IMS2026 Technical Program

The field of quantum computing relies heavily on the advancements in microwave technology. However, a gap exists between the microwave engineering community and the quantum research effort. To bridge this divide and propel the quantum industry forward, it is crucial to cultivate a new generation of engineers proficient in both microwave engineering and quantum physics. These multidisciplinary experts will be essential in driving innovation in quantum sensing, communication, and the control of quantum computing platforms, particularly those based on superconducting qubits. Initiatives like the Quantum Boot Camp aim to address this need by providing microwave engineers with foundational knowledge in quantum engineering, emphasizing the design, fabrication, control, and measurement of quantum systems. By equipping engineers with this expertise, the program seeks to empower them to contribute meaningfully to this rapidly evolving technological landscape. The program caters to a diverse audience, including recent graduates, career changers, and marketing professionals, all seeking to deepen their understanding of quantum technology and its practical implications.

Distributed Amplifier (DA) architectures have long been valued for their ability to deliver exceptionally wide bandwidths. In recent years, new design strategies and circuit techniques in various technologies have dramatically expanded their potential in applications ranging from high-speed optical and wireless communication to defense, instrumentation, radar, and sensing. This workshop will provide a comprehensive overview of recent research and development in distributed amplifiers, focusing on performance improvements across bandwidth, output power, linearity, noise, and efficiency enhancement. Emphasis will be given to implementations across multiple technology platforms including CMOS, SiGe BiCMOS, GaN, and InP technologies, highlighting the unique opportunities and challenges in each domain.

The ever-increasing demand for higher network capacity, and the volume of different devices that need connectivity, require innovative solutions. In mobile applications, this demand is addressed in 5G and 6G networks by using microwave links with massive Multiple-Input Multiple-Output (MIMO) antenna arrays to support high data-rate connectivity between large number of devices with improved coverage. However, the capacity is still limited by the available RF spectrum. Radio-over-fiber (RoF) systems combined with MIMO technology offer a flexible and powerful solution for extending the reach and improving the performance of wireless networks. In data center application, the hybrid opto-electrical links presents numerous advantages over single technology solutions. Energy efficiency, higher throughput, scalability and cost can be optimized by proper convergence of the two technologies. In this workshop, experts from industry and academia will discuss the latest developments in the convergence of the opto-electrical technology as applied to mobile networks and data center connectivity.

This bootcamp will present the basics of AI/machine learning (ML) and their applications to microwave engineering. It is intended for engineers who want to learn the basics of AI/ML or are interested in using AI/ML for microwave applications, marketing and sales professionals who are interested in understanding the basics and relevance of AI/ML for microwaves, professionals with AI/ML expertise seeking to explore potential applications to MHz-to-THz technologies, and university students who like to acquire the basic knowledge of AI/ML. To this end, the bootcamp includes introductory presentations on the fundamentals of AI/ML, covering supervised, unsupervised and reinforcement learning. Moreover, we will introduce common types of neural networks such as fully connected artificial neural networks (ANNs), convolutional neural networks (CNNs), recurrent neural networks (RNNs), long-short term memory networks (LSTMs), generative adversarial networks (GANs). We will discuss their function, training cost, relative advantages and limitations, as well as their suitability to various applications. We will also introduce concepts such as generalizability (i.e. the accuracy of neural networks to cases outside their training set) and overfitting (when the network learns training data well, but fails to generalize to new cases). Examples of applications of AI/ML to microwave engineering to be presented include: electromagnetic modeling and optimization, microwave filter modeling/design, GaN HEMT modeling, Doppler radar based human motion recognition, gesture recognition and object identification, radio coverage prediction and design optimization of reconfigurable intelligent surfaces. The course will provide ample opportunities for audience interaction and Q&A.

This workshop will present recent breakthroughs in the design of Voltage Controlled Oscillators (VCOs) and frequency multipliers, with a focus on innovations spanning the microwave, mm-wave, and sub-THz frequency bands. As these components are critical enablers in emerging communication, radar, and sensing systems, the workshop will cover both theoretical insights and practical design strategies that push the boundaries of performance, integration, and power efficiency. Bringing together leading experts from both academia and industry, the sessions will highlight state-of-the-art circuit techniques, emerging device technologies, and system-level considerations. Presentations will explore various aspects of VCO and frequency multiplier design, aiming to achieve low noise, wide tuning range, and high efficiency. The workshop will also address key challenges in scaling designs to higher frequencies and more compact integration.

The workshop takes a deep dive into systems and circuits at the forefront of the next generation wireless technology for commercial and defense applications. Bringing together leading experts from both academia and industry, the talks will highlight trade-offs in MIMO systems that motivate the use of analog, digital and hybrid beamforming with a focus on parameters like coverage, spectral and energy efficiency, bandwidth and throughput. Emerging device technologies, state-of-the-art design techniques for RF, analog and digital circuits, advanced packaging integration and thermal management will also be presented, providing a comprehensive view of the direction in which wireless systems are heading.

Generative AI and Large Language Models (LLMs) are beginning to change how electromagnetic and RF systems are specified, synthesized, and verified. Although these tools are common in software and data science, their use in microwave engineering is nascent and requires careful, physics-aware evaluation. This full-day workshop spotlights state-of-the-art methods that connect AI generation to EM reality, moving beyond proofs-of-concept toward validated models and workflows engineers can use today. Technical content centers on three pillars — (1) Inverse EM / spec-to-layout and end-to-end design: “Generative AI Methods for Wireless Propagation Prediction” (Costas Sarris) shows diffusion and GANs for real-time, generalizable indoor propagation maps and super-resolution; “AI-enabled End-to-End RF and RFIC Design” (Kaushik Sengupta) discusses inverse-design and generative AI approaches for automated synthesis of complex RF passives, multi-port elements, antennas, and spec-to-GDS RFIC flows combining reinforcement learning and inverse design; “Empowering Optimal Design of RF Devices by Generative AI” (Dominique Baillargeat and Francisco Chinesta) introduces rank-reduction autoencoders as generative surrogates for RF circuits and antennas; “An Autonomous Agentic Framework for Deep Inverse Photonic Design” (Willie Padilla) presents an agentic, autonomous inverse-design workflow for metamaterials, illustrating how AI agents can accelerate spectrum-to-structure design paradigms relevant across EM domains — (2) LLM-augmented EDA workflows and ML foundations: “Practical Considerations for Applying AI to RF and Microwave EDA Workflows” (Matthew Ozalas) and “Accelerating Innovation: AI-Driven Advances in Sigrity, Clarity, and Optimality” (Jian Liu) highlight Keysight’s and Cadence’s strategies for GenAI/LLM-aided design; Complementary talks cover attention mechanisms for non-linear circuit modeling (Qi-Jun Zhang) and multiphysics-informed, data-free ML for RFIC design (Dan Jiao) — (3) Multimodal LLMs: “Multimodal LLMs for Electromagnetic Waves” (Zhi Jackie Yao) fuses image-based EM data with text via a BLIP bridge into pretrained LLMs for EM reasoning and design assistance. Rigor and trust will be discussed throughout. Talks and discussion will cover dataset curation, generalization, solver-in-the-loop constraints (passivity/causality/manufacturability), independent EM/measurement validation, and secure integration into EDA flows, along with practical guardrails to avoid hallucinations and constraint violations. For attendees new to this intersection, the workshop includes short primers, reproducible examples, and simple evaluation checklists to separate signal from hype.

Next-generation wireless systems Beyond-5G will place unprecedented demands on radio front-ends across all frequency ranges, from sub-6GHz (FR1) to the upper mid-band (FR3) and into mm-wave spectrum. Each band presents its own trade-offs in terms of coverage, capacity, propagation, and spectrum availability, but they share common challenges: fragmented allocations, coexistence with incumbent services, and the need for spectrally agile, energy-efficient, and highly integrated transceivers. The upper mid-band (FR3, ∼6–24GHz) is a prime example. Compared to congested FR1 allocations, it offers an order of magnitude more bandwidth, while avoiding some of the severe propagation penalties of mm-wave frequencies above 28GHz. These advantages make FR3 highly attractive for wide-area enhanced broadband and low-latency applications, but also introduce stringent coexistence requirements with incumbent scientific, defense, and satellite users. The resulting emphasis on spectrum awareness and frequency agility highlights design challenges that resonate across all frequency ranges. This workshop will explore the circuit- and architecture-level innovations needed to enable broadband, reconfigurable, and spectrally agile radios. Topics include: Wideband, reconfigurable LNAs and PAs with high linearity and efficiency; Frequency-agile local oscillators and synthesizers with fast switching, low phase noise, and fine resolution; Wideband filtering and duplexing strategies using tunable, switched-capacitor, or acoustic/EM-based solutions; Digital-assisted calibration and adaptation, including ML-based techniques for resilience against PVT variations; Scalable architectures in advanced CMOS and SiGe technologies, enabling multi-band, multi-standard, and multi-antenna integration with energy efficiency. By bringing together experts from academia, industry, and government laboratories, the workshop will highlight state-of-the-art circuit techniques and cross-layer considerations — including spectrum policy, system-level trade-offs, and co-designed RF/digital intelligence — that are critical to realizing the next generation of programmable, energy-efficient, spectrally agile radios.

Are we there yet? — a world where radios and SoCs for IoT and countless other domains are truly battery free? What would it take to go beyond a smart toaster to a future with ubiquitous ambiently powered sensors that work seamlessly with the existing wireless devices and infrastructure. This workshop addresses these questions by bringing together a unique mix of top industry, research and academic speakers with expertise ranging from RFICs to SoCs. Apart from the current state of the low-power radios, the talks will discuss circuits and system architectures that have the potential to achieve 1000× improvements in energy efficiency. The workshop and concluding panel session also aims to explore salient features which the front-ends, integrated energy harvesters, and overall systems must provide to continue the evolution of ambient IoTs.

This workshop will focus on the design and implementation of FR3 Power Amplifiers. It will cover technology considerations, circuit implementation and topology consideration for PAs in this frequency range. Both Silicon, GaAs and GaN circuit examples and techniques are discussed, as well as DPD and broadband circuit techniques. The speakers are from both academia and industry.

The ever-increasing demand for high-throughput communication links and high-resolution radar sensors is driving the development of future wireless systems at higher operating frequencies, from mm-wave to sub-THz bands. The flexibility required from these systems to support multiple functionalities leads to the adoption of large phased array antennas and complex System-in-Package (SiP) Bit-to-RF or Optical-to-RF solutions. Heterogeneous technologies and vertical 3D integration will play a vital role in enhancing performance and functional density while reducing the size and cost of next-generation RF systems. However, the shift to 3DHI also introduces a new set of challenges, ranging from novel processes and substrates to RFIC/MMIC design, packaging and thermal management. This workshop brings together leading experts from academia and industry to present the latest advances and design methodologies in heterogeneous integration and advanced packaging technologies for mm-wave and sub-THz applications. The talks span a wide range of critical topics, including interposer-based system integration, advanced simulation techniques, integration of III-V technologies, SiGe and CMOS platform optimization, and co-packaged system testing and calibration.

The rapid progress in quantum computing has made microwave engineering a key enabler of nearly all major hardware platforms, including superconducting qubits, spin qubits, trapped ions, etc. Each of these technologies relies on advanced microwave techniques for control, coupling, readout, and scaling, demanding approaches that go well beyond classical electromagnetics. This creates a great opportunity for microwave engineers to make lasting contributions to the development of quantum computing and related technologies. The need for ultra-low-noise amplification, high-fidelity readout, and crosstalk suppression has stimulated novel device designs, often requiring hybrid approaches that combine electromagnetic modeling with quantum theory. Similar challenges appear in other quantum platforms; for example, trapped-ion processors demand stable and phase-coherent microwave delivery for multi-qubit gates, while spin qubits rely on advanced microwave control schemes. At the algorithmic level, quantum computing is increasingly viewed as a potential game-changer for electromagnetics and related fields. Specialized quantum algorithms promise significant acceleration for tasks such as solving integral equations, optimizing antenna radiation patterns, or addressing NP-hard problems in inverse scattering and system design. While fully fault-tolerant quantum computing remains a long-term goal, near-term noisy intermediate-scale quantum devices are already serving as valuable testbeds. Hardware-aware algorithm design, ie tailoring quantum algorithms to the specific strengths and limitations of physical devices, is becoming an essential strategy for identifying useful applications in the presence of noise and limited coherence times. This workshop will highlight state-of-the-art advances at the interface of microwave engineering, quantum hardware development, and quantum algorithm design. Contributions will cover multiple quantum platforms, emphasizing both their unique microwave engineering challenges and the unifying principles that connect them. A particular focus will be placed on industrial perspectives, including scalability, reliability, and manufacturability of microwave components for large-scale quantum systems. Industry engagement is crucial, as commercial interest and investment in quantum computing have surged dramatically, creating demand for engineers who can translate fundamental concepts into deployable technologies. To ensure accessibility, the workshop will open with a comprehensive tutorial introducing the basics of quantum theory in the language of microwave engineering. This will help participants from the RF and microwave community engage with the specialized concepts of quantum physics and better appreciate their role in quantum device design. The program will then feature a series of invited talks from leading experts in academia and industry, with topics spanning theoretical methods, quantum hardware, and algorithmic perspectives. By bringing together specialists from diverse quantum hardware platforms, algorithm developers, and industrial leaders, this workshop will provide a unique forum for exchanging ideas, identifying cross-platform synergies, and further drafting the engineering roadmap toward practical, scalable quantum computing.

With the operating frequencies of 6G wireless communications and next-generation automotive radars extending above 110GHz, accurate and robust on-wafer measurements are essential for enabling design, model verification, and industrialization. While a solid foundation has been established over the past decades in calibration methodologies and measurement platforms, many challenges remain as research and development move deeper into the sub-THz domain. As advanced devices, circuits, interposers/packaging technologies emerge alongside high-frequency systems, new measurement scenarios and calibration requirements continue to arise. At the same time, new methodologies such as AI-driven automation, advanced calibration algorithms, and novel calibration substrates are being developed to address these evolving needs. This full-day workshop brings together international experts from national metrology institutes, academia, and industry to address these challenges from complementary perspectives. The program begins with a focus on the fundamentals of calibration and measurement, reviewing the state-of-the-art in instrumentation, calibration techniques, and traceability at mm-wave frequencies, followed by comprehensive design guidance for calibration standards and systematic analysis of probe-induced uncertainties. These sessions lay the foundation for reliable and reproducible on-wafer measurements at sub-THz frequencies, offering both the theoretical framework and practical guidance needed for advancing calibration practices. The workshop then transitions to next-generation tools and methodologies that are extending the state-of-the-art. Topics include AI-driven nano-robotic probe stations that achieve sub-micron alignment and reproducible probe placement, calibration algorithms that go beyond conventional error models to capture mode conversion and crosstalk, and the development of GaAs impedance standard substrates supporting diverse calibration standards and measurement scenarios. Recent advances in broadband vector network analyzer technology will also be presented, including single-sweep measurements up to 250GHz and new calibration capabilities. These contributions demonstrate how innovative approaches are being translated into practical platforms, enhancing both robustness and scalability. Finally, the workshop highlights applications and industrial implementations. Talks will show how advanced calibration and measurement techniques are applied in wafer-scale silicon interposer technologies — addressing stackup choices, GSG pad design, and multimode suppression — as well as in high-volume silicon device testing for next-generation components. Presentations from industrial experts will emphasize optimizing calibration substrates, comparing methodologies such as modal versus SOLR calibration, and reducing measurement uncertainties under real manufacturing constraints. Together, these examples illustrate how academic innovation and industrial practice are converging to enable accurate and traceable measurements at scale. By covering the full spectrum from fundamentals to industrialization, this workshop offers participants both foundational insights and exposure to cutting-edge solutions. The day will conclude with an open discussion, providing a forum to exchange ideas, identify open challenges, and shape the roadmap for accurate, scalable, and robust on-wafer sub-THz measurements.

The D-band frequency range is gaining attention for both radar and communication applications due to potential system miniaturization related to smaller wavelength and the possibility of having larger bandwidth. There is an ongoing frequency regulation activity at ETSI, ECC and FCC on standardization of new frequency bands, targeting bandwidth >10GHz. Large bandwidth is beneficial for radar to achieve good range resolution, while for communication applications one can achieve higher data-rates. Pushing operation frequencies even further beyond the D-band towards 300GHz may offer even more potentially large available unregulated bandwidth. However, these high operation frequencies reach the technological limits imposed by the available CMOS processes. Operating the transistors at frequencies beyond half of the achievable ft/fmax makes it very difficult to obtain sufficient gain and power from an amplifier stage. One possible solution would be to use III-V technologies, which offer ft/fmax frequencies by far exceeding those of advanced CMOS nodes. Still, the possibility of integrating the mm-wave front-end with the digital baseband on the same chip makes CMOS very attractive despite this mentioned drawback. Another challenge that comes at higher frequencies are the higher losses of the interconnects. The packaging possibilities. Realization of antennas (on-chip or in-package?). As well, much higher propagation losses make the link budget very challenging and make it very hard to reach ranging or communication over large distances. In this full-day workshop we will address exactly these questions: (a) does it make sense to go to frequencies above 100GHz? Or shall we stay in the comfort zone below 100GHz?; (b) for which applications does it makes sense at all?; (c) what are the circuit related challenges in silicon-based technologies and how can we solve them?; (d) what are the challenges not only to build an SoC, but to actually build a system >100GHz?; (e) discuss emerging applications that might profit by very high frequencies. Level budget considerations for various mm-wave systems will be discussed. Fair and unbiased opinions will be given by experts. The workshop features distinguished speakers from leading companies and academia, who will present their view on mm-wave circuits >100GHz, as well as sharing their “best practice” on how to design mm-wave circuits. A brief concluding discussion will round-off the workshop to summarize the key learnings on the wide range of aspects presented during the day.

Scaled antenna arrays that support multiple simultaneous beams can enable significant throughput improvements and new capabilities for both communications and sensing applications. These benefits provide the form-factor and spectral efficiencies required for next generation wireless systems. However, beam scaling also scales up traditional design challenges and creates new implementation hurdles. For example, handling the signal distribution and processing for hundreds of antennas and tens of beams quickly results in stages that are power and thermally infeasible. Innovations in multi-beam array architectures are indispensable to overcoming these challenges for emerging satellite communications, radar, and 6G applications. To succeed in real-world deployments these innovations must be developed with resilience, cost-effectiveness, and hardware scalability considerations in mind. This workshop explores specifically multi-beam topics with an array of experts presenting their work on re-imagining how to architect and build point-to-multi-point arrays at scale. Approaches for beam-scaling in frequency, space, and time will be explored and hardware implementations that range from RF-centric to mostly digital will be covered. The goal is to provide attendees with an in-depth overview of this emerging area of antenna array design, and cast light on trade-offs and future directions.

Increasing demand for continuous information flow and uninterrupted connectivity requires next-generation communication and sensing systems to support higher data-rates and wideband operation. As a result, wireless systems are moving to higher frequencies, offering wider bandwidth and higher channel capacity, while simultaneously reducing the system size. Although lower mm-wave bands, such as V-band (40–75GHz), have been explored as a potential solution to meet the demand for high-speed connectivity, the elevated levels of atmospheric attenuation create an additional challenge for maintaining signal power in wireless transmission over long distances. On the other hand, the upper portion of the mm-wave spectrum at 110–300GHz, also known as G-band, offers a promising path to achieve higher data-rates in point-to-point links, defense applications, localization, ranging, and other multi-user communication scenarios as the underutilized portion of the EM spectrum, while enabling higher resolution in radars and other sensing systems for biomedical or security screening and also reducing the size of all these systems. The sub-THz spectrum above 200GHz is of particular interest due to lower atmospheric attenuation. However, building high-performance integrated circuits and systems at G-band poses significant disadvantages due to the lower available gain of the transistors and higher noise contribution from components, leading to higher power consumption and reduced sensitivity at these sub-THz frequencies. Therefore, a combination of advanced circuit design techniques and system-level innovations, state-of-the-art high-speed devices harnessing the properties of compound semiconductors, heterogeneous integration, and co-design with packaging is essential to overcome the inherent challenges of the G-band design space. This workshop provides a comprehensive and in-depth review of the latest academic and industrial research on innovative techniques and cutting-edge technologies for realizing high-data-rate wireless communication and radar systems at 110–300GHz across SiGe, scaled-CMOS, InP, and GaN platforms, with particular focus on designs above 200GHz in the upper G-band. First, novel circuit techniques and topologies to enable high-power generation with maximum power efficiency, advanced high-speed device design and optimization in compound semiconductor processes, as well as III-V RF front-ends and hybrid InP/CMOS phased arrays above 200GHz, will be presented. State-of-the-art SiGe BiCMOS transceiver arrays across the entire G-band will be showcased with an emphasis on ultra-compact design and 2D scalability, along with multiple demonstrations of modular beamforming ICs supporting up to 200Gbps wireless transmission, wideband radar transceiver chips for integration in large MIMO arrays, and upper G-band MMICs enabling radar systems with multi-target resolution down to a few millimeters while maintaining an absolute ranging accuracy on the order of 1µm. In addition, system- and circuit-level design considerations for record-low-power CMOS radar sensor systems will be reviewed. Finally, co-design and co-integration of sub-THz ICs in SiGe and SOI with glass interposer technology and 3-D Heterogeneous Integrated (3DHI) phased arrays incorporating an antenna on glass, GaN-on-SiC MMICs, a silicon interposer, and a silicon Beam Forming Integrated Circuit (BFIC) will be presented as a pathway toward end-to-end communication modules in G-band for commercial and defense applications.

Emerging applications such as Low Earth Orbit (LEO) satellite-based internet and geolocation services are rapidly expanding, driven by commercial efforts to deliver low-cost satellite connectivity to consumers. However, space environments present unique challenges not encountered in terrestrial systems, including radiation-induced errors, extreme temperature fluctuations, and limited power availability. Systems operating beyond LEO face even more severe higher levels of environmental degradations. This workshop will bring together leading experts from academia and industry, spanning both LEO SATCOM and traditional space-based systems, to provide a comprehensive overview of the key design challenges and state-of-the-art techniques required for reliable RF system performance in space.

Abstract:
In this lecture, mixer-first architectures are introduced. These architectures do not use a low noise amplifier, but a low loss passive mixer instead. These passive mixers exhibit very good linearity and also offer the option of narrow-band RF filtering right at the input of the mixer. This makes the mixer-first receiver a good candidate for application where interference is a challenge. The RF filtering is achieved by exploiting the mixer in a so-called N-path filter, which is a filtering technique from forgotten times.

New ideas like higher-order filtering, and passive voltage gain by stacking capacitors, will also be presented in this lecture. An outlook of fully passive receivers, without active linear amplification is also given as a possible future direction.

BIO:
Bram Nauta was born in Hengelo, The Netherlands. In 1987, he received the M.Sc. degree and the Ph.D. degree, both from the University of Twente, Enschede, The Netherlands. In 1991, he joined the Mixed-Signal Circuits and Systems Department of Philips Research, Eindhoven, the Netherlands. In 1998, he returned to the University of Twente as a full professor, heading the IC Design group, and he was nominated as a distinguished professor in 2014.

He served as the Editor-in-Chief (2007-2010) of the IEEE Journal of Solid-State Circuits (JSSC) and was the 2013 program chair of the International Solid-State Circuits Conference (ISSCC). He served as the President of the IEEE Solid-State Circuits Society (2018-2019 term).

As our society and economy continue to accelerate toward digitalization, the density of connected wireless nodes is increasing rapidly—with estimates suggesting up to ten million devices operating within a single square kilometer. This unprecedented growth raises major sustainability challenges, particularly due to the widespread use of batteries for powering wireless devices. Wireless Power Transfer (WPT) offers a transformative solution by delivering power without physical connections or disposable energy sources. By reducing dependence on batteries and minimizing material waste, WPT technologies contribute to a more sustainable, cost-effective, and scalable infrastructure for the connected world. The WPT Boot Camp at IMS 2026 will introduce participants to both near-field and far-field WPT technologies in a format that integrates industrial and academic perspectives. Industry speakers will present the current state of the art, including commercially available systems, standardization efforts, and emerging market opportunities. Academic experts will complement these talks with discussions on the theoretical foundations and ongoing research aimed at pushing WPT capabilities beyond existing limits. A central feature of the boot camp will be live demonstrations, giving participants hands-on experience with operational WPT systems and the opportunity to interact directly with the presenters. This highly interactive format ensures that attendees gain both a practical understanding of existing solutions and insights into future technological directions. The boot camp is open to engineers, students, and professionals from industry and academia who wish to deepen their understanding of WPT technologies, explore their applications, and engage with experts driving innovation in this rapidly evolving field.

Next-generation communications and sensing systems operating in the mm-wave range require a collaborative effort among the various components that make up the subsystems to enhance performance and reduce production costs. This workshop will bring together leading researchers from different fields of mm-wave phased arrays to discuss the key requirements and challenges relevant to their areas of expertise. The half-day workshop will kick off with a unique perspective on mm-wave phased arrays from industry and government representatives, providing context for the challenges and requirements in this field. The remainder of the workshop will feature internationally renowned speakers specializing in transistors, integrated circuits, packaging, and heterogeneous integration, as well as phased arrays. Interactive discussions will be prioritized throughout the event to encourage engagement among participants.

The frontier of next-generation radar is shaped by advances in mm-wave, UWB, and AI-assisted phased array technologies. In the D-Band, SiGe implementations enable instantaneous bandwidths up to 56GHz, delivering millimeter-level resolution and unlocking applications in imaging, non-destructive testing, and metrology. In parallel, UWB radar provides low-power, high-precision sensing for presence detection, vital-sign monitoring, and in-cabin safety. Complementing these developments, AI-driven phased arrays are emerging as enablers of adaptive beamforming, joint radar-communications (ISAC), and scalable multi-antenna architectures. This talk will highlight circuit and system design challenges, analog front-end techniques, and prototype results, illustrating how SiGe mm-wave, UWB, and AI-enhanced phased arrays together define the future of high-resolution radar.

This session presents recent advances in highly integrated RF transceiver and beamforming architectures that enable next‑generation wireless infrastructure and high‑resolution sensing. The talks span a wide range of mmWave applications, including a 57–67 GHz four‑channel transmitter with fine‑resolution phase shifting and built‑in self‑test for Doppler‑offset FMCW radar, a high‑linearity K‑band multi‑beam transmitter IC targeting LEO SATCOM, and a high‑power SiGe TXSIP delivering more than 32 dBm across the 71–86 GHz E‑band for point‑to‑point backhaul. Complementing these mmWave front‑ends, the session also features a single‑chip ORAN‑compliant 4TX‑4RX 5G radio‑unit transceiver that bridges Ethernet to RF for compact, power‑efficient base‑station deployments.

This session features four papers on high-performance Ku- and Ka-band CMOS oscillators utilizing innovative architectures—including triple-tank resonators for flicker-noise suppression, area-efficient Gm boosted cores, series-resonance tank with 3rd harmonic extraction, and quad-mode inductive switching. These designs achieve high figures-of-merit and ultra-wide tuning ranges across a frequency span of 9.9 to 30 GHz, addressing key challenges in next-generation frequency synthesis.

This session highlights circuit techniques that advance fully digital PAs and transmitters toward higher output power, broader bandwidth, and cleaner spectra. It begins with a reconfigurable multi-standard IoT digital transmitter using IQ-shared PA. Next, a 28.5 dBm all-digital Wi-Fi 7 polar transmitter employing triple-stacked class-G Doherty PA is demonstrated. The third paper presents a Wi-Fi Doherty polar transmitter that suppresses out-of-channel noise using a mixed-domain FIR technique. The session concludes with a wideband RF power DAC achieving −47.2dB EVM.

The future of computing requires innovations in connectivity and architectures that can solve complex problems. This session presents novel components that enable the next wave of high-speed connectivity solutions to meet today’s significant compute demand. Innovative wide-band circuit components driven by new technologies such as phase-change materials and high-speed NPN-PNP bipolar transistor architecture will be presented. In addition, the session showcases a high-speed galvanically isolated data link. Finally, a cryogenic controller for color centers in diamond will be introduced to enable scalable quantum computing and networking.

The Boot camp runs ½ day (4 hours) including 20-minute break. Four modules will be presented. The broad theme of the bootcamp is to educate, the high frequency (RF,MW and mm wave) engineers, the processing in the digital world where the analog RF waveforms from array antenna and electronics are available in digitized form. Popular techniques for beam shaping, beam spoiling, null steering, beam optimization, interference mitigation will be explained, targeting applications like massive MIMO, Reflective intelligent surfaces (RIS), direction of arrival estimation etc. The goal is not to delve deep into mathematics, but to provide an intuitive understanding of the techniques. Even though the algorithms are analytically sound, they often lose their efficacy due to the impairments in the electronics and antenna array. Hence treatment of all important RF impairments, how they can be captured accurately, and modeled accurately, will be discussed. The impact of RF impairments on the algorithms will be presented as well. Calibration techniques will be discussed to show recovery of the desired functionality by increasing the efficacy of the processing algorithms. The expected audience will be a mix of experienced phased array designers and engineers new to this field.

The exponential demands for higher power densities, broader frequency coverage, and enhanced reliability in microwave systems have exposed fundamental limitations in conventional thermal design approaches. As next-generation applications push beyond traditional thermal boundaries — from 5G/6G infrastructure to automotive radar and space-based communications — the industry faces a critical inflection point where incremental improvements in thermal management are essential to meet performance requirements. This workshop addresses these challenges through a comprehensive exploration of advanced thermal characterization, materials innovation, and holistic design methodologies that span from fundamental materials science to industrial-scale implementation. The program brings together leading researchers, and industry practitioners to present breakthrough approaches that are reshaping thermal management across the RF and microwave ecosystem. The technical foundation begins with the innovations in wide-bandgap materials presented by Prof. Srabanti Chowdhury of Stanford University, whose pioneering work on ultra-wide bandgap materials demonstrates how diamond integration with Beta-Gallium Oxide enables unprecedented reduction in thermal boundary resistance while maintaining RF performance. These materials advances provide the essential building blocks for next-generation thermal management solutions, particularly in high-power RF applications where conventional thermal interface materials reach fundamental limitations. Oscar D. Restrepo offers industrial thermal modeling and characterization perspectives from GlobalFoundries, where a unique combination of theoretical expertise in phonon transport and practical TCAD thermal simulation experience bridges fundamental physics with manufacturing-scale implementation. His work spans from first-principles calculations of defect formation energies to real-world thermal assessments across advanced technology nodes, including 22FDX and 12LP platforms. Building upon materials foundations, the workshop explores state-of-the-art thermal characterization techniques through both academic research and commercial implementation. Advanced thermoreflectance imaging, POSH-TDTR technology, and emerging measurement approaches demonstrate how nanosecond temporal resolution combined with submicron spatial accuracy reveals previously inaccessible thermal phenomena in operating RF devices. These characterization advances enable predictive thermal design that was previously impossible with conventional measurement techniques. Standards and validation methodologies receive dedicated attention through participation by the National Institute of Standards and Technology (NIST), which presents traceable thermal measurement techniques and validation protocols essential for industry adoption. NIST’s gate resistance thermometry methods and RF power metering standards provide the measurement foundation necessary for reliable thermal characterization across different technology platforms. The workshop culminates in a holistic design philosophy that integrates materials innovation, advanced characterization, and system-level optimization. Live demonstrations showcase how this integrated approach enables thermal-electromagnetic co-design, abandoning traditional component-level optimization in favor of system-wide performance optimization. Real-world case studies span from mm-wave antenna-in-package modules to high-power GaN amplifiers, illustrating a direct correlation between materials properties, thermal imaging data, and system performance. Interactive sessions throughout the workshop foster direct dialogue between materials researchers, device designers, and manufacturing engineers. These discussions address practical implementation challenges while exploring emerging opportunities that could reshape thermal management approaches over the next decade. The format emphasizes knowledge transfer and collaborative problem-solving rather than traditional presentation-only formats.

In recent years tremendous advances have been made in electronics and photonics device technologies for the generation, modulation, radiation, and detection of THz signals and the time is now right to exploit these advances to build and deploy THz systems. IEEE defines the THz band as frequencies ranging from 300 to 3000GHz, however, for most use cases frequencies extending from about 100GHz to 10THz is considered as the sub-THz and THz bands. The focus of this workshop is on the research and development of components and systems for THz wireless communications and sensing. In the THz band, the available bandwidth is very vast, and this feature can be leveraged for multi-Gbps wireless communications leading to terabits per second throughput in a multi-channel system. Besides communications, THz waves can be used for sensing the reflection, transmission, absorption, and scattering of materials which in turn can be exploited for detecting, imaging, and analyzing materials with high spectral resolution. Furthermore, the wavelength of THz waves is small and on the order of 30 microns to 3.0mm, which along with polarization of the signal can be exploited for precise position and orientation of objects, within a specific location. All the above features are crucial for 6G communications, self-driving vehicles, and industrial Internet-of-Things. Accordingly, the workshop includes presentations from individuals and organizations across the globe highlighting the THz components and systems that they have developed and their application to communications and sensing.

In RF device characterization, understanding and utilizing phase information is crucial for achieving accurate measurements. This workshop is designed for engineers, technicians, and researchers who seek to deepen their knowledge of phase references and their applications in vector network analyzers (VNAs) and vector signal analyzers/generators (VSAs/VSGs). The primary goal of this workshop is to emphasize the significance of phase information in RF measurements. We introduce the concept of a “signal comb” as a phase reference and a tool for enhancing measurement accuracy. Participants will gain insights into how a comb generator works and how phase references can improve the reliability of amplitude and phase measurements across various RF applications. Key Topic #1 — Understanding Phase Information: • Introduction to phase information and its relevance in RF measurements; • Discussion of the limitations of traditional amplitude measurements and the often-overlooked phase references. Key Topic #2 — The Role of Signal Comb: • Explanation of what a signal comb is and its function in RF testing; • How a signal comb acts as a “Swiss army knife” for calibration and broadband verification; • Design overview of a comb generator and its traceability. Key Topic #3 — Benefits of Phase References: • Detailed exploration of how aligning VNAs and VSAs/VSGs to a known phase reference enhances measurement accuracy; • The importance of traceable calibration for establishing transfer standards in amplitude and phase uncertainties. Key Topic #4 — Practical Applications: • Hands-on examples demonstrating the application of phase calibration in real-world scenarios; • Case studies including time domain transformation and frequency-converting circuit measurements. Key Topic #5 — Advanced Measurement Techniques: • Techniques for aligning multi-port VSAs in amplitude, phase, and time using phase references; • Over-the-air measurement of group delay in low-noise block downconverters (LNBs) and pulse response determination of amplifiers at optimized operating points. Who Should Attend — This workshop is ideal for RF engineers, measurement technicians, and researchers involved in RF device characterization and testing. Whether you are a seasoned professional or new to the field, this workshop will provide valuable insights and practical skills to enhance your measurement capabilities. Format — The workshop will feature a combination of presentations, interactive discussions, and hands-on demonstrations. Participants will have the opportunity to engage with experts in the field and collaborate with peers to solve measurement challenges. Join us for this comprehensive workshop to unlock the full potential of phase information in your RF measurements. By the end of the session, you will have a solid understanding of phase references, the utility of signal combs, and advanced measurement techniques that can save you time and improve the accuracy of your RF testing endeavors. Don’t miss this opportunity to elevate your measurement skills and ensure precision in your RF applications.

RF Bootcamp is an interactive based learning which teaches the fundamentals of RFMW theory as it applies to the elements of transmit/receive communication and radar signal chains. Sessions focus on RFMW basics, explaining real-world design, requirements, measurement techniques and applications. The intended audience includes technicians, new engineers, engineers who may be changing their career path, marketing, sales and business professionals seeking a better understanding of microwave technology, as well as current college students looking to learn more about the practical aspects of RF and Microwave technology.

The transition to all-digital RF transceivers marks a transformative shift in wireless system design, promising unprecedented levels of flexibility, scalability, and integration. This workshop brings together leading researchers and practitioners from academia and industry to explore the current state, challenges, and future directions of all-digital transceivers, covering a broad spectrum of topics from foundational architectures to application-driven innovations. All-digital transceivers replace traditional analog-intensive RF front-ends with fully digital architectures, where signal generation, modulation, transmission, and reception are primarily handled in the digital domain. This approach leverages high-speed digital-to-analog and analog-to-digital converters (DACs/ADCs), direct digital synthesis, and reconfigurable digital logic to create highly adaptable, software-defined systems that support multi-standard and multi-band operation. The workshop will begin with an overview of the architectural principles of all-digital transceivers, highlighting key building blocks, including pulsed modulators, up/down conversion architectures, filters, amplifiers and other fundamental building blocks. A comprehensive exploration of cutting-edge advances in digital and RF front-end technologies for next-generation wireless systems is presented. The first sessions focus on Delta-Sigma Modulation (DSM) for high-performance All-Digital RF Transmitters (ADTs). After revisiting key principles, advanced techniques for high-speed operation, out-of-band noise management, and hybrid DSM architectures are discussed, alongside emerging concepts such as spatial DSM for massive MIMO. Building on this, the relevance of ADTs as digital replacements for conventional RF chains is examined, highlighting their advantages in frequency agility, scalability, and integration with programmable platforms. Subsequent talks review progress in agile and scalable ADT architectures, including FPGA-based implementations and single-bit transmitters for direct antenna array driving. The benefits and trade-offs of wideband, multi-band, and multi-element operation are analyzed, providing participants with a clear perspective on the opportunities and limitations compared to analog-intensive designs. Extending the all-digital paradigm to the complete transmission–reception chain, another session introduces a Pulse-Width Modulation (PWM) approach for receivers, demonstrating how the combination of DSM-based transmitters and PWM receivers supports low-power, high-performance wireless architectures. The workshop also addresses digital transmitters for 5G and 6G, focusing on GaN-based amplifiers up to 6GHz, their role in boosting efficiency, and prospects for scaling digital architectures beyond 100GHz. This is complemented by advances in RF/microwave filter design, where new approaches achieve quasi-flat group-delay responses beyond the 3dB transmission band, thereby improving signal integrity without sacrificing selectivity. Emerging system-level concepts are also presented. A Distributed MIMO (D-MIMO) testbed based on all-digital radio-over-fiber is showcased, demonstrating practical solutions for sub-6GHz and mm-wave implementations and addressing synchronization challenges inherent to distributed architectures. Finally, the role of LEO satellite communications in the Q/V band is explored through digital beamforming and compact RF front-ends leveraging high-order Nyquist zones, enabling flexible beam generation for next-generation constellations. This workshop provides a unique platform for attendees to engage in in-depth technical discussions, exchange ideas, and foster collaborations that advance the frontier of all-digital RF systems. Together, these seven talks provide an integrated perspective on the transition to fully digital RF front-ends, offering insights into architectures, components, and system-level innovations that will shape future 5G, 6G, and non-terrestrial networks.

RF Power Amplifiers (PAs) play a critical role in modern wireless and satellite communications, radar, and electronic systems, requiring a deep understanding of both fundamental principles and cutting-edge innovations. This advanced course is designed for PhD students and professional researchers seeking to expand their expertise in RF PAs design, analysis, and optimization. Starting from solid-state power amplifiers fundamentals, the course will cover theoretical concepts, including PA classes of operation, their Figures of Merit, stability considerations and efficiency enhancement techniques. Special emphasis will be placed on advanced PA architectures, including Doherty PA, Envelope Tracking and other PA architectures, which are critical for next-generation wireless and satellite communication systems. The course will also address broadband design challenges and emerging trends in integrated PAs for large-scale phased array applications. Linearization strategies, including digital predistortion (DPD), will be discussed as essential tools to mitigate distortion and improve spectral efficiency. Several design examples based on commonly used semiconductor technologies (eg GaN, GaAs etc) will be presented to highlight the link between theory and practical implementation. Through a combination of theoretical foundations, practical case studies, and research-driven discussions, attendees will gain the expertise needed to design, model, and optimize cutting-edge RF power amplifiers. By the end of the course, participants will be well-equipped to contribute to breakthrough innovations in PA technology, bridging the gap between academic research and industrial applications.

Low-noise receivers are crucial system components for Earth observation and satellite communication. The complexity of such systems is growing, where today’s spacecraft range from large satellite missions such as MetOp-SG, to smaller systems such as the Arctic Weather Satellite, to CubeSats such as TROPICS (Time-Resolved Observations of Precipitation structure and storm Intensity with a Constellation of Smallsats). One of the most important building blocks are low-noise amplifiers. Over the years, corresponding technologies have improved substantially and provided excellent noise temperatures. Furthermore, the linearity and robustness of receivers is also an important characteristic, which adds another level of complexity. This requires new technologies, such as GaN HEMTs, with the necessity of different system architectures. This workshop gives an overview of the design of low-noise amplifiers and corresponding technologies. Furthermore, several aspects of the design and performance of receiver architectures will be discussed. Rarely discussed topics, such as in-system calibration targets or the reliability testing of critical components, will also be presented. The workshop starts with aspects of low-noise receiver systems and gives examples of several satellite missions and a background to the topic. Subsequently, best practices for the design of low-noise amplifiers and receivers are presented. An overview of recent advances in low-noise transistor technologies and the reliability testing is included as well. The remaining talks focus on different possibilities of low-noise calibration approaches for satellite systems.

This workshop surveys a materials-to-systems roadmap for reconfigurable apertures spanning sub-6GHz, FR3 (≈7–24GHz), mm-wave, and THz. Highlights include dual-polarized RFSOI-switched reflectarrays at 3–6GHz and 13–15GHz with true-time-delay or ultra-short phase shifters, achieving ±60° all-plane scanning and <1.5% EVM with 64-QAM. A 28GHz origami “eggbox” phased array merges electronic beam steering with controlled shape morphing to deliver near-360° azimuth coverage, multibeam and quasi-isotropic patterns, and additively manufactured foldable interconnects with ∼0.02dB/mm insertion loss. At higher frequencies, phase-transition and phase-change materials (VO₂, W:VO₂, GeTe) enable optically addressable, nonvolatile metasurfaces for broadband modulation, beam control, and tunable lensing in the sub-THz/THz regime, while plasmonic-nanoantenna platforms yield compact, high-SNR THz spectroscopy and imaging for sensing and security. CMOS-integrated, tile-scalable programmable metasurfaces and RIS architectures support resilient links and massive MIMO; electromagnetically consistent models and optimization frameworks extend to holographic surfaces and near-field ISAC. New multi-beam transmissive/reflective surface architectures up to 140GHz, OTA calibration and range-reduction methods for large reconfigurable arrays, and binary-coded genetic optimization of pixelated multiband antennas complete the program. Collectively, the sessions chart a path to low-loss, wide-angle, and highly programmable apertures that unify communications, sensing, and localization while remaining manufacturable, scalable, and verifiable.

Superconducting qubits have emerged as a leading platform for scalable quantum computing, offering robustness, manufacturability, and seamless integration with microwave engineering techniques. This workshop presents a comprehensive journey from the foundational principles of superconducting quantum systems to advanced microwave design strategies that enable scalable architectures. We begin by exploring the physics of Josephson junctions — the non-linear inductive elements that form artificial atoms — and their integration into quantum circuits. Participants will gain insights into the design and simulation of qubit-resonator networks, quantum amplifiers, and cryogenic microwave systems operating within dilution refrigerators at millikelvin temperatures. Key engineering challenges will be addressed, including resonance frequency tuning, qubit-resonator coupling, and quantum parameter optimization (eg anharmonicities, cross-Kerr effects). The workshop will also examine the role of quantum amplifiers in enhancing readout fidelity and the importance of scalable microwave layouts for multi-qubit systems. Using real-world examples and simulation workflows, we will demonstrate how to accelerate development cycles and improve design accuracy. Attendees will leave with a clear understanding of how microwave engineering principles intersect with quantum hardware design, paving the way for scalable quantum computing architecture.

Digital manufacturing technologies are transforming RF design, packaging, and integration, leading to new capabilities and use cases for high-frequency RF components and systems. The potential to digitally manufacture RF components, alongside new materials and integration processes, offers unprecedented opportunities for improving performance, reducing size/weight, and enhancing sustainability across the lifecycle of microwave systems. However, significant challenges remain in design, the realization of digitally-processed materials and manufacturing methods, and the seamless integration of individual components to full RF systems. This workshop aims to bring together advanced RF component design methodologies, manufacturing techniques, and practical RF/microwave applications. It will provide a comprehensive overview of new design, integration, and packaging techniques for microwave, mm-wave, and THz RF systems. Specifically, the workshop will give a detailed overview of novel materials, sustainable manufacturing methods, and scalable integration schemes that facilitate the realization of high-performing, highly-functional, and highly-miniaturized RF components. The workshop will bring forward recent advances in these fields by presenting the research of leading researchers and industry experts in the fields of RF component development, digital additive manufacturing, multi-material integration, and microwave materials engineering. Discussions will include cross-disciplinary advances involving manufacturing technologies, material development, and new design methods (ie design-for-print), opening new directions for materials-enabled innovation in wireless communication, sensing, and high-frequency electronics.

Phase-Change Material (PCM) RF switches are emerging as a breakthrough technology for reconfigurable microwave and mm-wave circuits. With their non-volatile operation, low insertion loss, and high power-handling capability, PCM switches offer distinct advantages over conventional alternatives. These properties make them ideal for use in phase shifters, impedance tuners, reconfigurable filters and switchable antenna arrays. At mm-wave frequencies, their scalability and fast response unlock new possibilities in adaptive beamforming, dynamic spectrum access, and next-generation 5G/6G wireless, satellite, and radar systems. This workshop will bring together leading experts from industry and academia worldwide to present recent advances and future directions in PCM-based RF technologies including coverage of device concepts, circuit integration, and application case studies. It aims to foster cross-disciplinary dialogue and broaden the community’s understanding of this promising technology for future mm-wave communication platforms.

Modern RF, mm-wave, and sub-THz systems stitch together multiple propagation media — microstrip, CPW/GCPW, SIW, ridge and rectangular waveguide, superconducting multilayers, and emerging flexible and additive platforms — because no single line technology satisfies bandwidth, loss, power, packaging, and cost targets simultaneously. This full-day workshop brings leading researchers and practitioners to present field-based design rules, validated topologies, and measurement workflows for high-performance transitions and interconnects across these media. Foundational talks cover the evolution of planar↔waveguide links and state-of-the-art SIW transitions (including compact, broadband launchers and thick–thin stackup integration). Practical sessions compare microstrip, GCPW, and SIW on a common process, detail ridge/ridge-gap waveguide connections, and treat transmission-line choices for high-speed/high-frequency ICs. Materials and manufacturing frontiers are addressed via MXenes for printable conductors, flexible hybrid electronics for ultra-low-cost modules, and multilayer superconducting devices for ultra-low-loss front-ends. A methodological block demonstrates AI/ML-assisted EM optimization (adjoint sensitivities, surrogates, active DOE) that reduces simulation burden while improving insertion/return loss and mode control. Throughout, speakers emphasize tolerance and variability, packaging and interposers, vertical/horizontal launches, and over-the-air and on-wafer verification. Attendees leave with implementable recipes and performance bounds that shorten development cycles and raise first-pass success for integrated communications, sensing/ISAC, and imaging hardware.

This session highlights state-of-the-art mmWave and sub‑THz transmitters and receivers, spanning a heterogeneously integrated InP–FinFET CMOS sliding‑IF transmitter, a packaged InP HBT transceiver module, emerging direct digital demodulation architectures, advanced glass/antenna-in-package integration, a D‑band receiver with injection‑locking–based quadrature correction, and a 28‑nm CMOS transceiver enabling dielectric waveguide (DWG) communication.

This session presents advanced CMOS frequency-generation circuits, including a D-band self calibrated quadrature generator, two E-band low-phase-noise LO with quadrature calibration and with harmonic extraction, and a series resonance 40 GHz VCO.

This session highlights recent advances in LEO SATCOM and FR3 transmitter front-ends and power amplifiers, covering devices, circuits, packaging, and design automation. The first paper demonstrates a high-power, high-efficiency complementary BiCMOS PA using both high-speed NPN and PNP devices. The second introduces a Ka-band 4-element beamforming transmitter front-end for LEO ground terminals with a negative-feedback-based interstage matching network. The third presents a compact, watt-level, thermally robust BiCMOS flip-chip PA module for SATCOM transmit front-ends. The final paper showcases a fast specs-to-silicon mmWave RFIC design framework using AI-assisted specs-to-layout with layout-to-silicon constraint integration.

A quiz show battle for RFIC knowledge supremacy is brewing between students and experienced professionals. Will it be the experience of the career RFIC veterans or the students who have been in the classroom more recently? Come join this fun and interactive panel to find out!

The broadband circuit performance is critical for high-data-rate communications and to cover different frequency bands. In this session, various design techniques on broadband RF amplifiers and switches are introduced. For RF amplifiers, in addition to distributed topologies, a reconfigurable architecture is adopted. As for RF switches, a distributed structure as well as power combining is illustrated. These papers demonstrate the state-of-the-art performance under broadband operations.

This session presents cutting-edge advancements in frequency conversion and filtering for wireless receivers, spanning FR3 to W-band frequencies. Featured papers introduce novel circuit architectures, including passive mixer-first diplexers, subharmonic mixers, and switched-Gm topologies, all optimized for high linearity and low noise. These works collectively push the performance boundaries of integrated front-ends for next-generation communication systems.

This technical session highlights state-of-the-art power amplifier (PA) architectures for D-band and mmWave applications in bulk CMOS and FD-SOI. Key innovations include a D-band variable-gain PA using Guanella transformers for 36% fractional bandwidth (FBW) and 20 Gb/s 16-QAM signaling, alongside ultra-compact 145 GHz PAs featuring adaptive back-gate biasing and diode-based linearization. Ultra-broadband performance is showcased through a 9.5–40 GHz linear PA utilizing compensated coupled-line transformers (126.5% FBW) and a 15.5–46.0 GHz PA with high-efficiency matching networks. Finally, a 40 GHz load-isolated Doherty PA is presented, offering enhanced VSWR resiliency and high efficiency for robust, high-speed wireless communication.

The market for integrated active electronically scanned arrays (AESA) and multiple-input multiple-output (MIMO) wireless systems is rapidly growing for ground-based and satellite telecommunications, as well as for automotive and aerospace and defense applications. Engineers, accustomed to traditional conductive characterization of RF front-ends, are increasingly confronted with over-the-air (OTA) interfaces, which makes their jobs more difficult in designing the test setups and measurement techniques while keeping measurement uncertainties small. Besides the wide use of anechoic chambers, reverberation chambers have been researched and explored for the past years to characterize different aspects of AESA / MIMO systems OTA with the focus on their active or electronic behavior, ie separate from the antenna characteristics. The goal of the workshop is to inform engineers about the state-of-the-art in reverberation measurement techniques, how they differ from those of anechoic chambers and how one may gain certain insights into the electronic behavior behind the antenna, similar to what traditional conducted measurements provided. The concepts and some exciting results will be demonstrated to make it more tangible. Attendees will learn how to make better tradeoffs related to selecting the proper characterization and test methods in every stage of AESA / MIMO product development, ie from characterizing the first design, to design validation and production.

Integrated Sensing And Communication (ISAC) applications have become a key emerging area in the next-generation wireless evolution. The role of ISAC will vary, ranging from tasks such as radar coordination, context awareness for communication to enhanced security and improving the trustworthiness/resilience of future networks. ISAC has the potential to transform current technologies by introducing context awareness, enabling breakthroughs in applications such as connected driving and next-generation mobile communications. The investigation of hardware enablers and emerging techniques considering different signal processing aspects will play an important role in the near future to realize the full potential of ISAC, leading to faster deployments. This half-day workshop will highlight these technologies and enablers featuring both applied and academic researchers working in hardware, signal processing, and system integration/demonstration aspects of ISAC targeting various applications. RF hardware design approaches that enable sharing components between both sensing and communication functions will be the key to faster deployment. The workshop talks will cover opportunistic sensing using existing communication infrastructure as well as dedicated approaches for sharing resources while achieving ISAC. Two talks will focus on antenna arrays for ISAC and one exploring special electromagnetic beams carrying orbital angular momentum. The presentations will include results from hardware supporting the feasibility of the proposed concepts.

Power Amplifiers (PAs) are key elements in every communication link, and their performance strongly impacts a system’s data throughput, power consumption, size, and reliability. With the transition from a small number of GEO satellites to large-scale constellations in LEO and MEO, driven by commercial and defence applications, there is increasing pressure to rethink PA architectures. Efficiency, bandwidth, and linearity remain central figures of merit, but the trade-offs between them acquire new dimensions in the context of satellite communications, where cost per bit, scalability, and long-term reliability are critical. This workshop will bring together perspectives from MMIC designers and system engineers to explore how solid-state PAs are evolving to meet these demands. Presentations will cover advances in GaN technology, thermal and reliability challenges, efficiency enhancement techniques, and integration. Looking ahead, the workshop will also highlight areas where new approaches could shift the current landscape: highly integrated front-end modules, thermal management, and new characterisation methods for devices at mm-wave and sub-THz frequencies. The intended outcome is to provide participants with a snapshot of current best practices and a clear view of the open challenges that will define the next steps in SATCOM PA research.

This session highlights advances in integrated RF sensing and radars. The first paper presents a 16-VRX radar using analog I/Q correlators with state-of-the-art efficiency. The next paper discusses a 2 to 20 GHz RF signal processor based on a looped phase–time array that enhances frequency resolution. The third paper presents a 405-GHz 2x2 scalable transceiver with increased frequency locking range. The fourth paper presents a radar transceiver featuring a hybrid Doppler-CW/PMCW operation to achieve unambiguous range accuracy of tens of µm. Finally, a W-band PMCW transmitter using an RWTO and edge combiner concludes the session.

The Front-Ends and LNAs are essential building blocks of modern transceivers. The session presents mm-wave novel self-synchronizing receiver array, high-efficiency FR2 transmit front-end, cryo LNA, FR3 LNA and a mm-wave LNA exploiting noise cancelling.

This session will present new design techniques for sub-THz power amplifiers to achieve high output power, wide bandwidth, and compact chip area. This session will also present a compact, high-gain sub-THz bidirectional amplifier.

Low RMS error and broadband phase shifters are essential building blocks for beamforming. This session features four broadband phase shifters spanning 8–110 GHz, 91–125 GHz, 8–28 GHz, and 24–30 GHz, all implemented in silicon (22 nm and 65 nm CMOS/FD‑SOI). Highlights include a 10-bit distributed vector‑summing PS with <0.22 dB RMS gain error and <1.99° RMS phase error, a 91–125 GHz beamforming receive channel with sub‑dB gain and sub‑few‑degree phase error, a wideband all‑passive variable gain phase shifter with calibration‑free gain control, and a compact 7‑bit passive hybrid achieving <1.1°/<0.61 dB RMS errors. Also included is a bi‑directional reflection‑amplifier phase shifter for ultra‑low‑power RIS enabling large‑scale beyond-5G deployments.

3D Heterogeneous Integration promises huge improvements to size, weight, power, and cost (SWAP-C) while maintaining or improving performance through choice of best-in-class electronics, components, and packaging. But with this increased system density comes additional physical challenges such as thermal management. Advanced electronics design and advanced packaging design need to consider the thermal generation and thermal management processes together to realize the true benefits of 3DHI. Join 3D Glass Solutions and Keysight for an investigation into the design of an advanced electronic system using thermal-aware electronic design processes to explore this complex interaction and determine the best thermal management solution

High-gain modern phased array radiation pattern measurements require narrow angular resolution to ensure accurate results and reliable null measurements. Fast and precise analysis is essential for uniform beam steering with minimal scan loss and side-lobe levels. You need to measure multiple beam and null steering settings, tapering modes and polarizations in SATCOM or NTN. We will demonstrate how to optimize radiation pattern measurements and analysis, regardless of your equipment. AI will be used for 3D pattern reconstruction. Our goal is to provide a game-changing approach to measurement and analysis, enhancing your testing workflow and quality of results.

The session features both Radars and UWB transceivers from the industry. The FMCW Radars include BIST solutions for 60-GHz MIMO radar SoCs and coded MIMO transceivers designed for 76–81 GHz, and an integrated 77-GHz radar with in-package antenna launchers for automotive applications. The session also covers UWB receivers for IEEE 802.15.4ab, narrowband-assisted architectures resilient to blockers, and innovative techniques for achieving PVT-robust signal strength estimation.

This session presents advanced frequency multiplication techniques for signal generation from 100 to 310 GHz in CMOS and SiGe technologies. The papers demonstrate phase-aligned harmonic recombination, coupled-line-based output matching, amplifier–multiplier chains, and coherent power combining to enhance efficiency, output power, bandwidth, and harmonic suppression. Reported results include up to 16 dBm output power, +26.5 dBm EIRP, and >70 dBc harmonic rejection. Together, these works illustrate scalable circuit strategies for high-purity, high-power D-band and sub-terahertz transmitters suitable for emerging communication and sensing applications.

Integrated transmit/receive front-ends are rapidly expanding in capability across radar imaging, 5G/6G MIMO, SATCOM phased arrays, and wideband beamforming. This session highlights mmWave and wideband Tx/Rx architectures that advance calibration accuracy, scalable spatial combining, and packaging-aware integration. Featured designs include a W-band FMCW radar transceiver using a self-calibrated Type-III ADPLL for 1.27-cm range-resolution imaging, a compact 28-GHz fully-connected Gm-cell-grid MIMO receiver network, a K-band multi-beam phased-array transmitter enabled by silicon-assisted beam combining in a 5-layer PCB, a 2–18-GHz 4-channel CMOS T/R beamformer and, a 256-element 28-GHz wirelessly-powered active relay transceiver with TDD-sync-free bidirectional amplifiers for robust high-capacity links.

This session provides an overview of emerging developments in terahertz and submillimeter-wave technologies. Presentations cover new research detailing technologies enabling hyperspectral imaging, sensing, and high data rate communications.

This session explores cutting-edge developments in ultra-low-power backscatter communication systems for IoT applications. The keynote addresses practical implementations of simultaneous wireless information and power transfer (SWIPT) for future IoT and space applications. Following papers present innovative backscatter architectures demonsrtating significant advances in energy efficiency while maintaining robust communication capabilities for battery-free sensor networks, passive RFID tags, and motion sensing applications.

This session covers advances in RF and digital beamforming for next-gen sensing and communications across mm-Wave and sub-THz bands. Highlights include spatial post-distortion cancellation, V-band digital-beamforming receiver, sub-THz phased-array radar with 2D steering, scalable dual-band phased-array concepts for 6G, and a wideband, low-power W-band chipset.

This session highlights the integration of Machine Learning and Digital Signal Processing to solve challenges in the RF and mm-wave domains. The presentations highlight innovations such as Spiking Neural Networks on FPGAs for high-speed modulation recognition, PointMLP architectures for sparse radar data classification, physics-informed state-space models for robust tracking in multipath environments, and multimodal IR-Radar fusion to ensure privacy-preserving event recognition.

Next-generation optical interconnects must achieve 200G/400G data rates per lane to support future intra-datacenter requirements. This session showcases high-performance optical transmitter and receiver building blocks engineered to meet these scaling demands. Presentations will cover a diverse range of cutting-edge material platforms and processes, including SiGe, CMOS, Thin-Film Lithium Niobate (TFLN), and InP, highlighting their roles in achieving the necessary power efficiency and signal integrity for the next era of data centers.

This workshop explores AI-assisted modeling techniques for RF components, enabling the creation of accurate digital twins and supporting a seamless digital thread across wireless system design. We cover advanced methods for characterizing beamformers, front-ends, and other RF devices through measurement and simulation, highlighting how AI differs from traditional IQ and VNA waveform-based modeling. System-level workflows are presented, integrating AI-driven behavioral models to predict performance across diverse conditions. Attendees will learn to validate digital twins with measurements, enhance simulation fidelity, and streamline design cycles, while assessing the advantages and limitations of AI versus conventional approaches.

By 2025, the global mobile cellular subscriber count is forecasted to surpass 6 billion, with 5G paving the way for high-data capacity and low-latency through sub-6GHz and mm-Wave spectrum. 6G networks will hinge on 7-15GHz FR3 bands, a pivotal shift in mobile connectivity. The global rise of smartphones owes much to CMOS technology advancements to smaller nodes, computational power, and digital calibrations. This workshop explores current 5G RF-FEM designs at the heart of this transformation, addressing implementation challenges and discussing 6G FR3 ones. The semiconductor roadmap envisioned for 6G FR3 will be discussed, focusing on the integration of III-V/Si technologies.

This session showcases recent innovations in RF front-end design from across the industry that enable the performance, bandwidth, and integration demands of emerging wireless standards. The talks highlight breakthroughs in low-noise amplification, switching, and frequency generation across CMOS, SiGe, and SOI technologies. Topics include N‑path receiver architectures optimized for WiFi 7 multi‑link operation, high‑gain D‑band LNAs, power‑efficient millimeter‑wave LNAs for 5G applications, broadband frequency doublers in advanced SiGe processes, and fully differential DC‑capable RF switching solutions. Together, these contributions showcase state‑of‑the‑art techniques that push the limits of noise performance, linearity, bandwidth, and integration in modern RF systems.

This session explores cutting-edge clock generation architectures achieving sub-30fs jitter and superior spur suppression.The first paper introduces an 8–28-GHz DLL with nested feedback to overcome inverter delay limits. The second paper demonstrates a 6.2-GHz sampling PLL with 18.2-fsrms jitter using bottom-plate sampling. The third paper describes a fractional-N digital PLL reaching 25.4-fs jitter via a series-resonance DCO and power-gated oscillator. The fourth paper presents a ring-oscillator clock multiplier using a reference quadrupler for enhanced noise suppression. Finally, the last paper details a 5-GHz ring-oscillator PLL employing over-sampling feedforward cancellation for a record –267.05-dB FoM.

This session showcases enabling circuit blocks for next-generation sub-THz transceivers. The talks span key front-end functions such as attenuation, low-noise amplification, frequency generation, and phase shifter, targeting wideband operation and robust performance across process, voltage, and temperature.

This session highlights the rapid evolution of integrated sensing and communication (ISAC) technologies, showcasing innovations that bridge device-level advancements and practical system implementations. The featured research covers large-scale reconfigurable RF surfaces, dynamic millimeter-wave solutions for secure and agile beam management, dual-band testbeds, real-time FPGA-accelerated ISAC for Wi-Fi, and novel fusion techniques for radar and communication. Together, these works illustrate a clear trend toward high-performance, adaptable, and real-world ISAC systems, reflecting the field’s drive for convergence, efficiency, and readiness for next-generation wireless and sensing applications.

This session spotlights emerging trends in receiver and transmitter technologies, emphasizing advances in self-interference mitigation, energy-efficient positioning, millimeter-wave agility, parametric signal processing, and high-power digital transmission. Together, these papers reflect a shift toward more integrated, adaptive, and high-performance radio-frequency solutions for next-generation wireless and sensing systems.

This session highlights recent advances in scalable mm-Wave to sub-THz phased-array transceivers and front-end architectures targeting high-data-rate communications and high-resolution sensing. The presented works span E-band, D-band, and frequencies beyond 200 GHz, demonstrating CMOS/SiGe and III-V HEMT implementations that push efficiency, output power density, bandwidth, and integration scalability. Key themes include wideband beam-steering transmitters, compact and reconfigurable T/R switching for TDD operation, die-to-die stitching approaches enabling wafer-scale phased arrays, and multi-channel beamforming.

This session explores the transformative integration of AI into the design and linearization of next-generation RF front-ends, addressing critical challenges for 6G and mmWave systems. The presentations highlight the shift from traditional analytical engineering to data-driven methodologies in developing high-efficiency, intelligent radio components.

This session opens with an invited keynote talk that sets the stage for the technical contributions that follow. The subsequent papers highlight recent advances in acoustic resonator and filter technologies targeting highly integrated and reconfigurable RF front-ends. Topics include bi-layer A3-mode acoustic resonators operating at 18 GHz with a near-zero temperature coefficient of frequency (TCF) and high electromechanical coupling, IDT-based mmWave resonators with large impedance ratios and wide frequency offsets, and miniature reconfigurable acoustic RF couplers. Further contributions address arbitrarily configurable group delay in acoustic devices and the generalized synthesis of double-ladder acoustic filters, including the demonstration of a high-performance dual-band duplexer on LTOI using a hybrid BAW-assisted wideband bandpass topology.

This session presents the latest advancements in phase-shifter and true-time-delay circuits. The research spans a diverse range of implementations, from 3D-printed structures to integrated on-chip designs in GaAs, SiGe, and CMOS technologies, including a novel approach utilizing on-chip phase-change materials (PCM). The featured works cover a broad frequency spectrum, spanning from 3 GHz up to 150 GHz.

Emerging AI workloads demand an exponential increase in XPU and switch scale-up interconnect bandwidth, alongside high-density die-to-die interfaces. This session explores novel Co-Packaged Optics (CPO) link architectures designed to meet these challenges. Presentations will highlight the use of Micro-Ring Modulators (MRM) and the enhancement of bandwidth through ultra-low-power coherent optics. Key technical deep-dives include UCIe-inspired clock-forwarding and the development of compact, power-efficient building blocks, featuring innovative Phase Interpolator (PI) designs.

In an increasingly congested spectrum landscape, companies, regulators, and policymakers are looking at new frequencies. With large chunks of untapped bandwidth, and the increasing maturity of the required technology, the sub-THz band offers significant promise for the wireless communications world. At the same time, existing services and stakeholders in the band, e.g., from the passive remote sensing and radio astronomy communities, need to be protected. Finally, international and national regulations limit emissions above 100 GHz largely based on considerations derived at lower frequency, overlooking the unique characteristics of electromagnetic wave propagation above 100 GHz, e.g., molecular absorption, and of the corresponding technology, e.g., the extreme directivity of the antennas. There is a growing need for 1) new propagation models and measurements across frequencies that capture the stakeholders’ diverse needs and ways of interacting with the spectrum; 2) new circuits, antenna designs, and interference cancellation techniques for sharing and coexistence; and 3) dialogue between the scientific and other stakeholders to understand and model Radio Frequency Interference. With this panel, we want to foster the dialogue between often siloed communities. To do so, we have invited representatives from the wireless communications, radioastronomy, and remote sensing community, including policy advocates and experts.

Recent advances in artificial intelligence (AI) and machine learning (ML) are transforming the way wireless components and complex electromagnetic (EM) systems are conceived, designed, and deployed. This session explores how ML-enabled optimization techniques are redefining applied electromagnetics, spanning the full pipeline from computational electromagnetics (CEM), uncertainty quantification (UQ), and antenna design to impactful applications such as magnetic resonance imaging (MRI), orthopaedic diagnostics, and remote sensing of snow and environmental parameters. By embedding AI and ML into EM modeling and optimization workflows, engineers can accelerate design cycles, navigate high-dimensional design spaces, and achieve performance levels that are difficult to reach with conventional approaches.
Beyond algorithms, the session emphasizes the critical role of data in driving the quality, robustness, and trustworthiness of AI-based solutions. High-fidelity simulation data, measurement-driven datasets, and hybrid physics-informed approaches are discussed as essential enablers for reliable learning and generalization. Attention is also given to the challenge of bridging ambition and deployment—moving AI-enhanced EM techniques from proof-of-concept demonstrations to deployable, validated systems operating under real-world constraints.

Join us this workshop to learn creative methods to maximize the spectrum equalization performance for Apollo MxFE™ by exploring the flexibility in its DSP architecture. The methods include a two-stage filtering using both PFILT and CFIR and leveraging CFIR sparse mode to expand effective taps from 16 to a maximum of 128. Simulation results along with a live demo of ADXBAND16EBZ - a Quad Apollo system development board will demonstrate the significant improvements in equalization performance, highlighting how Apollo’s flexible DSP architecture enables higher system-level capability across EW, Radar, ISR, and Instrumentation applications.

The evolution of wireless systems toward higher frequencies, together with the integration of joint RF sensing and communications, drives unprecedented demands on phased array performance. Next-generation architectures must deliver exceptional transmitter linearity and receiver sensitivity across multi-gigahertz bandwidths and large antenna arrays. We explore advanced measurement and behavioral modeling techniques, linking hardware prototypes with digital twins to accelerate the exploration of architectures and the development of wideband adaptive analog and digital algorithms, emphasizing the balance between modeling accuracy and computational efficiency. Demonstrations highlight design trade-offs and performance optimization strategies relevant to both 5G/6G communication links and AESA radar systems.

GaN technologies continue to attract strong interest for applications demanding high power density. This session highlights recent advances in GaN device technologies spanning recess-free, near enhancement-mode high-performance InAlGaN/GaN HEMTs; a scalable GaN-on-Si process with high power density and linearity for FR3; heterogeneous integration of GaN power amplifiers using diamond interposers; and nonlinear electro‑thermal models enabling accurate MMIC HPA prediction up to V-band.

The papers in the seesion present advanced CMOS VCO architectures achieving wide tuning ranges and state-of-the-art phase noise. Innovations include multi-tap inductors for flicker suppression, harmonic-phase tuning via transformer-based impedance control, balanced inverse-class-F operation, multiphase class-B coupling, and dual-mode series-resonance techniques, delivering high FoM across GHz frequencies with competitive power efficiency.

This session explores advanced integration technologies for power amplifiers (PAs) and low-noise amplifiers (LNAs), pushing the boundaries of performance and size across a wide range of frequencies. The session begins with a 3D-RDL integration approach for a LDMOS Doherty PA module operating in the 3.4–3.8 GHz band, demonstrating innovative packaging solutions for enhanced compactness. Next, the first GaN-on-Silicon (GaN/Si) Doherty PA operating above 7 GHz is presented, showcasing the potential of GaN/Si technology for 5G FR3 applications. The session then transitions to mmWave applications, featuring a 60 GHz LNA and PA designed and fabricated in an advanced gate-all-around (GAA) CMOS process, demonstrating the capabilities of advanced CMOS logic technologies for mmWave. Finally, the session ends with a 300 GHz PA design in a 130 nm SiGe technology, pushing the envelope of SiGe-based solutions for sub-THz applications.

This session will introduce latest advances in integrated sensing and communications (ISAC) front-end hardware and applications, including advancements in phased arrays, fading- and delay-resilient multibeam ISAC systems, digital twin modeling enabling diffraction-limited imaging and communications, direct antenna modulation systems for sub-6GHz communications and vital signs sensing, and passive RF tag detection of micro-motion using low-cost WiFi modules.

This session highlights advances in adaptive sensing and RF systems for aerospace and satellite applications. Presentations highlight recent work on reconfigurable phased arrays, SATCOM transceivers, and robust UAV detection in cluttered environments.

This session features cutting-edge breakthroughs in beamforming and antenna technologies, including pixel-based reconfigurable beamforming for fluid antennas, dynamic phased-array solutions for integrated terrestrial and satellite systems, efficient optical beam steering with holographic metasurfaces, and reconfigurable intelligent surfaces for sub-7 GHz bands. Learn how intelligent, software-controlled arrays are enabling adaptive, energy-efficient, and high-performance wireless solutions.

This session presents a variety of innovative technologies for emerging microwave and millimeter-wave systems, highlighting recent advances across millimeter-wave arrays, secure wireless transmission, power amplifier integration, and time-varying electromagnetic systems. Together, these papers illustrate novel system-level approaches that push the boundaries of high-frequency hardware, security, efficiency, and time-varying electromagnetic phenomena.

This session highlights advanced millimeter-wave oscillators, upconverters, frequency multipliers, and mixers implemented in CMOS, SiGe, and GaN technologies. The presented integrated circuits achieve broadband operation, low phase noise, high output power, and high conversion gain over frequencies spanning 30 GHz to 300 GHz.

This session presents recent advances in computational techniques, including machine-learning-enabled methods for microwave applications, with a focus on accelerating full-wave analysis and design. Contributions include rapid synthesis of training data for deep-learning surrogates, physics-informed neural operators for electromagnetic forward and inverse problems, and data-driven constitutive modeling within FDTD solvers. Novel numerical methods addressing ill-posed discrete Maxwell systems and tensor-train-accelerated FDTD with logarithmic computational cost are also featured. Together, these works highlight the integration of physics-based rigor, machine learning, and low-rank numerical techniques to enable fast, accurate, and scalable simulation and design of complex microwave systems.

This workshop explores the design of a high-performance signal chain spanning DC to 55 GHz. Attendees will examine key topics such as Digitization, Wideband up/down conversion, Tunable filtering, and Amplification. Key components will be highlighted showing unique features and process tradeoffs. Topics include architecture tradeoffs, frequency planning, high-speed data conversion, and system-level optimization for dynamic range and latency. Practical insights into design approach, calibration, and signal integrity will be shared. Ideal for RF and DSP engineers, this session equips participants with the knowledge to architect scalable signal chains for radar, 5G/6G, satellite, and instrumentation applications.

Model-based simulation enables early validation of design concepts, but accurately representing real-world imperfections can be challenging. This workshop will demonstrate how to create digital twins from hardware over-the-air measurements. Attendees will see live data gathering, model validation, and scaling to larger arrays, comparing digital twins with real hardware. Participants will learn to identify root causes of performance issues, using highly integrated mmWave beamformers with frequency conversion capable of circular polarization in compact antenna test range systems.

This session presents low-power RF designs targeting sensing and communication applications. The first paper introduces a mixer-first pulsed-LO beam-steering receiver enabling PLL-free operation with scalable power-performance trade-offs. The second paper presents a multi-source RF energy-harvesting IC with event-driven 3-D maximum power point tracking and SIMO regulation. The third paper reports a wideband active true-time-delay circuit achieving fine delay control for efficient self-interference cancellation in full-duplex systems. The final paper demonstrates a miniature LEO satellite localization tag using algorithm–hardware co-design to reduce required EIRP by 10 dB while achieving a highly compact integrated transmitter.

This session highlights recent advances in mm Wave front end building blocks spanning LNAs, PAs, robust T/R interfaces, and broadband LO generator. Building on the growing demands of broadband links and emerging applications such as satellite communications, the papers in this session emphasize robustness and reconfigurability alongside state-of-the-art performance. Topics include a blocker tolerant K-band LNA with strong Ka band TX rejection and a 12–28 GHz LNA used to demonstrate an automated schematic–layout co-optimization platform that tightens the loop between design specs and physical implementation. On the transmit side, a comparison of two SiGe complementary mm Wave PAs, as well as a frequency reconfigurable dual band T/R front end designed to maintain operation under severe load mismatch will be presented. A LO generator with oscillator-embedded artificial line is demonstrated for wideband next-generation radio.

This session presents recent advancements in device and circuits for system integration. Notable component advances include: a low loss X-Band Switched-Capacitor Delay Element and signal repeater implemented in 45nm SOI CMOS technology; a dual-mode circular cavity filter; a high-performance RF-SOI switch fabricated on 130nm 200mm technology platform that incorporates a 65nm device; and a multi-channel transceiver featuring Built-in-Self test functionality enabled by integrated directional couplers. These papers represent significant progress in the field, driving enhanced system integration with optimized performance.

The session begins with a keynote review of load-modulated balanced power amplifiers. Subsequently, amplifiers that combine load modulation with balanced performance, as well as high-efficiency outphasing PAs, will be described. The session will conclude with high-efficiency PA techniques utilizing various technologies.

This session addresses advancements in design automation, including developments in the growing fields of artificial intelligence (AI), digital twins, and deep learning for the design and optimization of circuits and systems. It presents works on system-oriented layout optimization of active circuits, continuation algorithms for nonlinear simulation, machine-learning-assisted design, and pixelated optimization and synthesis of passive structures. This session is held in honor of Vladimir G. Gelnovatch.

This session explores the latest advances in transceivers for the Internet of Things, focusing on ultra-low power consumption and architectural innovation. The session begins with a 2.4-GHz, low-latency wake-up receiver featuring a high-efficiency, VCO-based digital demodulator. The discussion then moves to extreme energy constraints, introducing a battery-less, crystal-less, event-driven UWB tag architecture that consumes less than 100 nW. A spectral- and energy-efficient tag for BPSK WiFi backscatter systems is then presented, integrating a novel sidelobe-rejection technique. The session concludes with a compact, highly efficient, BLE-compliant wireless transmitter optimized for the next generation of low-power wearable applications.

This workshop showcases the development of a phased array system for direction-of-arrival (DoA) estimation and beamforming, leveraging the Analog Devices Quad-Apollo ADXBAND16EBZ platform integrating with MATLAB. Participants will explore MATLAB-based hardware interfacing, array simulation for initial algorithm development (MUSIC and MVDR), and hardware-in-the-loop approaches to test algorithms in a controlled environment while contending with difficulties that come when working with real hardware. The workshop culminates in an over-the-air demonstration using a 16-element uniform rectangular array connected to the Quad-Apollo, highlighting array processing techniques with real signals. Attendees will gain practical insights into bridging algorithm design, simulation, and hardware implementation.

As serial link data rates push past 200 Gbps, precise characterization of high-speed interconnects becomes critical. traditional measurement approaches are increasingly limited by fixture effects, probe parasitic, and frequency-dependent losses that can mask true device performance. A glance at advanced de-embedding techniques that separate the behavior of test fixtures and measurement equipment from the device under test, enabling accurate modeling and validation at extreme bandwidths will be open for discussion. This workshop bring together researchers, system architects and test labs to address multidisciplinary engineering challenges and near-term deployment solutions for electrical and mixed electrical-optical interconnects operating beyond 200 Gbps.

This session presents recent advances in simultaneous wireless information and power transfer (SWIPT) and wirelessly powered RF systems, spanning biomedical implants and 5G/NR communications. An invited keynote introduces SWIPT fundamentals, followed by papers on inductive powering and auto-localization of CMOS brain implants, a flexible, tileable phased array enabled by CMOS beamformers, and a rectifier-type mixer enabling wirelessly powered 5G NR transceivers. Together, these contributions highlight practical, scalable architectures for flexible, distributed, and energy-autonomous RF systems.

This session explores complex integration methods to enable novel radar, imaging, and sensing systems. The topics demonstrate key subsystems and architectures including synthesizers, antennas, and transceivers that enable advanced sensing systems. In addition, presentations discuss recent advances in MIMO sensing, cognitive radar, and repeater-aided radar networks.

Increased levels of integration make antennas, modulation sources, and circuit nodes inaccessible to direct measurement. This session explores measurement techniques that use the signals that are indirectly available, including contactless and modulation-based methods.

This session presents advances in simulation approaches for wireless systems and technologies for RF sensing. The keynote discusses simulation methodologies for satellite coverage analysis, providing context for broadband wireless system design. Subsequent papers demonstrate diverse microwave sensing applications: metalens-enhanced backscatter tags, dielectric resonators for industrial process monitoring, gas sensing through permittivity-modulated antennas, and reflectionless displacement sensors. These contributions showcase the convergence of sensing and communication functionalities in compact RF systems suitable for safety-critical and industrial deployment scenarios.

As quantum computing advances toward scalable and fault-tolerant architectures, the integration of high-fidelity qubits with cryogenic microwave electronics becomes a critical enabling factor. This focus session provides a unique platform to foster collaboration among the quantum hardware, cryogenic electronics, and microwave engineering communities, accelerating the path toward practical, fault-tolerant, and large-scale quantum computing systems. It brings together experts from industry and government laboratories to present recent advances in superconducting, semiconductor spin, and ion trap qubit technologies, the associated cryogenic control and readout electronics, and quantum processor architectures. 

This session introduces advanced Doherty power amplifiers with power level >10 W over FR1 and FR3.

This session highlights key advances in novel 3D components, substrate technologies, and subsystem packaging, including multi-chip modules (MCMs) and additive manufacturing techniques such as metal and 3D printing. The papers explore heterogeneous integration and shape-changing materials, alongside technologies operating above 100 GHz. Featured works include high-efficiency PAs, pH sensors, and low-cost techniques for reconfigurable antenna elements and lenses.

This session presents the latest advancements in reconfigurable components and systems, as well as true-time-delay structures. The presented papers cover a range of topics, such as tunable filters, limiters, and delay structures. Additionally, a full-duplex antenna integrated into a substrate-integrated waveguide (SIW) using spatiotemporal modulation is presented.

Low earth orbit (LEO) communications constellations have radically changed the space communications industry. Emerging Satellite Communication (SatCom) applications like broadband internet access in remote areas, enhanced emergency response systems, and vehicle and object tracking, amongst other, are all driven by advancements in high-throughput satellites (HTS) and smaller, more affordable satellite technologies. These networks require new ecosystems that support a wide range of terminals with different cost, performance, and ruggedization requirements. This workshop provides a top-to-bottom review of the ecosystem for LEO satellite communication networks: Market trends, system requirements, applications and practical solution implementations.

This workshop explores the evolution of wireless standards from 2G to 6G, highlighting the economic impact on network operators, equipment vendors, and semiconductor providers. We examine how software-defined radios (SDRs) have adapted to each generation and the role of standard interfaces in enabling scalable, efficient development. The session concludes with a real-world example from Analog Devices, showcasing an SDR transceiver integrated with signal processing and physical layer functionality aligned with the open radio access network (O-RAN) standard.

This session provides a comprehensive view of state-of-the-art wireless power transfer subsystems, bridging device-level innovation, circuit architectures, and system-oriented functionality essential for scalable and efficient wireless energy solutions. The selected papers address key challenges in wireless power transfer hardware, including efficiency optimization, broadband operation, and ultra-wide dynamic range.

Radar sensors have found a wide variety of use cases in industrial and scientific measurement applications. This session explores how recent advances in hardware and techniques are enabling novel applications and enhanced performance for microwave and millimeter-wave radar sensors. Topics include radar systems for non-destructive testing, human sensing and tracking, and coherent multi-static imaging.

This session highlights advanced sensing, imaging, and interfacing technologies at the intersection of microwaves and biomedicine. Topics range from broadband microwave probes for electron paramagnetic resonance spectroscopy to highly sensitive SIW-based pulse sensors, and explore sub-GHz wireless power transfer links for bio-implants and wideband low-impedance receive interfaces for untuned coils. Together, these contributions showcase innovative hardware and system solutions enabling next-generation biomedical measurement and instrumentation.

This session discusses state-of-the art research in microwave/mm-wave photonics systems. The session starts with a keynote talk about reconfigurable microwave photonics systems, followed by talks on a pseudo-random microwave generator photonics chip and photonically-enabled wideband, low noise microwave/mm-wave signal generators. The session is concluded with a talk about a mm-wave radio-over-fiber co-integrated EIC/PIC transceiver.

This session presents recent advancements in compact modeling for commercial simulators, specifically targeting cryogenic and quantum applications. The papers feature a physics-based, temperature-dependent compact model for cryogenic spiral inductors, as well as an investigation into the suitability of embedded wafer-level BGA packaging for RF cryogenic use. Finally, the session introduces a reflective phase shifter optimized for these extreme environments.

This session presents state-of-the-art developments in high-efficiency power amplification, focusing on advanced GaN, GaAs, and switched-capacitor architectures for Ku-band and 6G FR3 applications. The featured papers explore sophisticated techniques for bandwidth extension and linearity enhancement, including a broadband GaN Doherty Power Amplifier (DPA) utilizing relative input phase compensation and a continuous-mode harmonic-tuning MMIC DPA achieving an 18.7% fractional bandwidth. Innovations in non-reciprocal and phase-control circuits are highlighted through a vector-sum phase shifter for analog pre-distortion in GaAs HBT and a GaN-on-Si DPA employing a differential power combiner for enhanced performance in the FR3 band. The session concludes with a digital-intensive Intra-Cell IQ Generation SCPA that leverages time-domain charge redistribution to achieve high drain efficiency, collectively demonstrating diverse semiconductor strategies to meet the stringent requirements of next-generation wireless systems.

Phase and amplitude control blocks are central to scalable phased-array beamforming, but pushing bandwidth, accuracy, bidirectionality, and integration density simultaneously remains challenging. This session highlights recent circuit innovations that deliver phase-invariant gain control, wideband vector-modulation phase shifting, and switchless bidirectional operation. The papers span ultracompact reciprocal phase-inverting architectures, broadband bidirectional amplitude–phase control for multibeam transceivers, and phase-compensated VGA designs over wide tuning ranges.

This session presents novel works related to non-planar filters and multiplexers. The papers discuss compact waveguide quadruplet filters realized with advanced topologies, diplexer designs with compact footprints based on innovative synthesis techniques, and compact metal-insert dual-band filters. Additionally, the session explores ridge-waveguide filters and diplexers designed for high-performance applications.

This panel is for academics and commercial attendees who need a deeper understanding of the opportunities for RF/UW components and solutions as part of a quantum solution and are determining when the industry will reach quantum advantage and what impact that has the RF industry. Quantum industry experts and leaders will provide insights into the state of the quantum industry, where and how RF/uW components are used and what can be expected in the future. They will also discus educational requirements for this industry and where to look for opportunities.

This panel will explore advancements in Integrated Sensing & Communications (ISAC) technologies that unify sensing with wireless connectivity across automotive and aerospace domains. Speakers will outline how tight co‑design of sensing and communication stacks can potentially enable dual use of RF hardware (Wi‑Fi, UWB, cellular, radar) to cut BOM cost, conserve spectrum, reduce power, and simplify architectural complexity for future software‑defined vehicles and aircraft. The discussion is organized around three complementary domains: (1) short‑range ISAC repurposing commodity wireless technologies (e.g., Wi‑Fi and UWB) for in‑cabin, near‑vehicle, and in‑flight sensing applications including intrusion detection, child presence / occupant vital sign monitoring, occupant localization, and classification; (2) long‑range ISAC leveraging cellular infrastructure and high‑definition maps for non‑line‑of‑sight detection of occluded road users (e.g., to mitigate crashes at intersections and highway merges), and evolution of dual‑purpose radar sensors supporting both high‑resolution perception and high‑bandwidth links to the network edge; (3) aerospace ISAC applications encompassing UAV/drone traffic management with integrated sensing and communication, aircraft collision avoidance systems combining radar sensing with air‑to‑air and air‑to‑ground data links, airport surface surveillance, and satellite‑based ISAC for simultaneous Earth observation and communication services.

As demand grows for high-frequency, high-bandwidth wireless connectivity, system designers face challenges balancing performance, power efficiency, and thermal management. This workshop explores Analog Devices’ mmWave technology evolution—from discrete RF components to integrated reference designs—highlighting solutions across generations of analog beamforming, frequency conversion, and frequency generation. Attendees will learn how ADI’s system-level innovations enable higher linear output power while maintaining strict power limits, reducing thermal complexity. Through technical discussions, design examples, and benchmarks, the session demonstrates how ADI’s scalable mmWave solutions accelerate development and meet the demands of next-generation wireless infrastructure including 5G FR2, FWA, and satellite communications.

Join our diverse team of engineers and discover how ADI’s first ever Software Defined Modem, integrated into the Nevis Narrowband Transceiver, is enabling smaller, lighter, and lower power radios than ever before while still delivering state of the art RF performance. This workshop combines theory with real-world performance data and real-time demonstrations to illustrate how users can leverage Nevis to advance the state of the art in their own radio designs. As a practical example, ADI will present how the combination of an SDR & SDM is being leveraged to create a new generation of Land Mobile Radios.

This session presents recent advances in microwave field–matter interaction for sensing, characterization, high-power applications, and quantum technologies. Topics include localized and near-field microwave excitation, resonant and metamaterial-based sensing, subwavelength electromagnetic imaging, and highly localized microwave delivery to quantum systems.

This session presents emerging radar and millimeter-wave technologies for vital sign monitoring across diverse real-world scenarios. Topics include FMCW radar systems, D-band super-regenerative sensor arrays, pulse-Doppler self-injection-locked radar, and body-worn systems. Together, these talks highlight advances in high-frequency circuits, radar architectures, and wearable platforms enabling scalable, accurate, and non-intrusive health monitoring solutions.

This session focuses on accuracy and practical limits in millimeter- and submillimeter-wave measurements. It brings together recent advances in calibration and de-embedding methodologies spanning planar structures, cable and fixture characterization, and cryogenic S-parameter measurements using room-temperature calibration strategies. The session will open with a keynote talk revisiting and extending VNA-based nonlinear mixer measurements up to millimeter frequencies.

This session presents new advancements in quantum computing and cryogenic circuits. The keynote address explores the challenges and microwave aspects of superconducting quantum processor readout. Subsequent papers feature a cryogenic FD-SOI fractional-N PLL for trapped-ion applications and high-performance cryogenic LNAs designed for both superconducting quantum computing and radio astronomy.

This session is dedicated to showing the most recent advancements in machine learning techniques for the linearization of power amplifiers under diverse dynamic scenarios, including variations in power, bandwidth, and center frequency.

This session includes a keynote talk on InP circuits for optical communication, followed by three papers discussing state-of-the-art technologies: a 270 GHz bandwidth InP wideband amplifier, a millimeter-wave (mm-Wave) VCO, and a low-jitter 5 GHz sampling PLL.

This session covers the latest developments in compact time-delay phase shifter circuits, filters, and switches based on novel approaches using phase-change materials (PCM), magnetic, and MEMS technologies. The session includes commercially viable GeTe-based PCM switches and tunable magnetic filters over a broad frequency band. At the end of the session, an RF-MEMS-based SP4T switch is also presented.

Modern technology is driving higher data rates and wider bandwidths. Communication standards such as 5G, 802.11, and satellites are driving power amplifier (PA) designers to develop amplifiers with ever-wider bandwidths. As bandwidth increases PAs memory effects become more pronounced, making accurate memory effect characterization more critical than ever. Additionally, efficiency requirements push the PAs further into non-linearity. Both topics are critical for digital predistortion (DPD) techniques. Different instrument classes are available for measuring wideband PAs. This workshop will compare data obtained from vector network analyzers (VNAs) and from vector signal generator/spectrum analyzer setups.

This workshop shed light on end-to-end process that transforms advanced electromagnetic designs into manufacturable, reliable hardware for demanding applications such as satellite payloads, radar systems, and next-generation communication networks. Beginning with rigorous electromagnetic simulation and optimization, design phase integrates thermal, mechanical, and additionally Multipactor analyses to ensure high power handling and minimal insertion loss. Speakers share unique design and engineering challenges as well as uncover recent innovations in achieving exceptionally tight tolerances, thermal stability, and design robustness across complete lifecycle of consolidated RF waveguide components—from initial electromagnetic design through precision machining, surface finishing, and final qualification.

This session focuses on millimeter-wave and sub-THz power amplifiers in InP, GaN, and CMOS technologies, covering E-band to D-band frequencies for next-generation communication, radar, and sensing applications. Featured works include advanced techniques in slot-line and 32-way power combining, loss-optimized matching networks, and a broadband distributed amplifier (DA) architecture utilizing a tapered coupled-line approach.

Spanning X-band to D-band, this session highlights wideband receiver front-end techniques. Featured papers discuss reflectionless concepts with fast AGC, transformer-assisted designs, ultra-wideband sub-THz LNAs, and high-linearity passive mixer-first receivers in RFSOI. These contributions address the critical trade-offs in noise, gain flatness, and interference robustness required for next-generation multi-gigabit sensing and communication.

This session presents passive components and circuits based on innovative integration techniques, targeting applications from the GHz to the sub-THz spectrum.

This session covers advanced integrated passive devices operating at frequencies ranging from several GHz to 300 GHz. Specifically, it highlights the development of a fully differential, ultra-compact broadband rat-race coupler using folded-inverted coupled lines in 180 nm CMOS, and an ultra-wideband, low-loss, and high-isolation Wilkinson power divider utilizing a multiple-resonant technique. Additionally, the session addresses a 220–340 GHz Marchand balun with an asymmetric ground shield in 90 nm SiGe BiCMOS, along with a miniaturized 150 GHz branch-line coupler using capacitive compensation in quartz-IPD technology.

Quantum technologies such as quantum computing are rapidly evolving from theoretical promise to technological frontier, driven in large part by innovations in microwave engineering. At the heart of many quantum platforms — especially superconducting qubits — lie microwave signals and components that enable precise control and readout of quantum states. These systems operate in extreme cryogenic environments, often at temperatures below 50 millikelvin, where conventional microwave techniques face unprecedented constraints. As quantum processors scale to accommodate hundreds or thousands of qubits, the microwave infrastructure required to support them grows exponentially. This includes a dense network of coaxial cabling, attenuators, filters, amplifiers, and interconnects, all of which must perform reliably under cryogenic conditions. The resulting demands on thermal management, spatial efficiency, and signal fidelity are formidable, and they call for a new generation of microwave design and metrology tailored to quantum applications. This workshop will explore the role of microwave technologies in enabling quantum control and readout and examine the unique challenges of cryogenic measurements for semiconductor and superconductor components. Topics will include calibration and uncertainty analysis in quantum-limited regimes, design strategies for minimizing heat load while maximizing signal integrity, and the development of emerging standards for benchmarking quantum hardware. Attendees will hear from a diverse lineup of speakers including quantum system developers, microwave instrument manufacturers, academic researchers, and national metrology institutes, who are tackling the practical challenges of building scalable quantum computers.

ICT and electronics are responsible for 2–4% of global emissions and potentially over 50% of the critical minerals consumption per capita, mostly attributed to the manufacturing of semiconductor devices. Microwave technologies underpin telecommunications and are a major energy consumer; emerging microwave technologies also have the potential to make electronics, and the world, more sustainable. This workshop will provide a holistic view of how sustainability and microwave technologies interact, across three main areas: (1) The sustainability of microwave devices and wireless networks, and more broadly electronics, with a focus on semiconductors and Life Cycle Assessments (LCAs); (2) Microwave technologies for sustainable sensing and identification, with a focus on RFID technologies and sustainable chipless solutions; (3) Microwave wireless power transfer (WPT) and its role in sustainability, from battery-less IoT to space-based “Net-Zero” energy generation. The workshop will start by introducing microwave engineers to areas ranging from RFICs/MMICs to passive technologies and systems, to quantifying sustainability. LCA will be introduced as a methodology which can be used to quantify the footprint of both specific electronic devices, with a focus on integrated circuits/chips, and of systems. LCA will then be applied to a range of technologies, including emerging mm-wave/THz links, RFID (UHF and chipless), and IoT applications. Given the central role of semiconductors, sustainable chip manufacturing and integration will be introduced, including a strong focus on industrial insights. These will be provided by opinions from activities across Europe, the US, and the UK, with a focus on industrially co-created insights. Methods for adopting “circular economy” principles and allowing RFICs and MMICs to be recycled and reused will be introduced. Frameworks for design-for-recycling will be discussed, highlighting challenges around reliability and commercialisation. The last technical aspect will explore the role of microwaves in creating a more sustainable world. Wireless Power Transfer (WPT), both terrestrial (low-power) and space-based (high-power) will be introduced as sustainable technologies for green energy. Chipless RFID and circular/low-waste RFID tags will also be discussed, as exemplars of how microwave-enabled tech could enable more supply chains. The workshop’s primary aim is to deepen the understanding of sustainability challenges across the microwave community. With the workshop speakers coming from a range of backgrounds and having active roles within the community, including 2 Editors-in-Chief (EiCs) of microwave journals, and multiple Topic Editors and Distinguished Microwave Lecturers (DMLs), we will conclude with an interactive panel discussion reflecting upon the sustainability challenges and seeking audience interaction. The panel will be primarily driven by the audience’s questions, and will be followed by a breakout and networking time to allow the attendees to connect with the speakers.

Electromagnetic fields from low frequency to sub-mm-wave (THz) are attracting much interest for biological, healthcare and agriculture precision applications. Among them is the possibility to non-invasively analyze living organisms at various scales, from individual cells to tissues and organs, for in-vitro and in-vivo investigations. With the advent of machine-learning techniques, the intrinsic variability of living organisms can be increasingly taken into account and offer new perspectives for detection and applications. This workshop will address the latest advances in microwave, mm-wave and sub-mm-wave biosensing and probing instruments suitable for molecular-scale to organ-scale investigations during in-vitro and in-vivo studies. Accurate biological sample characterization and analysis will be highlighted with resonant or broadband approaches with respect to the target applications, with main aims of early diseases’ diagnosis and prognosis. The integration of machine-learning techniques is becoming more common in biomedical investigations and enables further advances in detection accuracy and limits. Examples will be discussed, demonstrating its undoubted interest and increased use in the near future. A large space for discussion and interactions between speakers and attendees will be kept open during the day.

This workshop discusses the implementation, configuration, and operation of a comprehensive stand-alone open-source 5G end-to-end testbed to enable 5G research, development, and prototyping. The testbed provides a 5G SA FR1 and FR3 platform based on the OAI software stack and the USRP radio, for operation both over-the-air (OTA) and via coax cable. The testbed includes the all the primary system components: the core network; the basestation (gNB); and three implementations of the handset (UE). We will discuss in detail the full procedure for building this testbed, highlight several practical use-cases, and explore troubleshooting steps.

Recently, powder-bed fusion metal additive manufacturing (AM) process has matured as a breakthrough technology for the development of RF and microwave components such as waveguides, filters as well as antennas. Additive Manufacturing of RF Waveguide Components showed several advantages over the traditional/conventional machining process especially when it comes to part weight reduction and design flexibility. Critical discussions will also cover the challenges that remain. Surface roughness, material anisotropy, and process variability can degrade RF performance if not properly managed. Standards for material characterization, dimensional accuracy, and RF testing are still evolving.

This session highlights recent advances in sub-THz and THz circuits and components, spanning signal generation, frequency translation, reception, and waveguide technologies. The five papers cover a 312 GHz low-voltage push-push oscillator in GaAs pHEMT technology, a broadband CMOS frequency doubler with high fundamental suppression, and a sub-milliwatt receiver MMIC achieving low noise across a wide bandwidth. Complementing these active circuits are innovations in THz signal routing and multiplication, including metallized 3D-printed 1-THz hollow waveguide components and a 480–530 GHz balanced frequency quadrupler based on Schottky-varactor diodes integrated on a micromachined silicon membrane.

This session presents the latest developments in power amplifiers for HF, VHF, and UHF bands. The keynote paper introduces the Aurora transceiver, which integrates digital signal processing with high-efficiency amplification. This is followed by a Class-EF amplifier designed for VHF operation. The session continues with a paper utilizing digital pulse-width modulation to generate RF signals over a wide bandwidth. Finally, two papers address techniques for enhancing power amplifier robustness against variable load impedances.

This session discusses new research findings in circuit design and synthesis methods for planar filters with enhanced RF performance. Specifically, it covers novel concepts for achieving reflectionless behavior, flat group delay, and passband flatness while accounting for loss and selectivity-enhancement methodologies for acoustic filters.

Join us for the latest research in RF switching and power amplification. Explore advances in RF switch technology, including an analysis of SOI-switch substrate losses, GaN-on-silicon switch technology, and non-volatile GaN switch devices. For RF power modeling, we will investigate high-linearity design using two-tone load-pull and accurate large-signal device modeling of GaN power stages.

This inter-society technical panel will emphasize the urgent need for sustainable growth within the RF industry, particularly through the development of standards for measuring the carbon footprint of RF technologies. Today, the environmental impact of RF systems extends across the full lifecycle—from manufacturing processes and material usage to deployment, energy consumption, and long-term operation. However, the absence of consistent measurement frameworks makes it difficult to evaluate, compare, and ultimately reduce these impacts in a systematic way. The panel will bring together experts from multiple societies to explore how collective action can establish widely accepted methodologies and best practices for carbon footprint assessment in RF technologies. By working across organizational boundaries, societies can not only help define these standards but also provide strategic guidance to industry, academia, and policymakers. Such efforts are critical to ensuring that sustainability becomes a foundational consideration in future RF innovations rather than an afterthought. Ultimately, the discussion will highlight how professional societies can play a pivotal role in shaping a greener future for the RF industry—by fostering collaboration, driving standardization, and offering direction to reduce carbon emissions across both manufacturing and operational domains.

Artificial Intelligence is revolutionizing microwave circuit design, just as it is transforming other scientific and industrial domains. The growing number of published research papers demonstrates that the microwave community is actively embracing AI and ML across a wide spectrum of applications—from novel device modeling to virtual data generation, data management, and advanced EDA tools for circuit optimization. New commercial solutions for ML-assisted circuit design, already offer first-pass, fully automated layout generation, multi-objective optimization, and seamless multi-platform integration from device to system level. This evolving landscape suggests a progressive shift in researchers' focus from traditional design practices toward a complex interplay involving the development of custom, high-accuracy, dynamically reconfigurable models, advanced EDA algorithms, and ML workflows. Are we ready for this revolution? Can we truly trust AI/ML-driven design? Will AI really help to uncover entirely new device concepts and circuit topologies, or will it remain a highly capable design assistant? What tools and skills are needed to become active contributors in this new paradigm? This panel will bring together experts from foundries, model development, and EDA vendors to critically examine the pros and cons, practical implications, IP constraints and future directions of AI-assisted microwave circuit design.

This workshop focuses on leveraging phase information in RF device characterization using the Rohde & Schwarz ZN-ZCG phase reference. It is tailored for engineers, technicians, and researchers aiming to enhance measurement accuracy through advanced phase reference techniques in VNAs and VSAs/VSGs. Accurate RF measurements extend beyond amplitude: Understanding and utilizing phase information is essential. This workshop introduces the signal comb — a versatile phase reference tool — and demonstrates how it serves as a comprehensive solution for calibration and broadband verification, improving the precision of amplitude and phase measurements in diverse RF applications.

As RF systems expand into higher frequencies and wider bandwidths, preserving signal integrity and fidelity has become a universal challenge. This panel will explore how advances in interconnects, passives, and active RF components address core engineering concerns, including minimizing loss, noise, and distortion, while optimizing SWaP-C, reliability, and repeatability. By presenting perspectives across the signal chain, the discussion will highlight real-world tradeoffs, integration challenges, and emerging technologies. Attendees will gain practical guidance on selecting, integrating, and optimizing components for next-generation, mission-critical applications in aerospace, defense, and communications, including phased array systems, space systems, and advanced microwave architectures.

This session covers a wide range of high-power amplifier topics, including novel load-modulation architectures, advanced baseband manipulation for dual-band operation, and unconventional broadband designs.

This session is dedicated to showing recent advancements in linearization techniques for transmitters and receivers in MIMO applications, incorporating both analog and digital compensation.

This session presents papers covering a variety of innovative passive components. The featured works discuss Gysel power combiners, methodologies to increase power handling and multipaction thresholds for compact filters, and couplers with tunable coupling values. Additionally, the session explores resonator-based sensors and design considerations for radial power combiners.

This session highlights recent advances in field analysis and experimental characterization techniques enabling next-generation electromagnetic applications. The presented works span high-speed interconnect modeling, topological-wave phenomena for crosstalk suppression, and rigorous experimental studies of surface roughness and time-varying ferrite structures. In addition, quasi-analytical methods for blind-scan-angle estimation in surface-mounted antenna arrays are introduced. Collectively, these contributions emphasize the tight integration of analytical modeling, numerical methods, and experimental validation to address emerging challenges in high-speed, reconfigurable, and unconventional electromagnetic systems.

In the world of the most advanced and demanding RF/mmWave integrated circuits, designers look to Synopsys, Ansys (part of Synopsys) and Keysight to outfit them with the best-in-class set of AI-driven IC design and layout, circuit simulation and EM analysis software.

In this workshop and tutorial, experts from Synopsys and Keysight will walk designers through such a flow. It starts inside Synopsys’ Custom Compiler where designers will put their ideas down on the most feature-rich yet intuitive design canvas. Synopsys’ ASO.ai is unleashing the power of AI to analog and RF/mmWave IC design. Critical signal paths and devices will be extracted and modeled by Keysight RFPro EM if the Method of Moment analysis is the most appropriate, or by Ansys’ HFSS if a full 3D Finite Element Method is the most appropriate. This workshop will explain to participants how this choice can be best made.

We will then show how Synopsys’ PrimeWave can be used to assemble the design, models, and build test benches (with Keysight’s Virtual Test Benches) as well as define critical measurements to characterize the IC. A full description of this IC will be simulated in Keysight’s Nexus or GoldeGate RFIC simulators.

For designers looking to use native capabilities in Keysight’s ADS, we will also demonstrate how a design can seamlessly work in Keysight ADS seamlessly and Synopsys’ Custom Compiler.

At the conclusion of this workshop, designers will have experienced the best flow to ensure a first-time success tape out of an RF integrated circuit.

Phased array antennas (PAA) play a crucial role in satellite communications, where circular polarization (CP) and simultaneous multiple beams are employed to enhance capacity, coverage, and reliability. This workshop will focus on evaluating CP performance of PAAs operating in multibeam hybrid configurations, enabling independent polarizations for each beam, including left-hand circular polarization (LHCP), right-hand circular polarization (RHCP), horizontal or vertical polarization (H- or V-pol). We will delve into the design of a PAA with 256 elements, discuss measured performance, and provide a live demonstration of how to conduct over-the-air testing using a multi-reflector compact antenna test range.