The workshop then transitions to next-generation tools and methodologies that are extending the state-of-the-art. Topics include AI-driven nano-robotic probe stations that achieve sub-micron alignment and reproducible probe placement, calibration algorithms that go beyond conventional error models to capture mode conversion and crosstalk, and the development of GaAs impedance standard substrates supporting diverse calibration standards and measurement scenarios. Recent advances in broadband vector network analyzer technology will also be presented, including single-sweep measurements up to 250GHz and new calibration capabilities. These contributions demonstrate how innovative approaches are being translated into practical platforms, enhancing both robustness and scalability. Finally, the workshop highlights applications and industrial implementations. Talks will show how advanced calibration and measurement techniques are applied in wafer-scale silicon interposer technologies — addressing stackup choices, GSG pad design, and multimode suppression — as well as in high-volume silicon device testing for next-generation components. Presentations from industrial experts will emphasize optimizing calibration substrates, comparing methodologies such as modal versus SOLR calibration, and reducing measurement uncertainties under real manufacturing constraints. Together, these examples illustrate how academic innovation and industrial practice are converging to enable accurate and traceable measurements at scale. By covering the full spectrum from fundamentals to industrialization, this workshop offers participants both foundational insights and exposure to cutting-edge solutions. The day will conclude with an open discussion, providing a forum to exchange ideas, identify open challenges, and shape the roadmap for accurate, scalable, and robust on-wafer sub-THz measurements.

The D-band frequency range is gaining attention for both radar and communication applications due to potential system miniaturization related to smaller wavelength and the possibility of having larger bandwidth. There is an ongoing frequency regulation activity at ETSI, ECC and FCC on standardization of new frequency bands, targeting bandwidth >10GHz. Large bandwidth is beneficial for radar to achieve good range resolution, while for communication applications one can achieve higher data-rates. Pushing operation frequencies even further beyond the D-band towards 300GHz may offer even more potentially large available unregulated bandwidth. However, these high operation frequencies reach the technological limits imposed by the available CMOS processes. Operating the transistors at frequencies beyond half of the achievable ft/fmax makes it very difficult to obtain sufficient gain and power from an amplifier stage. One possible solution would be to use III-V technologies, which offer ft/fmax frequencies by far exceeding those of advanced CMOS nodes. Still, the possibility of integrating the mm-wave front-end with the digital baseband on the same chip makes CMOS very attractive despite this mentioned drawback. Another challenge that comes at higher frequencies are the higher losses of the interconnects. The packaging possibilities. Realization of antennas (on-chip or in-package?). As well, much higher propagation losses make the link budget very challenging and make it very hard to reach ranging or communication over large distances. In this full-day workshop we will address exactly these questions: (a) does it make sense to go to frequencies above 100GHz? Or shall we stay in the comfort zone below 100GHz?; (b) for which applications does it makes sense at all?; (c) what are the circuit related challenges in silicon-based technologies and how can we solve them?; (d) what are the challenges not only to build an SoC, but to actually build a system >100GHz?; (e) discuss emerging applications that might profit by very high frequencies. Level budget considerations for various mm-wave systems will be discussed. Fair and unbiased opinions will be given by experts. The workshop features distinguished speakers from leading companies and academia, who will present their view on mm-wave circuits >100GHz, as well as sharing their “best practice” on how to design mm-wave circuits. A brief concluding discussion will round-off the workshop to summarize the key learnings on the wide range of aspects presented during the day.

Scaled antenna arrays that support multiple simultaneous beams can enable significant throughput improvements and new capabilities for both communications and sensing applications. These benefits provide the form-factor and spectral efficiencies required for next generation wireless systems. However, beam scaling also scales up traditional design challenges and creates new implementation hurdles. For example, handling the signal distribution and processing for hundreds of antennas and tens of beams quickly results in stages that are power and thermally infeasible. Innovations in multi-beam array architectures are indispensable to overcoming these challenges for emerging satellite communications, radar, and 6G applications. To succeed in real-world deployments these innovations must be developed with resilience, cost-effectiveness, and hardware scalability considerations in mind. This workshop explores specifically multi-beam topics with an array of experts presenting their work on re-imagining how to architect and build point-to-multi-point arrays at scale. Approaches for beam-scaling in frequency, space, and time will be explored and hardware implementations that range from RF-centric to mostly digital will be covered. The goal is to provide attendees with an in-depth overview of this emerging area of antenna array design, and cast light on trade-offs and future directions.

Increasing demand for continuous information flow and uninterrupted connectivity requires next-generation communication and sensing systems to support higher data-rates and wideband operation. As a result, wireless systems are moving to higher frequencies, offering wider bandwidth and higher channel capacity, while simultaneously reducing the system size. Although lower mm-wave bands, such as V-band (40–75GHz), have been explored as a potential solution to meet the demand for high-speed connectivity, the elevated levels of atmospheric attenuation create an additional challenge for maintaining signal power in wireless transmission over long distances. On the other hand, the upper portion of the mm-wave spectrum at 110–300GHz, also known as G-band, offers a promising path to achieve higher data-rates in point-to-point links, defense applications, localization, ranging, and other multi-user communication scenarios as the underutilized portion of the EM spectrum, while enabling higher resolution in radars and other sensing systems for biomedical or security screening and also reducing the size of all these systems. The sub-THz spectrum above 200GHz is of particular interest due to lower atmospheric attenuation. However, building high-performance integrated circuits and systems at G-band poses significant disadvantages due to the lower available gain of the transistors and higher noise contribution from components, leading to higher power consumption and reduced sensitivity at these sub-THz frequencies. Therefore, a combination of advanced circuit design techniques and system-level innovations, state-of-the-art high-speed devices harnessing the properties of compound semiconductors, heterogeneous integration, and co-design with packaging is essential to overcome the inherent challenges of the G-band design space. This workshop provides a comprehensive and in-depth review of the latest academic and industrial research on innovative techniques and cutting-edge technologies for realizing high-data-rate wireless communication and radar systems at 110–300GHz across SiGe, scaled-CMOS, InP, and GaN platforms, with particular focus on designs above 200GHz in the upper G-band. First, novel circuit techniques and topologies to enable high-power generation with maximum power efficiency, advanced high-speed device design and optimization in compound semiconductor processes, as well as III-V RF front-ends and hybrid InP/CMOS phased arrays above 200GHz, will be presented. State-of-the-art SiGe BiCMOS transceiver arrays across the entire G-band will be showcased with an emphasis on ultra-compact design and 2D scalability, along with multiple demonstrations of modular beamforming ICs supporting up to 200Gbps wireless transmission, wideband radar transceiver chips for integration in large MIMO arrays, and upper G-band MMICs enabling radar systems with multi-target resolution down to a few millimeters while maintaining an absolute ranging accuracy on the order of 1µm. In addition, system- and circuit-level design considerations for record-low-power CMOS radar sensor systems will be reviewed. Finally, co-design and co-integration of sub-THz ICs in SiGe and SOI with glass interposer technology and 3-D Heterogeneous Integrated (3DHI) phased arrays incorporating an antenna on glass, GaN-on-SiC MMICs, a silicon interposer, and a silicon Beam Forming Integrated Circuit (BFIC) will be presented as a pathway toward end-to-end communication modules in G-band for commercial and defense applications.

Emerging applications such as Low Earth Orbit (LEO) satellite-based internet and geolocation services are rapidly expanding, driven by commercial efforts to deliver low-cost satellite connectivity to consumers. However, space environments present unique challenges not encountered in terrestrial systems, including radiation-induced errors, extreme temperature fluctuations, and limited power availability. Systems operating beyond LEO face even more severe higher levels of environmental degradations. This workshop will bring together leading experts from academia and industry, spanning both LEO SATCOM and traditional space-based systems, to provide a comprehensive overview of the key design challenges and state-of-the-art techniques required for reliable RF system performance in space.

As our society and economy continue to accelerate toward digitalization, the density of connected wireless nodes is increasing rapidly—with estimates suggesting up to ten million devices operating within a single square kilometer. This unprecedented growth raises major sustainability challenges, particularly due to the widespread use of batteries for powering wireless devices. Wireless Power Transfer (WPT) offers a transformative solution by delivering power without physical connections or disposable energy sources. By reducing dependence on batteries and minimizing material waste, WPT technologies contribute to a more sustainable, cost-effective, and scalable infrastructure for the connected world.
The WPT Boot Camp at IMS 2026 will introduce participants to both near-field and far-field WPT technologies in a format that integrates industrial and academic perspectives. Industry speakers will present the current state of the art, including commercially available systems, standardization efforts, and emerging market opportunities. Academic experts will complement these talks with discussions on the theoretical foundations and ongoing research aimed at pushing WPT capabilities beyond existing limits.
A central feature of the boot camp will be live demonstrations, giving participants hands-on experience with operational WPT systems and the opportunity to interact directly with the presenters. This highly interactive format ensures that attendees gain both a practical understanding of existing solutions and insights into future technological directions.
The boot camp is open to engineers, students, and professionals from industry and academia who wish to deepen their understanding of WPT technologies, explore their applications, and engage with experts driving innovation in this rapidly evolving field.

Next-generation communications and sensing systems operating in the mm-wave range require a collaborative effort among the various components that make up the subsystems to enhance performance and reduce production costs. This workshop will bring together leading researchers from different fields of mm-wave phased arrays to discuss the key requirements and challenges relevant to their areas of expertise. The half-day workshop will kick off with a unique perspective on mm-wave phased arrays from industry and government representatives, providing context for the challenges and requirements in this field. The remainder of the workshop will feature internationally renowned speakers specializing in transistors, integrated circuits, packaging, and heterogeneous integration, as well as phased arrays. Interactive discussions will be prioritized throughout the event to encourage engagement among participants.

The frontier of next-generation radar is shaped by advances in mm-wave, UWB, and AI-assisted phased array technologies. In the D-Band, SiGe implementations enable instantaneous bandwidths up to 56GHz, delivering millimeter-level resolution and unlocking applications in imaging, non-destructive testing, and metrology. In parallel, UWB radar provides low-power, high-precision sensing for presence detection, vital-sign monitoring, and in-cabin safety. Complementing these developments, AI-driven phased arrays are emerging as enablers of adaptive beamforming, joint radar-communications (ISAC), and scalable multi-antenna architectures. This talk will highlight circuit and system design challenges, analog front-end techniques, and prototype results, illustrating how SiGe mm-wave, UWB, and AI-enhanced phased arrays together define the future of high-resolution radar.

The Boot camp runs ½ day (4 hours) including 20-minute break. Four modules will be presented.
The broad theme of the bootcamp is to educate, the high frequency (RF,MW and mm wave) engineers, the processing in the digital world where the analog RF waveforms from array antenna and electronics are available in digitized form. Popular techniques for beam shaping, beam spoiling, null steering, beam optimization, interference mitigation will be explained, targeting applications like massive MIMO, Reflective intelligent surfaces (RIS), direction of arrival estimation etc. The goal is not to delve deep into mathematics, but to provide an intuitive understanding of the techniques. Even though the algorithms are analytically sound, they often lose their efficacy due to the impairments in the electronics and antenna array. Hence treatment of all important RF impairments, how they can be captured accurately, and modeled accurately, will be discussed. The impact of RF impairments on the algorithms will be presented as well. Calibration techniques will be discussed to show recovery of the desired functionality by increasing the efficacy of the processing algorithms.
The expected audience will be a mix of experienced phased array designers and engineers new to this field.

The exponential demands for higher power densities, broader frequency coverage, and enhanced reliability in microwave systems have exposed fundamental limitations in conventional thermal design approaches. As next-generation applications push beyond traditional thermal boundaries — from 5G/6G infrastructure to automotive radar and space-based communications — the industry faces a critical inflection point where incremental improvements in thermal management are essential to meet performance requirements. This workshop addresses these challenges through a comprehensive exploration of advanced thermal characterization, materials innovation, and holistic design methodologies that span from fundamental materials science to industrial-scale implementation. The program brings together leading researchers, and industry practitioners to present breakthrough approaches that are reshaping thermal management across the RF and microwave ecosystem. The technical foundation begins with the innovations in wide-bandgap materials presented by Prof. Srabanti Chowdhury of Stanford University, whose pioneering work on ultra-wide bandgap materials demonstrates how diamond integration with Beta-Gallium Oxide enables unprecedented reduction in thermal boundary resistance while maintaining RF performance. These materials advances provide the essential building blocks for next-generation thermal management solutions, particularly in high-power RF applications where conventional thermal interface materials reach fundamental limitations. Oscar D. Restrepo offers industrial thermal modeling and characterization perspectives from GlobalFoundries, where a unique combination of theoretical expertise in phonon transport and practical TCAD thermal simulation experience bridges fundamental physics with manufacturing-scale implementation. His work spans from first-principles calculations of defect formation energies to real-world thermal assessments across advanced technology nodes, including 22FDX and 12LP platforms. Building upon materials foundations, the workshop explores state-of-the-art thermal characterization techniques through both academic research and commercial implementation. Advanced thermoreflectance imaging, POSH-TDTR technology, and emerging measurement approaches demonstrate how nanosecond temporal resolution combined with submicron spatial accuracy reveals previously inaccessible thermal phenomena in operating RF devices. These characterization advances enable predictive thermal design that was previously impossible with conventional measurement techniques. Standards and validation methodologies receive dedicated attention through participation by the National Institute of Standards and Technology (NIST), which presents traceable thermal measurement techniques and validation protocols essential for industry adoption. NIST’s gate resistance thermometry methods and RF power metering standards provide the measurement foundation necessary for reliable thermal characterization across different technology platforms. The workshop culminates in a holistic design philosophy that integrates materials innovation, advanced characterization, and system-level optimization. Live demonstrations showcase how this integrated approach enables thermal-electromagnetic co-design, abandoning traditional component-level optimization in favor of system-wide performance optimization. Real-world case studies span from mm-wave antenna-in-package modules to high-power GaN amplifiers, illustrating a direct correlation between materials properties, thermal imaging data, and system performance. Interactive sessions throughout the workshop foster direct dialogue between materials researchers, device designers, and manufacturing engineers. These discussions address practical implementation challenges while exploring emerging opportunities that could reshape thermal management approaches over the next decade. The format emphasizes knowledge transfer and collaborative problem-solving rather than traditional presentation-only formats.

In recent years tremendous advances have been made in electronics and photonics device technologies for the generation, modulation, radiation, and detection of THz signals and the time is now right to exploit these advances to build and deploy THz systems. IEEE defines the THz band as frequencies ranging from 300 to 3000GHz, however, for most use cases frequencies extending from about 100GHz to 10THz is considered as the sub-THz and THz bands. The focus of this workshop is on the research and development of components and systems for THz wireless communications and sensing. In the THz band, the available bandwidth is very vast, and this feature can be leveraged for multi-Gbps wireless communications leading to terabits per second throughput in a multi-channel system. Besides communications, THz waves can be used for sensing the reflection, transmission, absorption, and scattering of materials which in turn can be exploited for detecting, imaging, and analyzing materials with high spectral resolution. Furthermore, the wavelength of THz waves is small and on the order of 30 microns to 3.0mm, which along with polarization of the signal can be exploited for precise position and orientation of objects, within a specific location. All the above features are crucial for 6G communications, self-driving vehicles, and industrial Internet-of-Things. Accordingly, the workshop includes presentations from individuals and organizations across the globe highlighting the THz components and systems that they have developed and their application to communications and sensing.

In RF device characterization, understanding and utilizing phase information is crucial for achieving accurate measurements. This workshop is designed for engineers, technicians, and researchers who seek to deepen their knowledge of phase references and their applications in vector network analyzers (VNAs) and vector signal analyzers/generators (VSAs/VSGs). The primary goal of this workshop is to emphasize the significance of phase information in RF measurements. We introduce the concept of a “signal comb” as a phase reference and a tool for enhancing measurement accuracy. Participants will gain insights into how a comb generator works and how phase references can improve the reliability of amplitude and phase measurements across various RF applications. Key Topic #1 — Understanding Phase Information: • Introduction to phase information and its relevance in RF measurements; • Discussion of the limitations of traditional amplitude measurements and the often-overlooked phase references. Key Topic #2 — The Role of Signal Comb: • Explanation of what a signal comb is and its function in RF testing; • How a signal comb acts as a “Swiss army knife” for calibration and broadband verification; • Design overview of a comb generator and its traceability. Key Topic #3 — Benefits of Phase References: • Detailed exploration of how aligning VNAs and VSAs/VSGs to a known phase reference enhances measurement accuracy; • The importance of traceable calibration for establishing transfer standards in amplitude and phase uncertainties. Key Topic #4 — Practical Applications: • Hands-on examples demonstrating the application of phase calibration in real-world scenarios; • Case studies including time domain transformation and frequency-converting circuit measurements. Key Topic #5 — Advanced Measurement Techniques: • Techniques for aligning multi-port VSAs in amplitude, phase, and time using phase references; • Over-the-air measurement of group delay in low-noise block downconverters (LNBs) and pulse response determination of amplifiers at optimized operating points. Who Should Attend — This workshop is ideal for RF engineers, measurement technicians, and researchers involved in RF device characterization and testing. Whether you are a seasoned professional or new to the field, this workshop will provide valuable insights and practical skills to enhance your measurement capabilities. Format — The workshop will feature a combination of presentations, interactive discussions, and hands-on demonstrations. Participants will have the opportunity to engage with experts in the field and collaborate with peers to solve measurement challenges. Join us for this comprehensive workshop to unlock the full potential of phase information in your RF measurements. By the end of the session, you will have a solid understanding of phase references, the utility of signal combs, and advanced measurement techniques that can save you time and improve the accuracy of your RF testing endeavors. Don’t miss this opportunity to elevate your measurement skills and ensure precision in your RF applications.

RF Bootcamp is an interactive based learning which teaches the fundamentals of RFMW theory as it applies to the elements of transmit/receive communication and radar signal chains. Sessions focus on RFMW basics, explaining real-world design, requirements, measurement techniques and applications.
The intended audience includes technicians, new engineers, engineers who may be changing their career path, marketing, sales and business professionals seeking a better understanding of microwave technology, as well as current college students looking to learn more about the practical aspects of RF and Microwave technology.

The transition to all-digital RF transceivers marks a transformative shift in wireless system design, promising unprecedented levels of flexibility, scalability, and integration. This workshop brings together leading researchers and practitioners from academia and industry to explore the current state, challenges, and future directions of all-digital transceivers, covering a broad spectrum of topics from foundational architectures to application-driven innovations. All-digital transceivers replace traditional analog-intensive RF front-ends with fully digital architectures, where signal generation, modulation, transmission, and reception are primarily handled in the digital domain. This approach leverages high-speed digital-to-analog and analog-to-digital converters (DACs/ADCs), direct digital synthesis, and reconfigurable digital logic to create highly adaptable, software-defined systems that support multi-standard and multi-band operation. The workshop will begin with an overview of the architectural principles of all-digital transceivers, highlighting key building blocks, including pulsed modulators, up/down conversion architectures, filters, amplifiers and other fundamental building blocks. A comprehensive exploration of cutting-edge advances in digital and RF front-end technologies for next-generation wireless systems is presented. The first sessions focus on Delta-Sigma Modulation (DSM) for high-performance All-Digital RF Transmitters (ADTs). After revisiting key principles, advanced techniques for high-speed operation, out-of-band noise management, and hybrid DSM architectures are discussed, alongside emerging concepts such as spatial DSM for massive MIMO. Building on this, the relevance of ADTs as digital replacements for conventional RF chains is examined, highlighting their advantages in frequency agility, scalability, and integration with programmable platforms. Subsequent talks review progress in agile and scalable ADT architectures, including FPGA-based implementations and single-bit transmitters for direct antenna array driving. The benefits and trade-offs of wideband, multi-band, and multi-element operation are analyzed, providing participants with a clear perspective on the opportunities and limitations compared to analog-intensive designs. Extending the all-digital paradigm to the complete transmission–reception chain, another session introduces a Pulse-Width Modulation (PWM) approach for receivers, demonstrating how the combination of DSM-based transmitters and PWM receivers supports low-power, high-performance wireless architectures. The workshop also addresses digital transmitters for 5G and 6G, focusing on GaN-based amplifiers up to 6GHz, their role in boosting efficiency, and prospects for scaling digital architectures beyond 100GHz. This is complemented by advances in RF/microwave filter design, where new approaches achieve quasi-flat group-delay responses beyond the 3dB transmission band, thereby improving signal integrity without sacrificing selectivity. Emerging system-level concepts are also presented. A Distributed MIMO (D-MIMO) testbed based on all-digital radio-over-fiber is showcased, demonstrating practical solutions for sub-6GHz and mm-wave implementations and addressing synchronization challenges inherent to distributed architectures. Finally, the role of LEO satellite communications in the Q/V band is explored through digital beamforming and compact RF front-ends leveraging high-order Nyquist zones, enabling flexible beam generation for next-generation constellations. This workshop provides a unique platform for attendees to engage in in-depth technical discussions, exchange ideas, and foster collaborations that advance the frontier of all-digital RF systems. Together, these seven talks provide an integrated perspective on the transition to fully digital RF front-ends, offering insights into architectures, components, and system-level innovations that will shape future 5G, 6G, and non-terrestrial networks.

RF Power Amplifiers (PAs) play a critical role in modern wireless and satellite communications, radar, and electronic systems, requiring a deep understanding of both fundamental principles and cutting-edge innovations. This advanced course is designed for PhD students and professional researchers seeking to expand their expertise in RF PAs design, analysis, and optimization. Starting from solid-state power amplifiers fundamentals, the course will cover theoretical concepts, including PA classes of operation, their Figures of Merit, stability considerations and efficiency enhancement techniques. Special emphasis will be placed on advanced PA architectures, including Doherty PA, Envelope Tracking and other PA architectures, which are critical for next-generation wireless and satellite communication systems. The course will also address broadband design challenges and emerging trends in integrated PAs for large-scale phased array applications. Linearization strategies, including digital predistortion (DPD), will be discussed as essential tools to mitigate distortion and improve spectral efficiency. Several design examples based on commonly used semiconductor technologies (eg GaN, GaAs etc) will be presented to highlight the link between theory and practical implementation. Through a combination of theoretical foundations, practical case studies, and research-driven discussions, attendees will gain the expertise needed to design, model, and optimize cutting-edge RF power amplifiers. By the end of the course, participants will be well-equipped to contribute to breakthrough innovations in PA technology, bridging the gap between academic research and industrial applications.

Low-noise receivers are crucial system components for Earth observation and satellite communication. The complexity of such systems is growing, where today’s spacecraft range from large satellite missions such as MetOp-SG, to smaller systems such as the Arctic Weather Satellite, to CubeSats such as TROPICS (Time-Resolved Observations of Precipitation structure and storm Intensity with a Constellation of Smallsats). One of the most important building blocks are low-noise amplifiers. Over the years, corresponding technologies have improved substantially and provided excellent noise temperatures. Furthermore, the linearity and robustness of receivers is also an important characteristic, which adds another level of complexity. This requires new technologies, such as GaN HEMTs, with the necessity of different system architectures. This workshop gives an overview of the design of low-noise amplifiers and corresponding technologies. Furthermore, several aspects of the design and performance of receiver architectures will be discussed. Rarely discussed topics, such as in-system calibration targets or the reliability testing of critical components, will also be presented. The workshop starts with aspects of low-noise receiver systems and gives examples of several satellite missions and a background to the topic. Subsequently, best practices for the design of low-noise amplifiers and receivers are presented. An overview of recent advances in low-noise transistor technologies and the reliability testing is included as well. The remaining talks focus on different possibilities of low-noise calibration approaches for satellite systems.

This workshop surveys a materials-to-systems roadmap for reconfigurable apertures spanning sub-6GHz, FR3 (≈7–24GHz), mm-wave, and THz. Highlights include dual-polarized RFSOI-switched reflectarrays at 3–6GHz and 13–15GHz with true-time-delay or ultra-short phase shifters, achieving ±60° all-plane scanning and <1.5% EVM with 64-QAM. A 28GHz origami “eggbox” phased array merges electronic beam steering with controlled shape morphing to deliver near-360° azimuth coverage, multibeam and quasi-isotropic patterns, and additively manufactured foldable interconnects with ∼0.02dB/mm insertion loss. At higher frequencies, phase-transition and phase-change materials (VO₂, W:VO₂, GeTe) enable optically addressable, nonvolatile metasurfaces for broadband modulation, beam control, and tunable lensing in the sub-THz/THz regime, while plasmonic-nanoantenna platforms yield compact, high-SNR THz spectroscopy and imaging for sensing and security. CMOS-integrated, tile-scalable programmable metasurfaces and RIS architectures support resilient links and massive MIMO; electromagnetically consistent models and optimization frameworks extend to holographic surfaces and near-field ISAC. New multi-beam transmissive/reflective surface architectures up to 140GHz, OTA calibration and range-reduction methods for large reconfigurable arrays, and binary-coded genetic optimization of pixelated multiband antennas complete the program. Collectively, the sessions chart a path to low-loss, wide-angle, and highly programmable apertures that unify communications, sensing, and localization while remaining manufacturable, scalable, and verifiable.

Superconducting qubits have emerged as a leading platform for scalable quantum computing, offering robustness, manufacturability, and seamless integration with microwave engineering techniques. This workshop presents a comprehensive journey from the foundational principles of superconducting quantum systems to advanced microwave design strategies that enable scalable architectures. We begin by exploring the physics of Josephson junctions — the non-linear inductive elements that form artificial atoms — and their integration into quantum circuits. Participants will gain insights into the design and simulation of qubit-resonator networks, quantum amplifiers, and cryogenic microwave systems operating within dilution refrigerators at millikelvin temperatures. Key engineering challenges will be addressed, including resonance frequency tuning, qubit-resonator coupling, and quantum parameter optimization (eg anharmonicities, cross-Kerr effects). The workshop will also examine the role of quantum amplifiers in enhancing readout fidelity and the importance of scalable microwave layouts for multi-qubit systems. Using real-world examples and simulation workflows, we will demonstrate how to accelerate development cycles and improve design accuracy. Attendees will leave with a clear understanding of how microwave engineering principles intersect with quantum hardware design, paving the way for scalable quantum computing architecture.

Digital manufacturing technologies are transforming RF design, packaging, and integration, leading to new capabilities and use cases for high-frequency RF components and systems. The potential to digitally manufacture RF components, alongside new materials and integration processes, offers unprecedented opportunities for improving performance, reducing size/weight, and enhancing sustainability across the lifecycle of microwave systems. However, significant challenges remain in design, the realization of digitally-processed materials and manufacturing methods, and the seamless integration of individual components to full RF systems. This workshop aims to bring together advanced RF component design methodologies, manufacturing techniques, and practical RF/microwave applications. It will provide a comprehensive overview of new design, integration, and packaging techniques for microwave, mm-wave, and THz RF systems. Specifically, the workshop will give a detailed overview of novel materials, sustainable manufacturing methods, and scalable integration schemes that facilitate the realization of high-performing, highly-functional, and highly-miniaturized RF components. The workshop will bring forward recent advances in these fields by presenting the research of leading researchers and industry experts in the fields of RF component development, digital additive manufacturing, multi-material integration, and microwave materials engineering. Discussions will include cross-disciplinary advances involving manufacturing technologies, material development, and new design methods (ie design-for-print), opening new directions for materials-enabled innovation in wireless communication, sensing, and high-frequency electronics.

Phase-Change Material (PCM) RF switches are emerging as a breakthrough technology for reconfigurable microwave and mm-wave circuits. With their non-volatile operation, low insertion loss, and high power-handling capability, PCM switches offer distinct advantages over conventional alternatives. These properties make them ideal for use in phase shifters, impedance tuners, reconfigurable filters and switchable antenna arrays. At mm-wave frequencies, their scalability and fast response unlock new possibilities in adaptive beamforming, dynamic spectrum access, and next-generation 5G/6G wireless, satellite, and radar systems. This workshop will bring together leading experts from industry and academia worldwide to present recent advances and future directions in PCM-based RF technologies including coverage of device concepts, circuit integration, and application case studies. It aims to foster cross-disciplinary dialogue and broaden the community’s understanding of this promising technology for future mm-wave communication platforms.

Modern RF, mm-wave, and sub-THz systems stitch together multiple propagation media — microstrip, CPW/GCPW, SIW, ridge and rectangular waveguide, superconducting multilayers, and emerging flexible and additive platforms — because no single line technology satisfies bandwidth, loss, power, packaging, and cost targets simultaneously. This full-day workshop brings leading researchers and practitioners to present field-based design rules, validated topologies, and measurement workflows for high-performance transitions and interconnects across these media. Foundational talks cover the evolution of planar↔waveguide links and state-of-the-art SIW transitions (including compact, broadband launchers and thick–thin stackup integration). Practical sessions compare microstrip, GCPW, and SIW on a common process, detail ridge/ridge-gap waveguide connections, and treat transmission-line choices for high-speed/high-frequency ICs. Materials and manufacturing frontiers are addressed via MXenes for printable conductors, flexible hybrid electronics for ultra-low-cost modules, and multilayer superconducting devices for ultra-low-loss front-ends. A methodological block demonstrates AI/ML-assisted EM optimization (adjoint sensitivities, surrogates, active DOE) that reduces simulation burden while improving insertion/return loss and mode control. Throughout, speakers emphasize tolerance and variability, packaging and interposers, vertical/horizontal launches, and over-the-air and on-wafer verification. Attendees leave with implementable recipes and performance bounds that shorten development cycles and raise first-pass success for integrated communications, sensing/ISAC, and imaging hardware.

A quiz show battle for RFIC knowledge supremacy is brewing between students and experienced professionals. Will it be the experience of the career RFIC veterans or the students who have been in the classroom more recently? Come join this fun and interactive panel to find out!

The market for integrated active electronically scanned arrays (AESA) and multiple-input multiple-output (MIMO) wireless systems is rapidly growing for ground-based and satellite telecommunications, as well as for automotive and aerospace and defense applications. Engineers, accustomed to traditional conductive characterization of RF front-ends, are increasingly confronted with over-the-air (OTA) interfaces, which makes their jobs more difficult in designing the test setups and measurement techniques while keeping measurement uncertainties small. Besides the wide use of anechoic chambers, reverberation chambers have been researched and explored for the past years to characterize different aspects of AESA / MIMO systems OTA with the focus on their active or electronic behavior, ie separate from the antenna characteristics. The goal of the workshop is to inform engineers about the state-of-the-art in reverberation measurement techniques, how they differ from those of anechoic chambers and how one may gain certain insights into the electronic behavior behind the antenna, similar to what traditional conducted measurements provided. The concepts and some exciting results will be demonstrated to make it more tangible. Attendees will learn how to make better tradeoffs related to selecting the proper characterization and test methods in every stage of AESA / MIMO product development, ie from characterizing the first design, to design validation and production.

Integrated Sensing And Communication (ISAC) applications have become a key emerging area in the next-generation wireless evolution. The role of ISAC will vary, ranging from tasks such as radar coordination, context awareness for communication to enhanced security and improving the trustworthiness/resilience of future networks. ISAC has the potential to transform current technologies by introducing context awareness, enabling breakthroughs in applications such as connected driving and next-generation mobile communications. The investigation of hardware enablers and emerging techniques considering different signal processing aspects will play an important role in the near future to realize the full potential of ISAC, leading to faster deployments. This half-day workshop will highlight these technologies and enablers featuring both applied and academic researchers working in hardware, signal processing, and system integration/demonstration aspects of ISAC targeting various applications. RF hardware design approaches that enable sharing components between both sensing and communication functions will be the key to faster deployment. The workshop talks will cover opportunistic sensing using existing communication infrastructure as well as dedicated approaches for sharing resources while achieving ISAC. Two talks will focus on antenna arrays for ISAC and one exploring special electromagnetic beams carrying orbital angular momentum. The presentations will include results from hardware supporting the feasibility of the proposed concepts.

Power Amplifiers (PAs) are key elements in every communication link, and their performance strongly impacts a system’s data throughput, power consumption, size, and reliability. With the transition from a small number of GEO satellites to large-scale constellations in LEO and MEO, driven by commercial and defence applications, there is increasing pressure to rethink PA architectures. Efficiency, bandwidth, and linearity remain central figures of merit, but the trade-offs between them acquire new dimensions in the context of satellite communications, where cost per bit, scalability, and long-term reliability are critical. This workshop will bring together perspectives from MMIC designers and system engineers to explore how solid-state PAs are evolving to meet these demands. Presentations will cover advances in GaN technology, thermal and reliability challenges, efficiency enhancement techniques, and integration. Looking ahead, the workshop will also highlight areas where new approaches could shift the current landscape: highly integrated front-end modules, thermal management, and new characterisation methods for devices at mm-wave and sub-THz frequencies. The intended outcome is to provide participants with a snapshot of current best practices and a clear view of the open challenges that will define the next steps in SATCOM PA research.

3D Heterogeneous Integration promises huge improvements to size, weight, power, and cost (SWAP-C) while maintaining or improving performance through choice of best-in-class electronics, components, and packaging. But with this increased system density comes additional physical challenges such as thermal management. Advanced electronics design and advanced packaging design need to consider the thermal generation and thermal management processes together to realize the true benefits of 3DHI. Join 3D Glass Solutions and Keysight for an investigation into the design of an advanced electronic system using thermal-aware electronic design processes to explore this complex interaction and determine the best thermal management solution

High-gain modern phased array radiation pattern measurements require narrow angular resolution to ensure accurate results and reliable null measurements. Fast and precise analysis is essential for uniform beam steering with minimal scan loss and side-lobe levels. You need to measure multiple beam and null steering settings, tapering modes and polarizations in SATCOM or NTN. We will demonstrate how to optimize radiation pattern measurements and analysis, regardless of your equipment. AI will be used for 3D pattern reconstruction. Our goal is to provide a game-changing approach to measurement and analysis, enhancing your testing workflow and quality of results.

This workshop explores AI-assisted modeling techniques for RF components, enabling the creation of accurate digital twins and supporting a seamless digital thread across wireless system design. We cover advanced methods for characterizing beamformers, front-ends, and other RF devices through measurement and simulation, highlighting how AI differs from traditional IQ and VNA waveform-based modeling.
System-level workflows are presented, integrating AI-driven behavioral models to predict performance across diverse conditions. Attendees will learn to validate digital twins with measurements, enhance simulation fidelity, and streamline design cycles, while assessing the advantages and limitations of AI versus conventional approaches.

By 2025, the global mobile cellular subscriber count is forecasted to surpass 6 billion, with 5G paving the way for high-data capacity and low-latency through sub-6GHz and mm-Wave spectrum. 6G networks will hinge on 7-15GHz FR3 bands, a pivotal shift in mobile connectivity. The global rise of smartphones owes much to CMOS technology advancements to smaller nodes, computational power, and digital calibrations. This workshop explores current 5G RF-FEM designs at the heart of this transformation, addressing implementation challenges and discussing 6G FR3 ones. The semiconductor roadmap envisioned for 6G FR3 will be discussed, focusing on the integration of III-V/Si technologies.

In an increasingly congested spectrum landscape, companies, regulators, and policymakers are looking at new frequencies. With large chunks of untapped bandwidth, and the increasing maturity of the required technology, the sub-THz band offers significant promise for the wireless communications world. At the same time, existing services and stakeholders in the band, e.g., from the passive remote sensing and radio astronomy communities, need to be protected. Finally, international and national regulations limit emissions above 100 GHz largely based on considerations derived at lower frequency, overlooking the unique characteristics of electromagnetic wave propagation above 100 GHz, e.g., molecular absorption, and of the corresponding technology, e.g., the extreme directivity of the antennas.
There is a growing need for 1) new propagation models and measurements across frequencies that capture the stakeholders’ diverse needs and ways of interacting with the spectrum; 2) new circuits, antenna designs, and interference cancellation techniques for sharing and coexistence; and 3) dialogue between the scientific and other stakeholders to understand and model Radio Frequency Interference.
With this panel, we want to foster the dialogue between often siloed communities. To do so, we have invited representatives from the wireless communications, radioastronomy, and remote sensing community, including policy advocates and experts.

Recent advances in artificial intelligence (AI) and machine learning (ML) are transforming the way wireless components and complex electromagnetic (EM) systems are conceived, designed, and deployed. This session explores how ML-enabled optimization techniques are redefining applied electromagnetics, spanning the full pipeline from computational electromagnetics (CEM), uncertainty quantification (UQ), and antenna design to impactful applications such as magnetic resonance imaging (MRI), orthopaedic diagnostics, and remote sensing of snow and environmental parameters. By embedding AI and ML into EM modeling and optimization workflows, engineers can accelerate design cycles, navigate high-dimensional design spaces, and achieve performance levels that are difficult to reach with conventional approaches.<br />
Beyond algorithms, the session emphasizes the critical role of data in driving the quality, robustness, and trustworthiness of AI-based solutions. High-fidelity simulation data, measurement-driven datasets, and hybrid physics-informed approaches are discussed as essential enablers for reliable learning and generalization. Attention is also given to the challenge of bridging ambition and deployment—moving AI-enhanced EM techniques from proof-of-concept demonstrations to deployable, validated systems operating under real-world constraints.

Join us this workshop to learn creative methods to maximize the spectrum equalization performance for Apollo MxFE™ by exploring the flexibility in its DSP architecture. The methods include a two-stage filtering using both PFILT and CFIR and leveraging CFIR sparse mode to expand effective taps from 16 to a maximum of 128. Simulation results along with a live demo of ADXBAND16EBZ - a Quad Apollo system development board will demonstrate the significant improvements in equalization performance, highlighting how Apollo’s flexible DSP architecture enables higher system-level capability across EW, Radar, ISR, and Instrumentation applications.

The evolution of wireless systems toward higher frequencies, together with the integration of joint RF sensing and communications, drives unprecedented demands on phased array performance. Next-generation architectures must deliver exceptional transmitter linearity and receiver sensitivity across multi-gigahertz bandwidths and large antenna arrays.
We explore advanced measurement and behavioral modeling techniques, linking hardware prototypes with digital twins to accelerate the exploration of architectures and the development of wideband adaptive analog and digital algorithms, emphasizing the balance between modeling accuracy and computational efficiency. Demonstrations highlight design trade-offs and performance optimization strategies relevant to both 5G/6G communication links and AESA radar systems.

This workshop explores the design of a high-performance signal chain spanning DC to 55 GHz. Attendees will examine key topics such as Digitization, Wideband up/down conversion, Tunable filtering, and Amplification. Key components will be highlighted showing unique features and process tradeoffs. Topics include architecture tradeoffs, frequency planning, high-speed data conversion, and system-level optimization for dynamic range and latency. Practical insights into design approach, calibration, and signal integrity will be shared. Ideal for RF and DSP engineers, this session equips participants with the knowledge to architect scalable signal chains for radar, 5G/6G, satellite, and instrumentation applications.

Model-based simulation enables early validation of design concepts, but accurately representing real-world imperfections can be challenging. This workshop will demonstrate how to create digital twins from hardware over-the-air measurements. Attendees will see live data gathering, model validation, and scaling to larger arrays, comparing digital twins with real hardware. Participants will learn to identify root causes of performance issues, using highly integrated mmWave beamformers with frequency conversion capable of circular polarization in compact antenna test range systems.

This workshop showcases the development of a phased array system for direction-of-arrival (DoA) estimation and beamforming, leveraging the Analog Devices Quad-Apollo ADXBAND16EBZ platform integrating with MATLAB. Participants will explore MATLAB-based hardware interfacing, array simulation for initial algorithm development (MUSIC and MVDR), and hardware-in-the-loop approaches to test algorithms in a controlled environment while contending with difficulties that come when working with real hardware. The workshop culminates in an over-the-air demonstration using a 16-element uniform rectangular array connected to the Quad-Apollo, highlighting array processing techniques with real signals. Attendees will gain practical insights into bridging algorithm design, simulation, and hardware implementation.

As serial link data rates push past 200 Gbps, precise characterization of high-speed interconnects becomes critical. traditional measurement approaches are increasingly limited by fixture effects, probe parasitic, and frequency-dependent losses that can mask true device performance. A glance at advanced de-embedding techniques that separate the behavior of test fixtures and measurement equipment from the device under test, enabling accurate modeling and validation at extreme bandwidths will be open for discussion. This workshop bring together researchers, system architects and test labs to address multidisciplinary engineering challenges and near-term deployment solutions for electrical and mixed electrical-optical interconnects operating beyond 200 Gbps.

Low earth orbit (LEO) communications constellations have radically changed the space communications industry. Emerging Satellite Communication (SatCom) applications like broadband internet access in remote areas, enhanced emergency response systems, and vehicle and object tracking, amongst other, are all driven by advancements in high-throughput satellites (HTS) and smaller, more affordable satellite technologies. These networks require new ecosystems that support a wide range of terminals with different cost, performance, and ruggedization requirements. This workshop provides a top-to-bottom review of the ecosystem for LEO satellite communication networks: Market trends, system requirements, applications and practical solution implementations.

This workshop explores the evolution of wireless standards from 2G to 6G, highlighting the economic impact on network operators, equipment vendors, and semiconductor providers. We examine how software-defined radios (SDRs) have adapted to each generation and the role of standard interfaces in enabling scalable, efficient development. The session concludes with a real-world example from Analog Devices, showcasing an SDR transceiver integrated with signal processing and physical layer functionality aligned with the open radio access network (O-RAN) standard.

This panel is for academics and commercial attendees who need a deeper understanding of the opportunities for RF/UW components and solutions as part of a quantum solution and are determining when the industry will reach quantum advantage and what impact that has the RF industry.
Quantum industry experts and leaders will provide insights into the state of the quantum industry, where and how RF/uW components are used and what can be expected in the future. They will also discus educational requirements for this industry and where to look for opportunities.

This panel will explore advancements in Integrated Sensing & Communications (ISAC) technologies that unify sensing with wireless connectivity across automotive and aerospace domains. Speakers will outline how tight co‑design of sensing and communication stacks can potentially enable dual use of RF hardware (Wi‑Fi, UWB, cellular, radar) to cut BOM cost, conserve spectrum, reduce power, and simplify architectural complexity for future software‑defined vehicles and aircraft. The discussion is organized around three complementary domains: (1) short‑range ISAC repurposing commodity wireless technologies (e.g., Wi‑Fi and UWB) for in‑cabin, near‑vehicle, and in‑flight sensing applications including intrusion detection, child presence / occupant vital sign monitoring, occupant localization, and classification; (2) long‑range ISAC leveraging cellular infrastructure and high‑definition maps for non‑line‑of‑sight detection of occluded road users (e.g., to mitigate crashes at intersections and highway merges), and evolution of dual‑purpose radar sensors supporting both high‑resolution perception and high‑bandwidth links to the network edge; (3) aerospace ISAC applications encompassing UAV/drone traffic management with integrated sensing and communication, aircraft collision avoidance systems combining radar sensing with air‑to‑air and air‑to‑ground data links, airport surface surveillance, and satellite‑based ISAC for simultaneous Earth observation and communication services.

As demand grows for high-frequency, high-bandwidth wireless connectivity, system designers face challenges balancing performance, power efficiency, and thermal management. This workshop explores Analog Devices’ mmWave technology evolution—from discrete RF components to integrated reference designs—highlighting solutions across generations of analog beamforming, frequency conversion, and frequency generation. Attendees will learn how ADI’s system-level innovations enable higher linear output power while maintaining strict power limits, reducing thermal complexity. Through technical discussions, design examples, and benchmarks, the session demonstrates how ADI’s scalable mmWave solutions accelerate development and meet the demands of next-generation wireless infrastructure including 5G FR2, FWA, and satellite communications.

Join our diverse team of engineers and discover how ADI’s first ever Software Defined Modem, integrated into the Nevis Narrowband Transceiver, is enabling smaller, lighter, and lower power radios than ever before while still delivering state of the art RF performance. This workshop combines theory with real-world performance data and real-time demonstrations to illustrate how users can leverage Nevis to advance the state of the art in their own radio designs. As a practical example, ADI will present how the combination of an SDR & SDM is being leveraged to create a new generation of Land Mobile Radios.

Modern technology is driving higher data rates and wider bandwidths. Communication standards such as 5G, 802.11, and satellites are driving power amplifier (PA) designers to develop amplifiers with ever-wider bandwidths.

As bandwidth increases PAs memory effects become more pronounced, making accurate memory effect characterization more critical than ever. Additionally, efficiency requirements push the PAs further into non-linearity. Both topics are critical for digital predistortion (DPD) techniques.

Different instrument classes are available for measuring wideband PAs. This workshop will compare data obtained from vector network analyzers (VNAs) and from vector signal generator/spectrum analyzer setups.

This workshop shed light on end-to-end process that transforms advanced electromagnetic designs into manufacturable, reliable hardware for demanding applications such as satellite payloads, radar systems, and next-generation communication networks. Beginning with rigorous electromagnetic simulation and optimization, design phase integrates thermal, mechanical, and additionally Multipactor analyses to ensure high power handling and minimal insertion loss. Speakers share unique design and engineering challenges as well as uncover recent innovations in achieving exceptionally tight tolerances, thermal stability, and design robustness across complete lifecycle of consolidated RF waveguide components—from initial electromagnetic design through precision machining, surface finishing, and final qualification.

Quantum technologies such as quantum computing are rapidly evolving from theoretical promise to technological frontier, driven in large part by innovations in microwave engineering. At the heart of many quantum platforms — especially superconducting qubits — lie microwave signals and components that enable precise control and readout of quantum states. These systems operate in extreme cryogenic environments, often at temperatures below 50 millikelvin, where conventional microwave techniques face unprecedented constraints. As quantum processors scale to accommodate hundreds or thousands of qubits, the microwave infrastructure required to support them grows exponentially. This includes a dense network of coaxial cabling, attenuators, filters, amplifiers, and interconnects, all of which must perform reliably under cryogenic conditions. The resulting demands on thermal management, spatial efficiency, and signal fidelity are formidable, and they call for a new generation of microwave design and metrology tailored to quantum applications. This workshop will explore the role of microwave technologies in enabling quantum control and readout and examine the unique challenges of cryogenic measurements for semiconductor and superconductor components. Topics will include calibration and uncertainty analysis in quantum-limited regimes, design strategies for minimizing heat load while maximizing signal integrity, and the development of emerging standards for benchmarking quantum hardware. Attendees will hear from a diverse lineup of speakers including quantum system developers, microwave instrument manufacturers, academic researchers, and national metrology institutes, who are tackling the practical challenges of building scalable quantum computers.

ICT and electronics are responsible for 2–4% of global emissions and potentially over 50% of the critical minerals consumption per capita, mostly attributed to the manufacturing of semiconductor devices. Microwave technologies underpin telecommunications and are a major energy consumer; emerging microwave technologies also have the potential to make electronics, and the world, more sustainable. This workshop will provide a holistic view of how sustainability and microwave technologies interact, across three main areas: (1) The sustainability of microwave devices and wireless networks, and more broadly electronics, with a focus on semiconductors and Life Cycle Assessments (LCAs); (2) Microwave technologies for sustainable sensing and identification, with a focus on RFID technologies and sustainable chipless solutions; (3) Microwave wireless power transfer (WPT) and its role in sustainability, from battery-less IoT to space-based “Net-Zero” energy generation. The workshop will start by introducing microwave engineers to areas ranging from RFICs/MMICs to passive technologies and systems, to quantifying sustainability. LCA will be introduced as a methodology which can be used to quantify the footprint of both specific electronic devices, with a focus on integrated circuits/chips, and of systems. LCA will then be applied to a range of technologies, including emerging mm-wave/THz links, RFID (UHF and chipless), and IoT applications. Given the central role of semiconductors, sustainable chip manufacturing and integration will be introduced, including a strong focus on industrial insights. These will be provided by opinions from activities across Europe, the US, and the UK, with a focus on industrially co-created insights. Methods for adopting “circular economy” principles and allowing RFICs and MMICs to be recycled and reused will be introduced. Frameworks for design-for-recycling will be discussed, highlighting challenges around reliability and commercialisation. The last technical aspect will explore the role of microwaves in creating a more sustainable world. Wireless Power Transfer (WPT), both terrestrial (low-power) and space-based (high-power) will be introduced as sustainable technologies for green energy. Chipless RFID and circular/low-waste RFID tags will also be discussed, as exemplars of how microwave-enabled tech could enable more supply chains. The workshop’s primary aim is to deepen the understanding of sustainability challenges across the microwave community. With the workshop speakers coming from a range of backgrounds and having active roles within the community, including 2 Editors-in-Chief (EiCs) of microwave journals, and multiple Topic Editors and Distinguished Microwave Lecturers (DMLs), we will conclude with an interactive panel discussion reflecting upon the sustainability challenges and seeking audience interaction. The panel will be primarily driven by the audience’s questions, and will be followed by a breakout and networking time to allow the attendees to connect with the speakers.

Electromagnetic fields from low frequency to sub-mm-wave (THz) are attracting much interest for biological, healthcare and agriculture precision applications. Among them is the possibility to non-invasively analyze living organisms at various scales, from individual cells to tissues and organs, for in-vitro and in-vivo investigations. With the advent of machine-learning techniques, the intrinsic variability of living organisms can be increasingly taken into account and offer new perspectives for detection and applications. This workshop will address the latest advances in microwave, mm-wave and sub-mm-wave biosensing and probing instruments suitable for molecular-scale to organ-scale investigations during in-vitro and in-vivo studies. Accurate biological sample characterization and analysis will be highlighted with resonant or broadband approaches with respect to the target applications, with main aims of early diseases’ diagnosis and prognosis. The integration of machine-learning techniques is becoming more common in biomedical investigations and enables further advances in detection accuracy and limits. Examples will be discussed, demonstrating its undoubted interest and increased use in the near future. A large space for discussion and interactions between speakers and attendees will be kept open during the day.

This workshop discusses the implementation, configuration, and operation of a comprehensive stand-alone open-source 5G end-to-end testbed to enable 5G research, development, and prototyping. The testbed provides a 5G SA FR1 and FR3 platform based on the OAI software stack and the USRP radio, for operation both over-the-air (OTA) and via coax cable. The testbed includes the all the primary system components: the core network; the basestation (gNB); and three implementations of the handset (UE). We will discuss in detail the full procedure for building this testbed, highlight several practical use-cases, and explore troubleshooting steps.

Recently, powder-bed fusion metal additive manufacturing (AM) process has matured as a breakthrough technology for the development of RF and microwave components such as waveguides, filters as well as antennas. Additive Manufacturing of RF Waveguide Components showed several advantages over the traditional/conventional machining process especially when it comes to part weight reduction and design flexibility. Critical discussions will also cover the challenges that remain. Surface roughness, material anisotropy, and process variability can degrade RF performance if not properly managed. Standards for material characterization, dimensional accuracy, and RF testing are still evolving.

This inter-society technical panel will emphasize the urgent need for sustainable growth within the RF industry, particularly through the development of standards for measuring the carbon footprint of RF technologies. Today, the environmental impact of RF systems extends across the full lifecycle—from manufacturing processes and material usage to deployment, energy consumption, and long-term operation. However, the absence of consistent measurement frameworks makes it difficult to evaluate, compare, and ultimately reduce these impacts in a systematic way.
The panel will bring together experts from multiple societies to explore how collective action can establish widely accepted methodologies and best practices for carbon footprint assessment in RF technologies. By working across organizational boundaries, societies can not only help define these standards but also provide strategic guidance to industry, academia, and policymakers. Such efforts are critical to ensuring that sustainability becomes a foundational consideration in future RF innovations rather than an afterthought.
Ultimately, the discussion will highlight how professional societies can play a pivotal role in shaping a greener future for the RF industry—by fostering collaboration, driving standardization, and offering direction to reduce carbon emissions across both manufacturing and operational domains.

Artificial Intelligence is revolutionizing microwave circuit design, just as it is transforming other scientific and industrial domains. The growing number of published research papers demonstrates that the microwave community is actively embracing AI and ML across a wide spectrum of applications—from novel device modeling to virtual data generation, data management, and advanced EDA tools for circuit optimization. New commercial solutions for ML-assisted circuit design, already offer first-pass, fully automated layout generation, multi-objective optimization, and seamless multi-platform integration from device to system level. This evolving landscape suggests a progressive shift in researchers' focus from traditional design practices toward a complex interplay involving the development of custom, high-accuracy, dynamically reconfigurable models, advanced EDA algorithms, and ML workflows.
Are we ready for this revolution? Can we truly trust AI/ML-driven design? Will AI really help to uncover entirely new device concepts and circuit topologies, or will it remain a highly capable design assistant? What tools and skills are needed to become active contributors in this new paradigm?
This panel will bring together experts from foundries, model development, and EDA vendors to critically examine the pros and cons, practical implications, IP constraints and future directions of AI-assisted microwave circuit design.

This workshop focuses on leveraging phase information in RF device characterization using the Rohde & Schwarz ZN-ZCG phase reference. It is tailored for engineers, technicians, and researchers aiming to enhance measurement accuracy through advanced phase reference techniques in VNAs and VSAs/VSGs.
Accurate RF measurements extend beyond amplitude: Understanding and utilizing phase information is essential. This workshop introduces the signal comb — a versatile phase reference tool — and demonstrates how it serves as a comprehensive solution for calibration and broadband verification, improving the precision of amplitude and phase measurements in diverse RF applications.

As RF systems expand into higher frequencies and wider bandwidths, preserving signal integrity and fidelity has become a universal challenge. This panel will explore how advances in interconnects, passives, and active RF components address core engineering concerns, including minimizing loss, noise, and distortion, while optimizing SWaP-C, reliability, and repeatability. By presenting perspectives across the signal chain, the discussion will highlight real-world tradeoffs, integration challenges, and emerging technologies. Attendees will gain practical guidance on selecting, integrating, and optimizing components for next-generation, mission-critical applications in aerospace, defense, and communications, including phased array systems, space systems, and advanced microwave architectures.

In the world of the most advanced and demanding RF/mmWave integrated circuits, designers look to Synopsys, Ansys (part of Synopsys) and Keysight to outfit them with the best-in-class set of AI-driven IC design and layout, circuit simulation and EM analysis software.<br />
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In this workshop and tutorial, experts from Synopsys and Keysight will walk designers through such a flow. It starts inside Synopsys’ Custom Compiler where designers will put their ideas down on the most feature-rich yet intuitive design canvas. Synopsys’ ASO.ai is unleashing the power of AI to analog and RF/mmWave IC design. Critical signal paths and devices will be extracted and modeled by Keysight RFPro EM if the Method of Moment analysis is the most appropriate, or by Ansys’ HFSS if a full 3D Finite Element Method is the most appropriate. This workshop will explain to participants how this choice can be best made.<br />
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We will then show how Synopsys’ PrimeWave can be used to assemble the design, models, and build test benches (with Keysight’s Virtual Test Benches) as well as define critical measurements to characterize the IC. A full description of this IC will be simulated in Keysight’s Nexus or GoldeGate RFIC simulators.<br />
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For designers looking to use native capabilities in Keysight’s ADS, we will also demonstrate how a design can seamlessly work in Keysight ADS seamlessly and Synopsys’ Custom Compiler.<br />
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At the conclusion of this workshop, designers will have experienced the best flow to ensure a first-time success tape out of an RF integrated circuit.

Phased array antennas (PAA) play a crucial role in satellite communications, where circular polarization (CP) and simultaneous multiple beams are employed to enhance capacity, coverage, and reliability.
This workshop will focus on evaluating CP performance of PAAs operating in multibeam hybrid configurations, enabling independent polarizations for each beam, including left-hand circular polarization (LHCP), right-hand circular polarization (RHCP), horizontal or vertical polarization (H- or V-pol).
We will delve into the design of a PAA with 256 elements, discuss measured performance, and provide a live demonstration of how to conduct over-the-air testing using a multi-reflector compact antenna test range.