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Tue 9 Jun | 13:30 - 15:10
Room: 252AB
Oleh Krutko
IMEC
Harshpreet Bakshi
Texas Instruments
GaN technologies continue to attract strong interest for applications demanding high power density. This session highlights recent advances in GaN device technologies spanning recess-free, near enhancement-mode high-performance InAlGaN/GaN HEMTs; a scalable GaN-on-Si process with high power density and linearity for FR3; heterogeneous integration of GaN power amplifiers using diamond interposers; and nonlinear electro-thermal models enabling accurate MMIC HPA prediction up to V-band.
13:30 - 13:50
Tu3A-1 High-Performance Near-Enhancement-Mode InAlGaN/GaN HEMTs on Silicon with High fT/fMAX of 71.5/173.1GHz for Millimeter-Wave Applications
Hsuan-Yao Huang, Po-Wei Chen, You-Chen Weng, You-Ting Lin, Fitriyadi, Jeng-Chyang Sun, Chen Zhang, Edward Yi Chang
NYCU, Infinity Communication Technology
13:50 - 14:10
Tu3A-2 GH10-10 Nonlinear Thermal Model Capability & 3W SatCom HPA
Samira Bouzid-Driad, Frederic Drillet, Christophe Chang, Manfred Madel, Kimon Vivien, Laurent Brunel, Romain Pecheux, Herve Blanck, Valeria Di Giacomo-Brunel
UMS
14:10 - 14:30
Tu3A-3 Fully Aluminum-Based 0.25µm 20V GaN-on-Si Process with 3W/mm for FR3
Hsien Shun Wu, Yuan Gao, Qingyun Xie, Yi Heng Leong, Wee Leng Ong, Lakshmi Kanta Bera, Navab Singh, Geok Ing Ng
A*STAR
14:30 - 14:50
Tu3A-4 A 4W Heterogeneous Power Amplifier with GaN-on-Si Dielets in Single-Crystal Diamond Interposer for 6G FR3 Applications
Pradyot Yadav, Xingchen Li, Danish A. Baig, Ruonan Han, Madhavan Swaminathan, Tomás Palacios
MIT, Georgia Tech, Penn State