Th1C: Innovative Integration Techniques of Waveguide Structures for GHz to Sub-THz Applications

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Thu 11 Jun | 08:00 - 09:40
Room 156AB
Jason Soric
Raytheon Technologies
Hualiang Zhang
University of Massachusetts Lowell
This session presents passive components and circuits based on innovative integration techniques, targeting applications from the GHz to the sub-THz spectrum.
08:00 - 08:20
Th1C-1 High Density MIMCAPs in a 300mm Silicon Interposer Using High-k Dielectric and 3D Oxide-Studs for mm-Wave Applications
ABSTRACT
Ilker Comart, Philip Nolmans, Shuo Kang, Rana ElKashlan, Alfredo Sanchez Ramos, Luc Pauwels, Nele Van Hoovels, Siddhartha Sinha, Xiao Sun, Andy Miller, Eric Beyne, Nadine Collaert
IMEC
08:20 - 08:40
Th1C-2 A Wideband True Time Delay Microstrip Line Five-Port Coupler with Double Ring Star Link
ABSTRACT
Ayesha Naseem, Muhammad Uzair, Shehryar Niazi, Hanxiang Zhang, Saeed Zolfaghary pour, Hao Yan, Fei Yan, Po Wei Liu, Jonathan Casamayor, Mia Reynolds, Bayaner Arigong
Florida A&M University, Florida State Univ.
08:40 - 09:00
Th1C-3 Integration of Passive D-Band Components Within the AFSIW Technological Platform for Future Systems on Substrate
ABSTRACT
Samir Lagoug, Soazig Le Bihan, Eric Kerhevé, Abdelaziz Hamani, Jose-Luis Gonzalez Jimenez, Anthony Ghiotto
IMS (UMR 5218), CEA-LETI
09:00 - 09:20
Th1C-4 A Structurally Reused Hybrid Integrated Ridged-Air-Filled Substrate Integrated Waveguide for Large-Frequency-Ratio X-K- and E-Band Cross-Band Operation
ABSTRACT
Bojie Lei, Jin Li, Tao Yuan
Shenzhen Univ.
09:20 - 09:40
Th1C-5 A Highly Isolated Dual-Band Substrate Integrated Waveguide Phase Shifter with Large Phase Tuning Range
ABSTRACT
Zhihua Wei, Yu Li, Jianjia Hu, Huaizong Shao, Pei-Ling Chi, Tao Yang
UESTC, NYCU