Mo2C: LEO SATCOM and FR3 Transmitter Front-Ends and Power Amplifiers

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Mon 8 Jun | 10:10 - 11:50
257AB
Andreia Cathelin
STMicroelectronics
Tolga Dinc
Texas Instruments
This session highlights recent advances in LEO SATCOM and FR3 transmitter front-ends and power amplifiers, covering devices, circuits, packaging, and design automation. The first paper demonstrates a high-power, high-efficiency complementary BiCMOS PA using both high-speed NPN and PNP devices. The second introduces a Ka-band 4-element beamforming transmitter front-end for LEO ground terminals with a negative-feedback-based interstage matching network. The third presents a compact, watt-level, thermally robust BiCMOS flip-chip PA module for SATCOM transmit front-ends. The final paper showcases a fast specs-to-silicon mmWave RFIC design framework using AI-assisted specs-to-layout with layout-to-silicon constraint integration.
10:10 - 10:30
Mo2C-1 A High Performance Complementary SiGe HBT Power Amplifier With A Three Conductor Coupled Line Four-Way Wilkinson Combiner Balun for Emerging K-band LEO SATCOM Transmit Front-End IC
ABSTRACT
Seungkyun Lee, Yoongoo Kang, Inchan Ju
Ajou Univ., Ajou Univ., Ajou Univ.
10:30 - 10:50
Mo2C-2 A Ka-Band CMOS 4-Element Beamforming Transmitter for LEO SATCOM using PA with Negative-Feedback-Based Interstage Matching Network and Asymmetric Wilkinson Power Divider
ABSTRACT
Wonseob Lee, Hyungju Kim, Hyeonwon Song, Mingyu Lee, Sunwoo Kong, Seunghyun Jang, Hui-Dong Lee, Bonghyuk Park, Seungchan Lee, Jinseok Park
Chonnam National Univ., Chonnam National Univ., Chonnam National Univ., Chonnam National Univ., ETRI, ETRI, ETRI, ETRI, Chonnam National Univ., Ulsan National Institute of Science and Technology (UNIST)
10:50 - 11:10
Mo2C-3 A Watt-level, Thermally Reliable Ku-band SiGe HBT Cascode Flip-Chip Power Amplifier Module Using an Optimal IC-to-Package ElectroThermal Codesign for LEO SATCOM Transmit Front-End
ABSTRACT
Seungpyo Han, Minchul Kim, Inchan Ju
Ajou Univ., MMII Laboratory, Ajou Univ.
11:10 - 11:30
Mo2C-4 Top-Metal-Only RFIC Retargeting for Fast Specs-to-Silicon Iteration Enabled by AI-Assisted Inverse Design
ABSTRACT
Chenhao Chu, Yuqi Liu, Yizhou Xu, Shouqing Fu, Takuma Torii, Shintaro Shinjo, Andreas Burg, Hua Wang
ETH Zurich, ETH Zurich, ETH Zurich, École Polytechnique Fédérale de Lausanne, Mitsubishi Electric Corp., Mitsubishi Electric Corp., École Polytechnique Fédérale de Lausanne, ETH Zurich