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Tue 9 Jun | 13:30 - 15:10
252AB
GaN technologies continue to attract strong interest for applications demanding high power density. This session highlights recent advances in GaN device technologies spanning recess-free, near enhancement-mode high-performance InAlGaN/GaN HEMTs; a scalable GaN-on-Si process with high power density and linearity for FR3; heterogeneous integration of GaN power amplifiers using diamond interposers; and nonlinear electro‑thermal models enabling accurate MMIC HPA prediction up to V-band.
13:30 - 13:50
Tu3A-1 High-Performance Near-Enhancement-Mode InAlGaN/GaN HEMTs on Silicon with High fT/fMAX of 71.5/173.1 GHz for Millimeter-Wave Applications
13:50 - 14:10
Tu3A-2 GH10-10 Nonlinear Thermal Model Capability & 3W SatCom HPA
14:10 - 14:30
Tu3A-3 Fully Al-based 0.25 µm 20 V GaN-on-Si Process with 3 W/mm for FR3
14:30 - 14:50
Tu3A-4 A 4 W Heterogeneous Power Amplifier with GaN-on-Si Dielets in Single-Crystal Diamond Interposer for 6G FR3 Applications