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Thu 11 Jun | 08:00 - 09:40
156AB
This session presents passive components and circuits based on innovative integration techniques, targeting applications from the GHz to the sub-THz spectrum.
08:00 - 08:20
Th1C-1 High Density MIMCAPs in a 300mm Silicon Interposer using High-k Dielectric and 3D Oxide-studs for mm-Wave Applications
08:20 - 08:40
Th1C-2 A Wideband True Time Delay Microstrip Line Five-Port Coupler with Double Ring Star Link
08:40 - 09:00
Th1C-3 Integration of Passive D-Band Components Within the AFSIW Technological Platform for Future Systems on Substrate
09:00 - 09:20
Th1C-4 A Structurally Reused Hybrid Integrated Ridged–Air-Filled Substrate Integrated Waveguide for Large-Frequency-Ratio X–K- and E-Band Cross-Band Operation
09:20 - 09:40
Th1C-5 A Highly Isolated Dual-Band Substrate Integrated Waveguide Phase Shifter With Large Phase Tuning Range